• Transactions on Electrical and Electronic Materials
• /
• 제16권3호
• /
• pp.156-161
• /
• 2015

In this paper, we present simulation results obtained using SILVACO TCAD tools for a 3-D silicon on insulator (SOI) n-FinFET structure with a gate length of 8 nm at 300K. The effects of variations of the device’s key electrical parameters, such as threshold voltage, subthreshold slope, transconductance, drain induced barrier lowering, oncurrent, leakage current and on/off current ratio are presented and analyzed. We will also describe some simulation results related to the influence of the gate work function variations on the considered structure. These variations have a direct impact on the electrical device characteristics. The results show that the threshold voltage decreases when we reduce the gate metal work function Φ_m. As a consequence, the behavior of the leakage current improves with increased Φ_m. Therefore, the short channel effects in real 3-D FinFET structures can reasonably be controlled and improved by proper adjustment of the gate metal work function.

• Applied Science and Convergence Technology
• /
• 제27권5호
• /
• pp.90-94
• /
• 2018

The electron band structure of manganese-adsorbed graphene on an SiC(0001) substrate has been studied using angle-resolved photoemission spectroscopy. Upon introducing manganese atoms, the conduction band of graphene, that is observed in pristine graphene indicating intrinsic electron-doping by the substrate, completely disappears and the valence band maximum is observed at 0.4 eV below Fermi energy. At the same time, the slope of the valence band decreases by the presence of manganese atoms, approaching the electron band structure calculated using the local density approximation method. The former provides experimental evidence of the formation of nearly free-standing graphene on an SiC substrate, concomitant with a metal-to-insulator transition. The latter suggests that its electronic correlations are efficiently screened, suggesting that the dielectric property of the substrate is modified by manganese atoms and indicating that electronic correlations in grpahene can also be tuned by foreign atoms. These results pave the way for promising device application using graphene that is semiconducting and charge neutral.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
• /
• pp.204-206
• /
• 1993

In this paper we represented electroplating process without seed layers for making metal micro structures needed for applying terminal voltage for one-to-one cell fusion system. In this system, we need thick insulator and metal structures because the diameter of a cell is approximately $40{\mu}m$. So, we adopted the photo-sensitive polyimide as electroplating molds and structural material. Generally, the processes utilizing the photo-sensitive polyimide as molds have metal seed layers on the substrate as electroplating electrodes and requires wiring tasks to these seed layers. We proposed electroplating process without any seed layer on the Si-substrate and simulated P-N-P (electrode - Si substrate - electrode) junction on N-type silicon substrate. Leakage current from one metal structure to another which arise when terminal voltage is applied can be remarkably decreased by doping Boron in the region to be electroplated.

• 센서학회지
• /
• 제4권3호
• /
• pp.80-88
• /
• 1995

본 논문에서는 Al 및 TiW 금속을 상하층 전극으로 사용하고 이들 금속사이에 절연물이 존재하는 금속-절연물-금속(metal-insulator- metal : MIM) 구조의 안티휴즈 소자를 만들고 금속층간 절연물의 성질에 따른 안티휴즈 특성에 대하여 연구하였다. 금속층간 절연물로는 R.F 스퍼터링법에의해 형성된 실리콘 산화막과 탄탈륨 산화막으로 구성된 이층 절연물을 사용하였다. 이러한 안티휴즈 구조에서 실리콘 산화막은 프로그램 전의 안티휴즈 소자를 통해 흐르는 누설전류를 감소시켰으며, 실리콘 산화막에 비해 절연 강도가 낮은 탄탈륨 산화막은 안티휴즈 소자의 절연파괴전압을 저 전압으로 낮추는 역할을 하였다. 최종적으로 제조된 $Al/Ta_{2}O_{5}(10nm)/SiO_{2}(10nm)/TiW$ 구조에서 1 nA 이하의 누설전류와 약 9V의 프로그래밍 전압을 갖고 수 초내에 프로그램이 완성되는 전기적 특성이 안정된 안티휴즈 소자를 제조하였다. 그리고 이때 소자의 OFF 및 ON 저항은 각각 $3.65M{\Omega}$ 및 $7.26{\Omega}$이었다. 이와 같은 $Ta_{2}O_{5}/SiO_{2}$ 구조에서 각 절연물의 두께를 조절함으로써 측정 전압에 민감하고 재현성 있는 안티휴즈 소자를 제조할 수 있었다.

• 한국전기전자재료학회논문지
• /
• 제17권3호
• /
• pp.283-288
• /
• 2004

We have fabricated MIM capacitors for MMIC applications, with capacitances as high as 600pF/$\textrm{mm}^2$ and excellent electrical properties of the insulator layer. Silicon nitride thin film is the desirable material for MMIC capacitor fabrication. Standard MIM capacitance in MMIC is 300pF/$\textrm{mm}^2$ with an insulator layer thickness of more than 2000$\AA$. However, capacitors with thin insulator layers have breakdown voltages as low as 20V. We have deposited insulator layers by PECVD in our MIM structure with an air bridge between the top metal and the contact pad. The PECVD process was optimized for fabricating the desired capacitors to be used in MMIC. Silicon nitride(Si$_{x}$N$_{y}$) thin films of about 1000$\AA$ thick show capacitances of about 600pF/$\textrm{mm}^2$, and breakdown voltages above 70V at 100nA.A.A.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 하계학술대회 논문집
• /
• pp.80-80
• /
• 2009

