• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.221-221
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• 2013

Striving to replace the well known silicon nanocrystals embedded in oxides with solution-processable charge-trapping materials has been debated because of large scale and cost effective demands. Herein, a silicon quantum dot-polystyrene nanocomposite (SiQD-PS NC) was synthesized by postfunctionalization of hydrogen-terminated silicon quantum dots (H-SiQDs) with styrene using a thermally induced surface-initiated polymerization approach. The NC contains two miscible components: PS and SiQD@PS, which respectively are polystyrene and polystyrene chains-capped SiQDs. Spin-coated films of the nanocomposite on various substrate were thermally annealed at different temperatures and subsequently used to construct metal-insulator-semiconductor (MIS) devices and thin film field effect transistors (TFTs) having a structure p-$S^{++}$/$SiO_2$/NC/pentacene/Au source-drain. C-V curves obtained from the MIS devices exhibit a well-defined counterclockwise hysteresis with negative fat band shifts, which was stable over a wide range of curing temperature ($50{\sim}250^{\circ}C$. The positive charge trapping capability of the NC originates from the spherical potential well structure of the SiQD@PS component while the strong chemical bonding between SiQDs and polystyrene chains accounts for the thermal stability of the charge trapping property. The transfer curve of the transistor was controllably shifted to the negative direction by chaining applied gate voltage. Thereby, this newly synthesized and solution processable SiQD-PS nanocomposite is applicable as charge trapping materials for TFT based memory devices.

• Journal of Electrical Engineering and information Science
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• 제3권2호
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• pp.239-244
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• 1998

Piezoelectric pressure sensors and pyroelectric infrared detectors based on ZnO thin film have been integrated with GaAs metal-semiconductor field effect transistor (MESFET) amplifiers. Surface micromachining techniques have been applied in a GaAs MESFET process to form both microsensors and electronic circuits. The on-chip integration of microsensors such as pressure sensors and infrared detectors with GaAs integrated circuits is attractive because of the higher operating temperature up to 200 oC for GaAs devices compared to 125 oC for silicon devices and radiation hardness for infrared imaging applications. The microsensors incorporate a 1${\mu}$m-thick sputtered ZnO capacitor supported by a 2${\mu}$m-thick aluminum membrane formed on a semi-insulating GaAs substrate. The piezoelectric pressure sensor of an area 80${\times}$80 ${\mu}$m2 designed for use as a miniature microphone exhibits 2.99${\mu}$V/${\mu}$ bar sensitivity at 400Hz. The voltage responsivity and the detectivity of a single infrared detector of an area 80${\times}$80 $\mu\textrm{m}$2 is 700 V/W and 6${\times}$108cm$.$ Hz/W at 10Hz respectively, and the time constant of the sensor with the amplifying circuit is 53 ms. Circuits using 4${\mu}$m-gate GaAs MESFETs are fabricated in planar, direct ion-implanted process. The measured transconductance of a 4${\mu}$m-gate GaAs MESFET is 25.6 mS/mm and 12.4 mS/mm at 27 oC and 200oC, respectively. A differential amplifier whose voltage gain in 33.7 dB using 4${\mu}$m gate GaAs MESFETs is fabricated for high selectivity to the physical variable being sensed.

• 한국재료학회지
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• 제15권2호
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• pp.134-138
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• 2005

