• Title/Summary/Keyword: Metal line

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Sag Behavior of STACIR/AW 410SQmm Overhead Conductor in accordance with the Aging (STACIR/AW 410SQmm 가공송전선의 경년열화와 이도거동(III))

  • Kim Shang-Shu;Kim Byung-Geol;Sin Goo-Yong;Lee Dong-Il;Min Byung-Uk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.3
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    • pp.280-286
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    • 2006
  • As a way to expand electric capacity in conductor with electric power demand, STACIR/AW (Super Thermal-resistant Aluminum-alloy Conductors Aluminum-clad Invar-Reinforced) conductor which has high electric current and heat resistance characteristics have been developed. STACIR/AW power line is mechanical composite wire composed of steel cores for dip control and aluminum conductors for sending electric current. Recently, to ensure stable operation and prediction of wire life span of STACIR/AW conductor, a heat property of STACIR/AW conductor have been investigated. In the present work, a change of essential property with long term-heat exposure of STACIR/AW conductor and its structure material, INVAR wire and Al conductor, have been investigated. INVAR/AW is approximately $3.2\;{\mu}m/m^{\circ}C$. thermal expansion coefficient of INVAR/AW wire increases with time of heat exposure. the thermal expansion coefficient of INVAR/AW is markedly influenced by heat and mechanical treatment. creep rate(0.242) of STACIR/AW $410\;mm^2$ conductor at room temperature is much higher than that(0.022) at $210\;^{\circ}C$ STACIR/AW $410\;mm^2$ conductor has minimum creep rate at operating temperature. To lower creep rate with increase temperature is more unique characteristics in STACIR/AW. It is expected that STACIR/AW turned its tension to INVAR/AW at the transition temperature. at room temperature, the tension apportionment of INVAR/AW in STACIR/AW is about $50\;\%$. but whole tension of STACIR/AW is placed on the INVAR/AW alone of core metal above transition temperature.

A Study on the Behavior of the Plane Stress Fracture Toughness - About the Compact Tension Specimen- (平面應力 破壞靭性値 擧動에 관한 硏究)

  • 송삼홍;고성위
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.10 no.6
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    • pp.937-946
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    • 1986
  • In this paper, the plane stress fracture toughness of low carbon steel with 3mm thickness is investigated for various specimen widths and crack ratios using the J integral. The experiments is carried out for the compact tension(CT) specimen on an Instron machine. For materials that may be approximated by the Ramberg and Osgood stress strain law, the relevant crack parameter like the J integral and load line displacement are approximately normalized. Crack driving forces in terms of J integral is computed using the above estimation scheme. Abtained results are summarized as follows. (1) The plane stress fracture toughness, J$_{c}$, is almost constant in the range 50-70mm of width. Hence J$_{c}$ can be obtained by using smaller specimen than ASTM standard. (2) Yoon's and Simpson's formular which considers crack growth in obtaining J integral show more consevative J than Rice's and Merkle's (3) J$_{c}$ is almost constant in the range 0.499-0.701 crack ratios tested. J$_{c}$ obtained by using Kumar's formular is 28.14kgf/mm for base metal specimen and 32.51kgf/mm for annealed. (4) Comparison of the prediction with actual experimental measurements by Yoon's formular show good agreement for several different-size specimens.

An Introduction to the Ground Water Model Test (지하수 model에 관한 모형시험방법)

