• Title/Summary/Keyword: Metal-to-metal contact

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A Bonding Surface Behavior of Bi-metal Bar through Hydrostatic Extrusion (이중복합봉 정수압 압출시 접합면 거동에 관한 연구)

  • Park, Hun-Jae;Na, Gyeong-Hwan;Jo, Nam-Seon;Lee, Yong-Sin
    • Transactions of Materials Processing
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    • v.7 no.1
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    • pp.66-71
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    • 1998
  • The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

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A Study on the Fracture Behavior of Quartz Glass(II) (석영 유리의 파괴 거동에 관한 연구(II))

  • Choi, Seong-Dae;Cheong, Seon-Hwan;Kwon, Hyun-Kyu;Jeong, Young-Kwan;Hong, Yong-Bae
    • Journal of the Korean Society of Industry Convergence
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    • v.10 no.4
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    • pp.213-219
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    • 2007
  • Glass-to-metal contact should be prevented in the design of any structural glass component. Because glass is extremely brittle and will fracture readily if even a small point load is applied. If the assembly includes a glass component supported by metallic structure, designers should provide a pliable interface of some kind between the two parts. But there happens high demand of glass-to metal contact in semiconductor industries due to adoption of dry cleaning process as one of the good solution to reduce running cost - carry out equipments cleaning with high corrosive and etching gas such as CF4 with keeping process temperature as the same as high service temperature. Therefore the quartz glass have to be received compression by direct contact with metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process during the process. In this paper investigation will be carried out on fracture behavior of quartz glass contacted with metal directly under local load and fatigue given by process vibration with apparatus which can give $lox{\backslash}cal$ load and vibration through PZT ceramics to give guideline to prevent unintended fracture of quartz glass.

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A Study on the Plasma Treatment Effect of Metal Fibersusing Micromechanical Technique (미세역학적 실험법에 의한 금속섬유의 플라즈마 처리효과에 관한 연구)

  • MiYeon Kwon;Seung Goo Lee
    • Journal of Adhesion and Interface
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    • v.23 no.4
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    • pp.122-129
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    • 2022
  • In this study, the hydrophilicity of the metal fiber is improved by introducing an oxygen-containing functional group to the fiber surface after treatment of the metal fiber using the oxygen plasma treatment time as an experimental variable. For the surface modification of metal fibers, changes in surface properties before and after plasma treatment were observed using SEM and x-ray photoelectron spectroscopy (XPS). In order to observe the effect of the plasma treatment time on the surface of the metal fiber, the change in contact angle of the metal fiber with respect to a polar solvent and a non-polar solvent was measured. After calculating the change in surface free energy using the measured contact angle, the contact angle and the surface free energy for metal fibers before and after oxygen plasma treatment were compared, and the correlation with the adhesion work was also considered. The microdroplet specimens were prepared to investigate the effect of surface changes of these metal fibers on the improvement of shear strength at the interface when combined with other materials and the interfacial shear strength was measured, and the correlation with the adhesion work was also identified. Therefore, the oxygen plasma treatment of the metal fiber results in an increase in the physical surface area on the fiber surface and a change in contact angle and surface energy according to the introduction of the oxygen-containing functional group on the surface. This surface hydrophilization resulted in improving the interfacial shear strength with the polymer resin.

Implementation of Wireless ECG Measurement System Attaching in Chair for Ubiquitous Health Care Environment (유비쿼터스 헬스 케어 적용을 위한 의자 부착형 무선 심전도 측정 시스템 구현)

  • Ye, Soo-Young;Baik, Seong-Wan;Kim, Jee-Chul;Jeon, Gye-Rok
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.8
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    • pp.776-781
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    • 2008
  • In this study, ubiquitous health care system attaching in chair to monitor ECG for health care was developed at the unconsciousness state. The system conveniently and simple measured ECG at non-consciousness. We measured the contact impedance to skin-electrode of metal mesh electrodes of the system. Contact impedance enable the electrode to use for ECG measurement. The results are that the impedance of the metal mesh electrodes according to sizes is low when the size is 4$cm^2$. As the result, when the size of the metal mesh electrode is 4$cm^2$, the electrode is fit for ECG measurement. We can acquired by positing the arm on the metal mesh electrode. The ECG signal was detected using a high-input-impedance bio-amplifier, and then passed filter circuitry. The measured signal transmitted to a PC through the bluetooth wireless communication and monitored. Data of the non-constrained ECG system attaching in chair is noise-data when comparing metal mesh electrode with the Ag/Agcl electrode but the data is significant to monitor ECG for check the body state.