This study was performed to investigate the surface properties of electrochemically oxidized pure niobium by anodic oxide and hydrothermal treatment technique. Niobium specimens of $10mm\times10mm\times1.0mm$ in dimension were polished sequentially from $\#600,\;\#800,\;\#1000$ emery paper. The surface of pure niobium sperimens was anodized in an electrolytic solution that was dissolved calcium and phosphate in water. The electrolytic voltage was set in the range of 250 V and the current density was $10mA/cm^2$. The specimen was hydrothermal treated in high-pressure steam at $300^{\circ}C$ for 2 hours using an autoclave. And all specimens were immersed in the in the Hanks' solution nth pH 7.4 at $37^{\circ}C$ for 30 days. The surface of specimen was characterized by surface roughness, scanning electron microscope(SEM), energy dispersion X-ray analysis(EDX), X-ray photoemission spectroscopy(XPS) test. The value of surface roughness was the highest in the anodized sample and $0.41{\pm}0.04\;{\mu}m$. The results of the SEM observation show that oxide layers of the multi porosity in the anodized sample were piled up on another, and hydroxyapatite crystal was precipitate from the surface of the hydrothermal treated sample. In the XPS analysis, O, Nb, C peak and small amounts of N peak were found in the polished specimens while Ca and P peak in addition to O, Nb, C and peak were observed in the hydrothermal treated sample.

• Carbon letters
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• 제12권4호
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• pp.207-217
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• 2011

We discuss the influence of few-walled carbon nanotubes (FWCNTs) treated with nitric acid and/or sulfuric acid on field emission characteristics. FWCNTs/tetraethyl orthosilicate (TEOS) thin film field emitters were fabricated by a spray method using FWCNTs/TEOS sol one-component solution onto indium tin oxide (ITO) glass. After thermal curing, they were found tightly adhered to the ITO glass, and after an activation process by a taping method, numerous FWCNTs were aligned preferentially in the vertical direction. Pristine FWCNT/TEOS-based field emitters revealed higher current density, lower turn-on field, and a higher field enhancement factor than the oxidized FWCNTs-based field emitters. However, the unstable dispersion of pristine FWCNT in TEOS/N,N-dimethylformamide solution was not applicable to the field emitter fabrication using a spray method. Although the field emitter of nitric acid-treated FWCNT showed slightly lower field emission characteristics, this could be improved by the introduction of metal nanoparticles or resistive layer coating. Thus, we can conclude that our spray method using nitric acid-treated FWCNT could be useful for fabricating a field emitter and offers several advantages compared to previously reported techniques such as chemical vapor deposition and screen printing.

• 한국세라믹학회지
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• 제48권1호
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• pp.94-98
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• 2011

A Sn-doped $In_2O_3$ (ITO) nanowire photoelectrode was produced using a simple metal evaporation method at low synthesis temperature (< $540^{\circ}C$). The nanowire electrodes have large surface area compared with that of flat ITO thin film, and show low electrical resistivity of $5.6{\times}10^{-3}{\Omega}cm$ at room temperature. In order to apply ITO nanowires to the photoelectrodes of dye-sensitized solar cell (DSSC), those surfaces were modified by $TiO_2$ nanoparticles using a chemical bath deposition (CBD) method. The conversion efficiency of the fabricated $TiO_2$/ITO nanostructure-based DSSC was obtained at 1.4%, which was increased value by a factor of 6 than one without ITO nanowires photoelectrode. This result is attributed to the large surface area and superior electrical property of the ITO nanowires photoelectrode, as well as the structural advantages, including short diffusion length of photo-induced electrons, of the fabricated $TiO_2$/ITO nanostructure-based DSSC.

• 대한전자공학회논문지SD
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• 제45권7호
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• pp.1-8
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• 2008

본 논문에서는 플라스틱 기판에 OTFT를 스위칭 소자로 사용하여 유연한 EPD 패널을 제작하였다. OTFT의 채널 폭과 길이의 비(W/L)는 EPD의 응답속도를 고려하여 15이상으로 설계를 하였다. 게이트전극은 Al, 절연층은 cross-linked PVP, 반도체층은 펜타센, 중간층은 PVA/Acryl를 사용하였다. 플라스틱 기판은 보호층 처리를 통하여 열처리 공정 시 발생하는 입자를 제거하였고, 거친 표면을 평탄화하였다. 반도체층의 크기는 게이트 전극 보다 작도록 제한하여 누설전류를 줄일 수 있었다. EPD-상판과 OTFT-하판 사이에 픽셀전극을 삽입하고 또한 OTFT-하판을 보호하기 위하여 PVA/Acryl로 구성된 중간층을 상빙하였다. 완성된 OTFT-하판에서 OTFT의 이동도는 $0.21cm^2/V.s$, 전류점멸비(Ion/Ioff)는 $10^5$ 이상의 성능을 보였다.