  • 김주욱
    • Magazine of the Korean Society of Agricultural Engineers
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    • v.9 no.2
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    • pp.1301-1305
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    • 1967
  • Ground water flow can be studied with model test. Model test of ground water works are necessary for economic and safe design of the works. Also influence of the ground water flow to the durability and safety of hydraulic structures can be studied with this model. a. Sand model ; Water flow through porous media is the principle of sand model. Darcy's formula is the basic equation, $q=k{\frac{dh}{ds}}^{\circ}. The effect of the ground water flow on the grain system itself is represented with this model only. b. Hele-Shaw model ; In this model use is made of the viscous flow analogy. Viscous fluid such as glycerine flowing through two parallel plates depends on Poiseuille law, $q=-c{\frac{dh}{ds}}$. The analogue can be used vertically and horizontally. c. Heat model ; This is based on the analogy of the Fourier's law for heat conduction and Darcy's law for ground water flow. Especially unsteady problem can be studied with this model. A difficulty of the construction of this model is the isolation, which has to prevent losses of the heat. d. Electirc model ; Ohm's law for electric current is analogous to Darcy's law. Resistance material such as metal foil, graphite block, water with salt added, gelatine with salt added, ete. is connected to electric sources and resistor, and equi-voltage line is detected with galvanometer, $N_aCl$, $CuSo_4$, etc. are used as salt in the model. e. Membrane model ; This model is based on the facts that the deflection of a thin membrane obeys Laplace's equation if there is no load in the direction perpendicular to the membrane, and if the dellection is small.

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A Study of New Technique Development for Creep Evaluation of Heat Resistant Steel Weldment(I) (내열강 용접부의 크리프 평가 신기술 개발에 관한 연구)

  • 유효선;백승세;권일현;이송인
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.30-30
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    • 2002
  • It has been reported that the creep characteristics on weldment which is composed of weld metal(W.M), fusion line(F.L), heat-affected zone(HAZ), and base meta(B.M) could be unpredictably changed in severe service conditions such as high temperature and high pressure. However, the studies done on creep damage in power plant components have been mostly conducted on B.M and not the creep properties of the localized microstructures in weldment have been thoroughly investigated yet. In this paper, it is investigated the creep characteristics for three microstructures like coarse-grain HAZ(CGHAZ), W.M, and B.M in X20CrMoV121 steel weldment by the small punch-creep-(SP-Creep) test using miniaturized specimen(l0×10×0.5mm). The W.M microstructure possesses the higher creep resistance and shows lower creep strain rate than the B.M and CGHAZ. In the lower creep load the highest creep strain rate is exhibited in CGHAZ, whereas in the higher creep load the B.M represents the high creep strain rate. The power law correlation for all microstructures exists between creep rate and creep load at 600℃. The values of creep load index (n) based on creep strain rate for B.M, CGHAZ, and W.M are 7.54, 4.23, and 5.06, respectively and CGHAZ which shows coarse grains owing to high welding heat has the lowest creep loade index. In all creep loads, the creep life for W.M shows the highest value.

Apoptotic Signaling Pathway by Cadmium in Hepalclc7 cells (Hepa1c1c7 세포에서 카드뮴에 의한 세포사멸 신호전달체계에 관한 연구)

  • 오경재;염정호
    • Toxicological Research
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    • v.17 no.3
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    • pp.215-223
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    • 2001
  • Cadmium is an ubiquitous toxic metal and chronic exposure to cadmium results in the accumulation of cadmium in the liver and kidneys. In contrast, acute exposure leads to damage mainly in the liver. Apoptosis induced by cadmium has been shown in many tissues in vivo and in cultured cells in vitro. However, the molecular mechanism of cadmium-induced apoptosis is not clear in hepatocyte. To investigate the induction of apoptosis in the hepatocyte, we used mouse hepatoma cell line, Hepalclc7 cells, and analysed the molecules that involved in cadmium-induced apoptosis. Cadmium induced the genomic DNA fragmentation, PARP cleavage, and activation of caspase-3 like protease. Caspase-9 cysteine protease was activated in a time-dependent manner but caspase-8 cysteine protease was not significantly activated in cadmium-treated Hepalclc7 cells. Cadmium also induced mitochondrial dysfunction including cytochrome c release from mitochondria, change oj mitochondrial membrane potential tranition, and tranlocation of Bax Protein into mitochondria. These results strong1y indicated that the signal Pathway of apoptotic death in cadmium-treated Hepalclc7 cells is modulated by caspase cascade via mitochondria.