Recently, multiferroics have attracted much attention due to their numorous potentials. In this work, we attemped to utilize the multiferroics as an alternative material for ferroelectrics. Ferroelectric materials have been stadied to ferroelectric random access memories, however, some inevitable problems prevent it from inplementation. multiferroics shows a ferroelectricity and has low process temperature $BiFeO_3$(BFO) films have good ferroelectric properties but poor leakage characterization. Thus we tried, in this work, to adopt $HfO_2$ insulating layer for metal-ferroelectric-insulator-semiconductor(MFMIS) structure to surpress to leakage current. $BiFeO_3$(BFO) thin films were fabricared by using a sol-gel method on $HfO_2/Si$ structure. Ferroelectric BFO films on a p-type Si(100)wafer with a $HfO_2$ buffer layer have been fabricated to form a metal-ferroelectric-insulator-semiconductor (MFIS) structure. The $HfO_2$ insulator were deposited by using a sol-gel method. Then, they were carried out a rapid thermal annealing(RTA) furnace at $750\;^{\circ}C$ for 10 min in $N_2$. BFO films on the $HfO_2/Si$ structures were deposited by sol-gel method and they were crystallized rapid thermal annealing in $N_2$ atomsphere at $550\;^{\circ}C$ for 5 min. They were characterized by atomic force microscopy(AFM) and Capacitance-voltage(C-V) curve.

• 전자공학회논문지
• /
• 제50권9호
• /
• pp.12-20
• /
• 2013

본 논문에서는 주파수 재구성 기능이 가능한 방사 구조 갖는 co-planar waveguide (CPW) 급전 방식의 영차 공진 안테나를 제작하고 측정하였다. 제안된 안테나의 단위 셀은 직렬 metal-insulator-metal (MIM) 형태의 커패시터와 두개의 단락된 병렬 스터브 인덕터로 구성되어 있다. 제안된 안테나는 두 개의 단위 셀을 갖는 composite right/left-handed (CRLH) 전송 선로에 근거하여 설계되었으며 선로의 끝단을 개방하여 선로의 병렬부에서 주된 전자파 에너지 방사가 이루어지도록 하였다. 안테나의 크기를 소형화시키는 동시에 다이오드 스위치 부착을 통하여 주파수 재구성 안테나를 구현하기 위하여 비아를 통하여 접지 면과 연결되어지는 4개의 $90^0$ 접혀진 단락 스터브 선로를 병렬 인덕터 구조로 사용하였다. 제안된 안테나의 영차 공진주파수는 3.09 GHz이고 전체 크기는 $0.22{\lambda}_0{\times}0.16{\lambda}_0$이다. 제작된 안테나의 측정 결과 영차 공진 주파수 2.97 GHz에서 안테나의 최대 이득과 임피던스 대역폭은 각각 3.1 dBi와 56MHz를 나타내었으며, 삼중 대역에서 동작하는 주파수 재구성 안테나시스템에 응용이 가능하다.

• 한국전기전자재료학회논문지
• /
• 제29권5호
• /
• pp.268-273
• /
• 2016

In this study, we observed current-voltage characteristics of the MIM (metal-insulator-metal) structure. The $WO_x$ material was used between metal electrodes as the oxide insulator. The structure of the $Al/WO_x/TiN$ shows bipolar resistive switching and the operating direction of the resistive switching is clockwise, which means set at negative voltage and reset at positive voltage. The set process from HRS (high resistance state) to LRS (low resistance state) occurred at -2.6V. The reset process from LRS to HRS occurred at 2.78V. The on/off current ratio was about 10 and resistive switching was performed for 5 cycles in the endurance characteristics. With consecutive switching cycles, the stable $V_{set}$ and $V_{reset}$ were observed. The electrical transport mechanism of the device was based on the migration of oxygen ions and the current-voltage curve is following (Ohm's Law ${\rightarrow}$ Trap-Controlled Space Charge Limited Current ${\rightarrow}$ Ohm's Law) process in the positive voltage region.

• 한국재료학회지
• /
• 제15권2호
• /
• pp.139-142
• /
• 2005

[ $ZrO_2$ ] gate dielectric thin films were deposited by radio frequency (rf)-magnetron sputtering and its structure, surface morphology and electrical peoperties were studied. As the oxygen flow rate increases, the surface becomes smoother. The experimental results indicate that a high temperature annealing is desirable since it improves the electrical properties of the $ZrO_2$ gate dielectric thin films by decreasing the number of interfacial traps at the $ZrO_2/Si$ interface. The carrier transport mechanism is dominated by the thermionic emission.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2000년도 하계학술대회 논문집 C
• /
• pp.1708-1710
• /
• 2000

The synthesis and characterization of polymers for organic Metal/Insulator/Metal(MIM) devices were investigated from LB films. The physicochemical properties of the LB films were examined by UV absorption spectrum and AFM. The AFM images showed for network structure of polyurethane monolayer that the film formed an unsymmetry mesh with intermolecular interaction within the large scale. The stable images are probably due to a strong interaction between the monolayer film and Si substrate. We are unable to obtain molecular resolution in images of the films but did see a marked contrast between images of the bare substrate and those with the network structure film deposited onto it.