• 한국진공학회지
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• 제6권3호
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• pp.227-234
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• 1997

ITO, AZO, SZO 투명전도박막의 수소 플라즈마에 대한 안정성에 관하여 연구하였 다. ITO는 Corning 사의 제품을 사용하였고, AZO와 SZO는 rf magnetron sputtering 방법 으로 증착한 것을 이용하였다. 이 세가지 투명전도박막을 PECVD 챔버 내에 장착한 다음, 수소 플라즈마에 노출시켰다. 이 때 ITO 박막의 광투과도는 시편 표면의 온도와 시간이 증 가할수록 감소하였는데 특히 $300^{\circ}C$에서 30분간 노출시켰을 때 10~20%정도의 광투과도를 나타내었으며, 박막의 전도성을 완전히 잃어 버렸다. 반면 AZO와 SZO의 경우, 수소 플라즈 마 노출 온도와 시간에 대해 전반적으로 광투과도 손실이 나타나지 않았다. 하지만 박막내 수소의 유입으로 인하여 흡수대가 단파장 쪽으로 이동하는 'Burstein-Moss'효과가 나타났 다. 또한 표면구조에서도 AZO와 SZO가 수소 플라즈마 노출에 대해 안정성을 보인 반면 ITO의 표면은 indium과 tin의 금속입자로의 환원으로 인해 매우 거칠어짐을 보였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.66-66
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• 1999

최근 들어 다결정 SiGe은 MOS(Metal-Oxide-Semiconductor)에서 기존에 사용되던 다결정 Si 공정과의 호환성 및 여러 장점으로 인하여 다결정 Si 대안으로 많은 연구가 진행되고 있다. 고농도로 도핑된 P type의 다결정 SiGe은 Ge의 함량에 따른 일함수의 조절과 낮은 비저항으로 submicrometer CMOS 공정에서 게이트 전극으로 이용하려는 연구가 진행되고 있으며, 55$0^{\circ}C$ 이하의 낮은 온도에서도 증착이 가능하고, 도펀트의 활성화도가 높아서 TFT(Thin Film Transistor)에서도 유용한 재료로 검토되고 있다. 현재까지 다결정 SiGe의 증착은 MBE, APCVD, RECVD. HV/LPCVD 등 다양한 방법으로 이루어지고 있다. 이중 HV/LPCVD 방법을 이용한 증착은 반도체 공정에서 게이트 전극, 유전체, 금속화 공정 등 다양한 공정에서 사용되고 있는 방법으로 현재 사용되고 있는 반도체 공정과의 호환성의 장점으로 다결정 SiGe 게이트 전극의 증착 공정에 적합하다고 할 수 있다. 본 연구에서는 HV/LPCVD 방법을 이용하여 게이트 전극으로의 활용을 위한 다결정 SiGe의 증착 메카니즘을 분석하고 Ex-situ implantation 후 열처리에 따라 나타나는 활성화 정도를 분석하였다. 도펀트를 첨가하지 않은 다결정 SiGe을 주성엔지니어링의 EUREKA 2000 장비를 이용하여, 1000$\AA$의 열산화막이 덮혀있는 8 in 웨이퍼에 증착하였다. 증착 온도는 55$0^{\circ}C$에서 6$25^{\circ}C$까지 변화를 주었으며, 증착압력은 1mtorr-4mtorr로 유지하였다. 낮은 증착압력으로 인한 증착속도의 감소를 방지하기 위하여 Si source로서 Si2H6를 사용하였으며, Ge의 Source는 수소로 희석된 10% GeH4와 100% GeH4를 사용하였다. 증착된 다결정 SiGe의 Ge 함량은 RBS, XPS로 분석하였으며, 증착된 박막의 두께는 Nanospec과 SEM으로 관찰하였다. 또한 Ge 함량 변화에 따른 morphology 관찰과 변화 관찰을 위하여 AFM, SEM, XRD를 이용하였으며, 이온주입후 열처리 온도에 따른 활성화 정도의 관찰을 위하여 4-point probe와 Hall measurement를 이용하였다. 증착된 다결정 SiGe의 두게를 nanospec과 SEM으로 분석한 결과 Gem이 함량이 적을 때는 높은 온도에서의 증착이 더 빠른 증착속도를 나타내었지만, Ge의 함량이 30% 되었을 때는 온도에 관계없이 일정한 것으로 나타났다. XRD 분석을 한 결과 Peak의 위치가 순수한 Si과 순수한 Ge 사이에 존재하는 것으로 나타났으며, ge 함량이 많아짐에 따라 순수한 Ge쪽으로 옮겨가는 경향을 보였다. SEM, ASFM으로 증착한 다결정 SiGe의 morphology 관찰결과 Ge 함량이 높은 박막의 입계가 다결정 Si의 입계에 비해 훨씬 큰 것으로 나타났으며 근 값도 증가하는 것으로 나타났다.

