• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.75-81
• /
• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.4
• /
• pp.87-92
• /
• 2016

The importance of heat dissipation for the electric device modules along the thickness direction is increasing. Two types of two-layered materials, metal-metal bonding and dielectric-metal bonding, have been fabricated by roll bonding process and a thermal diffusivity of the specimens was measured along the thickness direction. The thermal diffusivity of specimens with metal-metal bonding measured by light flash analysis (LFA) showed a same value independent on the direction of heat flow. However, the thermal diffusivity of specimens with dielectric-metal bonding showed a big difference of 17.5% when the direction of heat flow changed oppositely in the LFA process. The measured thermal diffusivity of specimens when the heat flows from metal to dielectric direction showed smaller value of 17.5% compared to the value when the heat flow from dielectric to metal direction. The difference in thermal diffusivity of specimens with dielectric-metal bonding dependence on direction of heat flow is due to the electron-phonon resistance that occurred transfer process of electron energy to phonon energy near the interface.

• Korean Journal of Materials Research
• /
• v.8 no.9
• /
• pp.837-842
• /
• 1998

As the size of the integrated circuit is scaled down the importance of Si cleaning has been emphasized. One of the major concerns is abut the removal of metallic impurities such as Cu and Fe on Si surface. In this study, we intentionally contaminated Cu and Fe on the Si wafers and cleaned the wafer by cleaning splits of the chemical mixture of $\textrm{H}_2\textrm{O}_2$ and HF and the combination of HF treatment with UV/$\textrm{O}_3$ treatment. The contamination level was monitored by TXRF. Surface microroughness of the Si wafers was measured by AFM. The Si wafer surface was examined by SEM. AES analysis was carried out to analyze the chemical composition of Cu impurities. The amount of Cu impurities after intentional contamination was abut the level of $\textrm{10}^{14}$ atoms/$\textrm{cm}^2$. The amount of Cu was decreased down to the level of $\textrm{10}^{10}$ atoms/$\textrm{cm}^2$ by cleaning splits. The repeated treatment exhibited better Cu removal efficiency. The surface roughness caused by contamination and removal of Cu was improved by repeated treatment of the cleaning splits. Cu were adsorbed on Si surface not in a thin film type but in a particle type and its diameter was abut 100-400${\AA}$ and its height was 30-100${\AA}$. Cu was contaminated on Si surface by chemical adsorption. In the case of Fe the contamination level was $\textrm{10}^{13}$ atoms/$\textrm{cm}^2$ and showed similar results of above Cu cleaning. Fe was contaminated on Si surface by physical adsorption and as a particle type.

• Journal of Sensor Science and Technology
• /
• v.8 no.2
• /
• pp.115-123
• /
• 1999

A micro-gas sensor with heater and sensing electrode on the same plane was fabricated on phosphosilicate glass(PSG, 800nm)/$Si_3N_4$ (150nm) dielectric membrane. PSG film was provided by atmospheric pressure chemical vapor deposition(APCVD), and $Si_3N_4$ film by low pressure chemical vapor deposition (LPCVD). Total area of the fabricated device was $3.78{\times}3.78mm^2$. The area of diaphragm was $1.5{\times}1.5mm^2$, and that of the sensing layer was $0.24{\times}0.24mm^2$. Finite-element simulation was employed to estimate temperature distribution for a square-shaped diaphragm. The power consumption of Pt heater was about 85mW at $350^{\circ}C$. Tin thin films were deposited on the silicon substrate by thermal evaporation at room temperature and $232^{\circ}C$, and tin oxide films($SnO_2$) were prepared by thermal oxidation of the metallic tin films at $650^{\circ}C$ for 3 hours in oxygen ambient. The film analyses were carried out by SEM and XRD techniques. Effects of humidity and ambient temperature on the resistance of the sensing layer were found to be negligible. The fabricated micro-gas sensor exhibited high sensitivity to butane gas.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.38B no.9
• /
• pp.744-750
• /
• 2013

In this paper, we proposed new type of an artificial magnetic conductor(AMC) structure, which has a high impedance surface for realizing the meta-material characteristics. The designed AMC structure set a goal of 3.2GHz, and the reflector, which consists of periodically arrayed AMCs is fabricated and measured. The high impedance improves the reflection coefficient, decreases the system size and interference, and increases the antenna performance. The structure has embodied the high impedance by the thickness and relative permitivity of the dielectric substrate and the design configuration without the metallic via hole which connects the AMC to the GND. The bandwidth is 150% broader than the similar AMC structures. Also, the distance between the antenna and the AMC reflector is decreased by ${\lambda}/10$ as working as the metal(PEC) reflectors. The antenna radiation characteristics are 3dB increased at 10mm away from reflector by measurement. The proposed reflector could be inserted in the portable mobile devices, and the antenna's performance has improved by the reflector. The specific absorption rate is dramatically decreased over 94% because the back radiation of the antenna is shielded.

• Korean Journal of Mineralogy and Petrology
• /
• v.35 no.3
• /
• pp.333-344
• /
• 2022

The quarrying and utilization of natural building stones such as granite and marble are rapidly emerging in developing countries. A huge amount of wastes is being generated during the processing, cutting and sizing of these stones to make them useable. These wastes are disposed of in the open environment and the toxic nature of these wastes negatively affects the environment and human health. The growth trend in the world stone industry was confirmed in output for 2019, increasing more than one percent and reaching a new peak of some 155 million tons, excluding quarry discards. Per-capita stone use rose to 268 square meters per thousand persons (m²/1,000 inh), from 266 the previous year and 177 in 2001. However, we have to take into consideration that the world's gross quarrying production was about 316 million tons (100%) in 2019; about 53% of that amount, however, is regarded as quarrying waste. With regards to the stone processing stage, we have noticed that the world production has reached 91.15 million tons (29%), and consequently this means that 63.35 million tons of stone-processing scraps is produced. Therefore, we can say that, on a global level, if the quantity of material extracted in the quarry is 100%, the total percentage of waste is about 71%. This raises a substantial problem from the environmental, economical and social point of view. There are essentially three ways of dealing with inorganic waste, namely, reuse, recycling, or disposal in landfills. Reuse and recycling are the preferred waste management methods that consider environmental sustainability and the opportunity to generate important economic returns. Although there are many possible applications for stone waste, they can be summarized into three main general applications, namely, fillers for binders, ceramic formulations, and environmental applications. The use of residual sludge for substrate production seems to be highly promising: the substrate can be used for quarry rehabilitation and in the rehabilitation of industrial sites. This new product (artificial soil) could be included in the list of the materials to use in addition to topsoil for civil works, railway embankments roundabouts and stone sludge wastes could be used for the neutralization of acidic soil to increase the yield. Stone waste is also possible to find several examples of studies for the recovery of mineral residues, including the extraction of metallic elements, and mineral components, the production of construction raw materials, power generation, building materials, and gas and water treatment.