• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.192-196
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. The nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. In nano-injection molding process, since the solidified layer, generated during the polymer filling, deteriorates transcribability of nano patterns by preventing the polymer melt from filling the nano cavities, an injection-mold system was constructed to actively control the stamper surface temperature using MEMS heater and sensors. The replicated polymeric patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth. The replicated polymeric patterns can be applied to high density patterned media.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1258-1260
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• 1997

The metallic interconnector has a superior property than the ceramic interconnector in the point of the cell performance, but has problems to form oxide films on the interconnector surface during cell operation and induce cracking in the cell due to the stress by the thermal expansion coefficient difference with stabilized Zr electrolyte. For solving the problems in the metallic interconnector, new and modified materials have been investigated. In this paper, $LaCrO_3$ dispersed Cr was evaluated in high temperature oxidized characteristics, sintering density, electrical conductivity and various thermochemical properties. The test results show that $LaCrO_3$ dispersed Cr has more superior properties than that of conventional alloy interconnector and $LaCrO_3$ dispersed Cr can be used as an interconnector in SOFC.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1142-1143
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• 2006

Kinik Company pioneered diamond pad conditioners protected by DLC barrier ($DiaShield^{(R)}$ Coating) back in 1999 (Sung & Lin, US Patent 6,368,198). Kink also evaluated Cermet Composite Coating (CCC or $C^3$, patent pending) with a composition that grades from a metallic (e.g. stainless steel) interlayer to a ceramic (e.g. $Al_2O_3$ or SiC) exterior. The metallic interlayer can form metallurgical bond with metallic matrix on the diamond pad conditioner. The ceramic exterior is both wear and corrosion resistant. The gradational design of $C^3$ coating will assure its strong adherence to the substrate because there is no weak boundary between coating and substrate.

• ETRI Journal
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• v.28 no.2
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• pp.216-218
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• 2006

This letter presents the design for a low-profile planar inverted-F antenna (PIFA) that can be stuck to metallic objects to create a passive radio frequency identification (RFID) tag in the UHF band. The designed PIFA, which uses a dielectric substrate for the antenna, consists of a U-slot patch for size reduction, several shorting pins, and a coplanar waveguide feeding structure to easily integrate with an RFID chip. The impedance bandwidth and maximum gain of the tag antenna are about 0.3% at 914 MHz for a voltage standing wave ratio (VSWR) of less than 2 and 3.6 dBi, respectively. The maximum read range is about 4.5 m as long as the tag antenna is on a metallic object.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.130-133
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• 2005

Efficient finite element method has been introduced for metallic sandwich plates subject to 3-point bending. A full model 3-point bending FE-analysis shows that plastic behavior of inner structures appears only at the load point. So, Unit structures of sandwich plates are defined to numerically calculate the bending stiffness with recurrent boundary condition of pure bending. And then equivalent models with same bending stiffness and strength of full models are designed analytically. It is demonstrated that results of both models are almost same and FE analysis method with equivalent models can reduce analysis time effectively.

• Pediatric Gastroenterology, Hepatology & Nutrition
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• v.25 no.1
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• pp.87-91
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• 2022

Ingestion of foreign bodies (FBs) is a common phenomenon among young children. Plain radiography is the first step diagnostic modality to detect the radio-opaque FBs. And computed tomography has been recommended by several guidelines as useful modalities for diagnosing ingested FBs. However, there is a risk of radiation exposure, making it burdensome to use in asymptomatic patients. Ultrasound (US) is not a commonly used technique for diagnosing ingested foreign bodies. However, US can provide real-time imaging with good resolutions without radiation exposure in pediatric patients. Herein, we report two pediatric cases of metallic foreign body ingestion that were successfully diagnosed using US for localizing foreign bodies. This study indicates that US may be used as an alternative method for detecting the localization of metallic foreign bodies in the gastrointestinal tract without exposure of radiation, particularly in pediatric patients.

• Nuclear Engineering and Technology
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• v.53 no.3
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• pp.932-941
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• 2021

This paper suggests a fracture simulation method for SFR metallic fuel pin under accident condition. Two major failure mechanisms - creep damage and eutectic penetration - are implemented in the suggested method. To simulate damaged element, stress-reduction concept to reduce stiffness of the damaged element is applied. Using the proposed method, the failure size of cladding can be predicted in addition to the failure time and failure site. To verify the suggested method, Whole-pin furnace (WPF) test and TREAT-M test conducted at Argonne National Laboratory (ANL) are simulated. In all cases, predicted results and experimental results are overall in good agreement. Based on the simulation result, the effect of eutectic-penetration depth representing failure behavior on failure size is studied.

• Journal of Sensor Science and Technology
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• v.32 no.4
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• pp.252-256
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• 2023

A one-step method for nanoscale patterning of silver ionic ink on a substrate is developed using a microscale, elastic mold deformation. This method yields unique micro/nanoscale metallic structures that differ from those produced using the original molds. The linewidth of these metallic structures is significantly reduced (approximately 10 times) through the sidewall deformation of the original mold cavity on a thin liquid film, as verified by finite element analysis. The process facilitates the fabrication of various, isolated and complex micro/nanoscale metallic structures with negligible residual layers at low cost and high throughput. These structures can be utilized for various applications, including optoelectronics, wearable sensors, and metaverse-related devices. Our approach offers a promising tool for manipulation and fabrication of micro/nanoscale structures of various functional materials.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.93-96
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• 2003

Recently, various bulk metallic glasses (BMG's) haying good mechanical and chemical properties were developed. BMG's can easily be deformed in the supercooled liquid region, via viscous flow mechanism. In our previous work, we evaluated the deformation behavior and some other basic properties of Z $r_{41.2}$ $Ti_{13.8}$C $u_{12.5}$N $i_{10}$B $e_{22.5}$ alloy. In this study, we investigated the micro forming of Z $r_{41.2}$ $Ti_{13.8}$C $u_{12.5}$N $i_{10}$B $e_{22.5}$ alloy. The process condition was chosen based on the viscosity data from TMA, and superalloy and Si wafer with micro patterns on the surface were used as forming die. The alloy showed good replication of the patterns. However, some stripe patterns, resembling scratches, appeared on the deformed alloy surface. These scratches can be reduced or eliminated by polishing before forming.ing.ore forming.ing.

• Transactions of Materials Processing
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• v.14 no.8 s.80
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• pp.718-724
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• 2005

An efficient finite element method has been introduced for analysis of metallic sandwich plates subject to bending moment. A full model 3-point bending FE-analysis shows that the plastic behavior of inner structures appears only at the load point. The unit structures of sandwich plates are defined to numerically calculate the bending stiffness and strength utilizing the recurrent boundary condition for pure bending analysis. The equivalent models with the same bending stiffness and strength of full models are then designed analytically. It is demonstrated that the results of both models are almost the same and the FE-analysis method incorporating the equivalent models can reduce the computation time effectively. The dominant collapse modes are face buckling and face yielding. Since the inner dimpled structures prevent face buckling, sandwich plates with inner dimpled shell structure can absorb more energy than other types of sandwich plates during the bending behavior.