• 한국전기전자재료학회논문지
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• 제29권7호
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• pp.394-399
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• 2016

The silicon dioxide ($SiO_2$) was deposited using various gas as oxygen and nitrous oxide ($N_2O$) in nowadays. In order to improve electrical characteristics and the interface state density ($D_{it}$) in low temperature, It was deposited with carbon dioxide ($CO_2$) and silane ($SiH_4$) gas by inductively coupled plasma chemical vapor deposition (ICP-CVD). Each $D_{it}$ of $SiO_2$ using $CO_2$ and $N_2O$ gas was $1.30{\times}10^{10}cm^{-2}{\cdot}eV^{-1}$ and $3.31{\times}10^{10}cm^{-2}{\cdot}eV^{-1}$. It showed $SiO_2$ using $CO_2$ gas was about 2.55 times better than $N_2O$ gas. After 10 years when the thin film was applied to metal/insulator/semiconductor(MIS)-nonvolatile memory(NVM), MIS NVM using $SiO_2$($CO_2$) on tunneling layer had window memory of 2.16 V with 60% retention at bias voltage from +16 V to -19 V. However, MIS NVM applied $SiO_2$($N_2O$) to tunneling layer had 2.48 V with 61% retention at bias voltage from +20 V to -24 V. The results show $SiO_2$ using $CO_2$ decrease the $D_{it}$ and it improves the operating voltage.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.217.2-217.2
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• 2014

We prepared a flexible and transparent CuO/Cu/CuO multilayer electrodes on a polyethylene terephthalate (PET) substrate using a specially designed roll-to-roll sputtering system at room temperature for GFF-type touch screen panels (TSPs). By the continuous roll-to-roll sputtering of the CuO and Cu layer, we fabricated a flexible CuO(150nm)/Cu(150nm)/CuO(150nm) multilayer electrodes with a sheet resistance of $0.289{\Omega}/square$, resistivity of $5.991{\times}10^{-23}{\Omega}-cm$, at the optimized condition without breaking the vacuum. To investigate the feasibility of the CuO/Cu/CuO multilayer as a transparent electrode for GFF-type TSPs, we fabricated simple GFF-type TSPs using the diamond patterned CuO/Cu/CuO electrode on PET substrate as function of mesh line width. Using diamond patterned CuO/Cu/CuO electrode of mesh line $5{\mu}m$ with sheet resistance of 38 Ohm/square, optical transmittance of 90% at 550 nm and an average transmittance of 89% at wavelength range from 380 to 780 nm, we successfully demonstrated GFF-type touch panel screens (TPSs). The successful operation of GFF-type TPSs with CuO/Cu/CuO multilayer electrodes indicates that the CuO/Cu/CuO multilayer is a promising transparent electrode for large-area capacitive-type TPSs due to its low sheet resistance and high transparency.