• Title/Summary/Keyword: Metal wire

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Arc Fault Circuit Interrupter Design using Microprocessor (마이크로프로세서를 이용한 아크결함 차단기 설계)

  • Yoon, Kwang-Ho;Ban, Gi-Jong;Lee, Hyo-Jik;Park, Byung-Suk;Nam, Moon-Hyon
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.44 no.1
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    • pp.12-18
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    • 2007
  • As an arc fault interrupter, the AFCI mentioned in this paper has been designed to detect and interrupt arc faults due to wire deterioration, insulation, wire damage, loose connection, and excessive mechanical damage. Since AFCI is digital and uses mechanical and electric stress, the length of interruption against overload and over-current is much shorter than the current bi-metal method. Therefore, the risk of electrical fires has been reduced.

Comparison of the frictional characteristics of aesthetic orthodontic brackets measured using a modified in vitro technique

  • Arici, Nursel;Akdeniz, Berat Serdar;Arici, Selim
    • The korean journal of orthodontics
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    • v.45 no.1
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    • pp.29-37
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    • 2015
  • Objective: The coefficients of friction (COFs) of aesthetic ceramic and stainless steel brackets used in conjunction with stainless steel archwires were investigated using a modified linear tribometer and special computer software, and the effects of the bracket slot size (0.018 inches [in] or 0.022 in) and materials (ceramic or metal) on the COF were determined. Methods: Four types of ceramic (one with a stainless steel slot) and one conventional stainless steel bracket were tested with two types of archwire sizes: a $0.017{\times}0.025$-in wire in the 0.018-in slots and a $0.019{\times}0.025$-in wire in the 0.022-in slot brackets. For pairwise comparisons between the 0.018-in and 0.022-in slot sizes in the same bracket, an independent sample t-test was used. One-way and two-way analysis of variance (ANOVA) and Tukey's post-hoc test at the 95% confidence level (${\alpha}$ = 0.05) were also used for statistical analyses. Results: There were significant differences between the 0.022-in and 0.018-in slot sizes for the same brand of bracket. ANOVA also showed that both slot size and bracket slot material had significant effects on COF values (p < 0.001). The ceramic bracket with a 0.022-in stainless steel slot showed the lowest mean COF (${\mu}$ = 0.18), followed by the conventional stainless steel bracket with a 0.022-in slot (${\mu}$ = 0.21). The monocrystalline alumina ceramic bracket with a 0.018-in slot had the highest COF (${\mu}$ = 0.85). Conclusions: Brackets with stainless steel slots exhibit lower COFs than ceramic slot brackets. All brackets show lower COFs as the slot size increases.

Low Temperature Pyrolysis for the Recovery of Value-added Resources from Waste Wire (II) (폐전선으로부터 유가자원 회수를 위한 저온열분해(II))

  • Han, Seong-Kuk;Kim, Jae-Yong
    • Applied Chemistry for Engineering
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    • v.20 no.5
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    • pp.553-556
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    • 2009
  • This research aims at the recovery of valuable resource and more efficient waste treatment through solving the problem of pyrolysis technique. At first, in order to raise the economical efficiency, the low temperature pyrolysis experiment was carried out at the temperature of $450^{\circ}C$, which is lower than the common pyrolysis temperature area ($500{\sim}1000^{\circ}C$). We could lower the reaction temperature and reduce the reaction time by using catalyst. Also we used indirect heat for the purpose of maintaining favorable anoxic condition. As a result, we could raise the recovery rate of the valuable copper and synthetic fuel oil. Furthermore, the by-products and flue gas could be treated more effectively as well. The flue gas passed through two stage neutralization tank, so that dioxin hardly occurs and other environment items are controlled fairly well to the environmental standard. Throughout this study, we produced the low temperature pyrolysis equipment (GTPK-001) as mentioned above, and we found out that the technique can be commercialized economically as well as environmentally friendly.

Development of a Redundant Shoulder Complex Actuated by Metal Wire Tendons (텐던 구동 기반 여유자유도를 가지는 로봇의 어깨 메커니즘 구현)

  • Choi, Taeyong;Kim, Doohyung;Do, Hyunmin;Park, Chanhun;Park, Dongil
    • Journal of Institute of Control, Robotics and Systems
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    • v.22 no.10
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    • pp.853-858
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    • 2016
  • Cooperation and collaboration with robots are key functions of robotic utility that are currently developing. Thus, robots should be safe and resemble human beings to cope with these needs. In particular, dual-arm robots that mimic human kinetics are becoming the focus of recent industrial robotics research. Their size is similar to the size of a human adult; however, they lack natural, human-like motion. One of the critical reasons for this is the shoulder complex. Most recent dual-arm robots have only 2 degrees of freedoms (DOFs), which significantly limits the workspace and mobility of the shoulders and arms. Therefore, a redundant shoulder complex could be very important in new developments that enable new capabilities. However, constructing a kinematically redundant shoulder complex is difficult because of spatial constraints. Therefore, we propose a novel, redundant shoulder complex for a human-like robot that is driven by flexible wire tendons. This kinematically redundant shoulder complex allows human-like robots to move more naturally because of redundant DOFs. To control the proposed shoulder complex, a hybrid control scheme is used. The positioning precision has also been considered, and the ability of the shoulder complex to perform several human-like motions has been verified.