Study of contact resistance using the transmission line method (TLM) pattern for metal of electrode (Cr/Ag & Ni) (TLM pattern을 사용한 Cr/Ag 및 Ni 전극에 따른 접합 저항 연구)

  • Hwang, Min-Young;Koo, Ki-Mo;Koo, Sun-Woo;Oh, Gyu-Jin;Koo, Sang-Mo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.349-349
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    • 2010
  • Great performance of many semiconductor devices requirs the use of low-resistance ohmic contact. Typically, transmission line method (TLM) patterns are used to measure the specific contact resistance between silicon and metal. In this works, we investigate contact resistance for metal dependent (Cr/Ag, Ni) using TLM pattern based on silicon-on-insulator (SOI) wafer. The electrode with Ni linearly increases contact resistance as the pattern distance increase from $15{\mu}m$ to $75{\mu}m$ in accumulation part, but non-linearly increase in inversion part. In additional, the electrode with Cr/Ag linearly increases contact resistance as the pattern distance increase from $15{\mu}m$ to $75{\mu}m$ in inversion part, but non-linearly increase in accumulation part.

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Investigation of the Ni/Cu metal grid space for high-effiency, low cost crystlline silicon solar cells (고효율, 저가화 태양전지에 적합한 Ni/Cu 금속 전극 간격에 따른 특성 평가)

  • Kim, Min-Jeong;Lee, Ji-Hun;Cho, Kyeng-Yeon;Lee, Soo-Hong
    • 한국태양에너지학회:학술대회논문집
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    • 2009.04a
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    • pp.225-229
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    • 2009
  • The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

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Seat Tightness of Flexible Metal Seal of Butterfly Valve at Cryogenic Temperatures (초저온 버터플라이 밸브용 탄성 메탈실의 누설방지에 관한 연구)

  • Ahn, Jun-Tae;Lee, Kyung-Chul;Lee, Yong-Bum;Han, Seung-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.6
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    • pp.643-649
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    • 2011
  • For the development of butterfly valves used in liquefied natural gas (LNG) vessels, the seat tightness is one of the important factors to be taken into account in the valve-design process. An O-ring-type metal seal with a retaining ring showing good seat tightness at cryogenic temperatures has been widely used, despite the high manufacturing costs involved. As an alternative, a flexible solid metal seal offers not only sufficient tightness of the butterfly valve, meeting specification requirements, but also relatively low manufacturing costs. In this study, a design criterion to ensure the seat tightness of the butterfly valve using the flexible solid metal seal is proposed. The contact pressure can be calculated by the simulation of the frictional contact behavior between the surface of the metal seal and the valve disc. The geometry of the flexible solid metal seal is determined so that it satisfies the design criterion for sufficient seat tightness, and is verified by experiments according to BS6755 and BS6364.

Formation of Ohmic Contacts on acceptor ion implanted 4H-SiC (이온 이온주입한 p-type 4H-SiC에의 오믹 접촉 형성)

  • Bahng, W.;Song, G.H.;Kim, H.W.;Seo, K.S.;Kim, S.C.;Kim, N.K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.290-293
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    • 2003
  • Ohmic contact characteristics of Al ion implanted n-type SiC wafer were investigated. Al ions implanted with high dose to obtain the final concentration of $5{\times}10^{19}/cm^3$, then annealed at high temperature. Firstly, B ion ion implanted p-well region were formed which is needed for fabrication of SiC devices such as DIMOSFET and un diode. Secondly, Al implanted high dose region for ohmic contact were formed. After ion implantation, the samples were annealed at high temperature up to $1600^{\circ}C\;and\;1700^{\circ}C$ for 30 min in order to activate the implanted ions electrically. Both the inear TLM and circular TLM method were used for characterization. Ni/Ti metal layer was used for contact metal which is widely used in fabrication of ohmic contacts for n-type SiC. The metal layer was deposited by using RF sputtering and rapid thermal annealed at $950^{\circ}C$ for 90sec. Good ohmic contact characteristics could be obtained regardless of measuring methods. The measured specific contact resistivity for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$ were $1.8{\times}10^{-3}{\Omega}cm^2$, $5.6{\times}10^{-5}{\Omega}cm^2$, respectively. Using the same metal and same process of the ohmic contacts in n-type SiC, it is found possible to make a good ohmic contacts to p-type SiC. It is very helpful for fabricating a integrated SiC devices. In addition, we obtained that the ratio of the electrically activated ions to the implanted Al ions were 10% and 60% for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$, respectively.

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Thermal Contact Resistance Measurement of Metal Interface at Cryogenic Temperature (극저온에서 금속표면의 열 접촉 저항 측정)

  • Kim, Myung Su;Choi, Yeon Suk
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.26 no.1
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    • pp.32-37
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    • 2014
  • The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

Analysis of Metal Forming Process Using Meshfree Method (무요소법에 의한 금속성형공정의 해석)

  • Han, Kyu-Taek
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1569-1572
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    • 2003
  • Meshfree approximations exhibit significant potential to solve partial differential equations. Meshfree methods have been successfully applied to various problems which the traditional finite element methods have difficulties to handle, including the quasi-static and dynamic fracture. large deformation problems, contact problems, and strain localization problems. A meshfree method based on the reproducing kernel particle approximation(RKPM) is applied to sheet metal forming analysis in this research. Metal forming examples, such as stretch forming and flanging operation, are analyzed to demonstrate the performance of the proposed meshfree method for largely deformed elasto-plastic material.

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