Simultaneous Removal of Cadmium and Copper from a Binary Solution by Cathodic Deposition Using a Spiral-Wound Woven Wire Meshes Packed Bed Rotating Cylinder Electrode

  • Al-Saady, Fouad A.A.;Abbar, Ali H.
    • Journal of Electrochemical Science and Technology
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    • v.12 no.1
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    • pp.58-66
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    • 2021
  • Spiral-wound woven wire meshes packed bed rotating cylinder electrode was used for the simultaneous removal of cadmium (Cd) and copper (Cu) from a binary solution. The effects of weight percent of each metal on the removal and current efficiencies were studied at an operating current of 345A, while the effect of current on the removal efficiency of both metals was investigated at three levels of current (240, 345.and 400 mA). The experiments were carried out at constant rotation speed 800 rpm, pH = 3, and a total concentration of metals (500 ppm). The results showed that the removal efficiency of copper increased from 89% to 99.4% as its weight percent increased from 20% to100%. In a similar fashion, the removal efficiency of cadmium increased from 81% to 97% as its weight percent increased from 20% to100%. The results confirmed that the removal efficiency of any metals declined in the presence of the other. Increasing of current resulted in increasing the removal efficiency of both metals at different weight percents. The results confirmed that current efficiencies for removing of copper and cadmium simultaneously decline with increasing of electrolysis time and weight percent of cadmium or with decreasing the weight percent of copper. Current efficiency was higher at the initial stage of electrolysis for all weight percents of metals. The results showed that the decay of copper concentration was exponential at all weight percents of copper, confirming that the electrodeposition of copper is under mass transfer control in the presence of cadmium. While the decay of cadmium concentration was linear at lower weight percent of cadmium then changed to an exponential behavior at high weight percent of cadmium in the presence of copper.

A Hermenutic Study of Material Language in Contemporary Metal-craft - Centerd on June Schwarcz′s Color works - (현대금속공예에 있어서 물질언어의 해석학적 분석연구 -June Schwarcz′s 색채 구조물을 중심으로 -)

  • 임옥수
    • Archives of design research
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    • v.14 no.3
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    • pp.197-210
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    • 2001
  • There are symbolicity and special meaning in the materials which are supposed to be used metalcraft from ancient to present. These are basical resources of hermeneutics and play a role as moaning elements. Generally, the precious Cold and Silver are mainly to be used with precious stone. But recently, ordinary materials like glass iron aluminum has begun to be used with them. Several artists are intentionally using them, and special skills which could be revealed by only the matherials are developing by them. In these skill, there are original material's texture and character of matter are looking like other matter. Well, special skills are adapted in these matters to magnify the possibility of expression, the originally codified meaning resources are disturbed. For example, The metal craft artist June Schwarcz is using the skills of electroforming, copper foiling, enameling, wire brush patina, fine wires fusing, etc. He is doing abstract forming and making various textures. And his works are very big size, and done by the skills of painting and sculpture. The outer form is very structural, special touches of the artists are heterogeneously mixed with the symbolic abstract expressionism color field. Further, there are mixed with Primitive original life atmosphere, Medieval ornamental aspect, Minimal, and Chaotic aspects. The meaning particles of these aspects are directly/indirectly joined but special skills and basic material languages are mixed together, the originally codified material language are disturbed. These disturbed material languages are becoming optically special effect and be illusion. It is making expressing way of tile metalcraft more fertile and be infinite.

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Simulation Study of a Large Area CMOS Image Sensor for X-ray DR Detector with Separate ROICs (센서-회로 분리형 엑스선 DR 검출기를 위한 대면적 CMOS 영상센서 모사 연구)

  • Kim, Myung Soo;Kim, Hyoungtak;Kang, Dong-uk;Yoo, Hyun Jun;Cho, Minsik;Lee, Dae Hee;Bae, Jun Hyung;Kim, Jongyul;Kim, Hyunduk;Cho, Gyuseong
    • Journal of Radiation Industry
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    • v.6 no.1
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    • pp.31-40
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    • 2012
  • There are two methods to fabricate the readout electronic to a large-area CMOS image sensor (LACIS). One is to design and manufacture the sensor part and signal processing electronics in a single chip and the other is to integrate both parts with bump bonding or wire bonding after manufacturing both parts separately. The latter method has an advantage of the high yield because the optimized and specialized fabrication process can be chosen in designing and manufacturing each part. In this paper, LACIS chip, that is optimized design for the latter method of fabrication, is presented. The LACIS chip consists of a 3-TR pixel photodiode array, row driver (or called as a gate driver) circuit, and bonding pads to the external readout ICs. Among 4 types of the photodiode structure available in a standard CMOS process, $N_{photo}/P_{epi}$ type photodiode showed the highest quantum efficiency in the simulation study, though it requires one additional mask to control the doping concentration of $N_{photo}$ layer. The optimized channel widths and lengths of 3 pixel transistors are also determined by simulation. The select transistor is not significantly affected by channel length and width. But source follower transistor is strongly influenced by length and width. In row driver, to reduce signal time delay by high capacitance at output node, three stage inverter drivers are used. And channel width of the inverter driver increases gradually in each step. The sensor has very long metal wire that is about 170 mm. The repeater consisted of inverters is applied proper amount of pixel rows. It can help to reduce the long metal-line delay.

The Frictional Resistance Of Tin Ion-Plated Co-Cr Orthodontic Wire (TiN 피막처리된 Co-Cr계 교정용 선재의 마찰저항력)

  • Lee, Ho-Kyu;Kwon, Oh-Won;Kim, Kyo-Han
    • The korean journal of orthodontics
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    • v.28 no.1 s.66
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    • pp.123-133
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    • 1998
  • The effectiveness of TiN ion-plating was examined with TiN ion-plated Co-Cr wires(.016“, .016”x.022“) on three different types of bracket(TiN ion-plated metal bracket ceramic bracket and plastic bracket). Maximum static frictional forces and characteristic curves obtained from the frictional characteristic graph, were compared and surface roughness of wires and bracket slots before and after friction experiment was observed by SEM. The obtained results were as follows $\cdot$The frictional forces of TiN ion-plated wires were significantly lower than those of non ion-plated wires(p<0.05). $\cdot$On the effect of wire shape, the frictional forces of round wires were significantly lower than those of rectangular wires(p<0.05) $\cdot$As the result of the SEM observation on the wires and bracket slots after the friction experiment the surface of non ion-plated wires was rougher than that of TiN ion-plated ones. $\cdot$The difference between the static frictional forces and the kinetic frictional forces was not significant in case of the TiN ion-plated round ins, but the static frictional forces were a little higher than the kinetic frictional forces in the TiN ion-plated rectangular wires. $\cdot$The static frictional forces were much higher than the kinetic frictional forces in the case of non ion-plated wires.

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Numerical simulation of three-dimensional flow and heat transfer characteristics of liquid lead-bismuth

  • He, Shaopeng;Wang, Mingjun;Zhang, Jing;Tian, Wenxi;Qiu, Suizheng;Su, G.H.
    • Nuclear Engineering and Technology
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    • v.53 no.6
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    • pp.1834-1845
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    • 2021
  • Liquid lead-bismuth cooled fast reactor is one of the most promising reactor types among the fourth-generation nuclear energy systems. The flow and heat transfer characteristics of lead-bismuth eutectic (LBE) are completely different from ordinary fluids due to its special thermal properties, causing that the traditional Reynolds analogy is no longer recommended and appropriate. More accurate turbulence flow and heat transfer model for the liquid metal lead-bismuth should be developed and applied in CFD simulation. In this paper, a specific CFD solver for simulating the flow and heat transfer of liquid lead-bismuth based on the k - 𝜀 - k𝜃 - 𝜀𝜃 model was developed based on the open source platform OpenFOAM. Then the advantage of proposed model was demonstrated and validated against a set of experimental data. Finally, the simulation of LBE turbulent flow and heat transfer in a 7-pin wire-wrapped rod bundle with the k - 𝜀 - k𝜃 - 𝜀𝜃 model was carried out. The influence of wire on the flow and heat transfer characteristics and the three-dimensional distribution of key thermal hydraulic parameters such as temperature, cross-flow velocity and Nusselt number were studied and presented. Compared with the traditional SED model with a constant Prt = 1.5 or 2.0, the k - 𝜀 - k𝜃 - 𝜀𝜃 model is more accurate on predicting the turbulence flow and heat transfer of liquid lead-bismuth. The average relative error of the k - 𝜀 - k𝜃 - 𝜀𝜃 model is reduced by 11.1% at most under the simulation conditions in this paper. This work is meaningful for the thermal hydraulic analysis and structure design of fuel assembly in the liquid lead-bismuth cooled fast reactor.

Thermal Stress Induced Spalling of Metal Pad on Silicon Interposer (열응력에 의한 실리콘 인터포저 위 금속 패드의 박락 현상)

  • Kim, Junmo;Kim, Boyeon;Jung, Cheong-Ha;Kim, Gu-sung;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.3
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    • pp.25-29
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    • 2022
  • Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.