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Real-Time Spacer Etch-End Point Detection (SE-EPD) for Self-aligned Double Patterning (SADP) Process

  • Han, Ah-Reum;Lee, Ho-Jae;Lee, Jun-Yong;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.436-437
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    • 2012
  • Double patterning technology (DPT) has been suggested as a promising candidates of the next generation lithography technology in FLASH and DRAM manufacturing in sub-40nm technology node. DPT enables to overcome the physical limitation of optical lithography, and it is expected to be continued as long as e-beam lithography takes place in manufacturing. Several different processes for DPT are currently available in practice, and they are litho-litho-etch (LLE), litho-etch-litho-etch (LELE), litho-freeze-litho-etch (LFLE), and self-aligned double patterning (SADP) [1]. The self-aligned approach is regarded as more suitable for mass production, but it requires precise control of sidewall space etch profile for the exact definition of hard mask layer. In this paper, we propose etch end point detection (EPD) in spacer etching to precisely control sidewall profile in SADP. Conventional etch EPD notify the end point after or on-set of a layer being etched is removed, but the EPD in spacer etch should land-off exactly after surface removal while the spacer is still remained. Precise control of real-time in-situ EPD may help to control the size of spacer to realize desired pattern geometry. To demonstrate the capability of spacer-etch EPD, we fabricated metal line structure on silicon dioxide layer and spacer deposition layer with silicon nitride. While blanket etch of the spacer layer takes place in inductively coupled plasma-reactive ion etching (ICP-RIE), in-situ monitoring of plasma chemistry is performed using optical emission spectroscopy (OES), and the acquired data is stored in a local computer. Through offline analysis of the acquired OES data with respect to etch gas and by-product chemistry, a representative EPD time traces signal is derived. We found that the SE-EPD is useful for precise control of spacer etching in DPT, and we are continuously developing real-time SE-EPD methodology employing cumulative sum (CUSUM) control chart [2].

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Influence of Ne-Xe Gas Mixture Ratio on the Extreme Ultraviolet (EUV) Emission Measurement from the Coaxially Focused Plasma

  • Lee, Sung-Hee;Hong, Young-June;Choi, Duk-In;Uhm, Han-Sup;Choi, Eun-Ha
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.220-220
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    • 2011
  • The Ne-Xe plasmas in dense plasma-focus device with coaxial electrodes were generated for extreme ultraviolet (EUV) lithography. The influence of gas mixture ratio, Ne-Xe (1, 10, 15, 20, 25, 30, 50%) mixture gas, on EUV emission measurement, EUV intensity and electron temperature in the coaxially focused plasma were investigated. An input voltage of 4.5 kV was applied to the capacitor bank of 1.53mF and the diode chamber was filled with Ne-Xe mixture gas at a prescribed pressure. The inner surface of the cylindrical cathode was lined by an acetal insulator. The anode was made of tin metal. The EUV emission signal of the wavelength in the range of 6~16 nm has been detected by a photo-detector (AXUV-100 Zr/C, IRD). The visible emission line was also detected by the composite-grating spectrometer of the working wavelength range of 200~1100 nm (HR 4000CG). The electron temperature is obtained by the optical emission spectroscopy (OES) and measured by the Boltzmann plot with the assumption of local thermodynamic equilibrium (LTE).

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Thermocompression bonding for wafer level hermetic packaging of RF-MEMS devices (RF-MEMS 소자의 웨이퍼 레벨 밀봉 패키징을 위한 열압축 본딩)

  • Park, Gil-Soo;Seo, Sang-Won;Choi, Woo-Beom;Kim, Jin-Sang;Nahm, Sahn;Lee, Jong-Heun;Ju, Byeong-Kwon
    • Journal of Sensor Science and Technology
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    • v.15 no.1
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    • pp.58-64
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    • 2006
  • In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

Ultra-thin aluminum thin films deposited by DC magnetron sputtering for the applications in flexible transparent electrodes (스퍼터링법으로 증착된 초박형 Al 박막의 투명전극 적용성 연구)

  • Kim, Dae-Gyun;Choe, Du-Ho
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.82-82
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    • 2018
  • 광전소자용 투명전극으로 적용하기 위한 초박형 Al 박막에 대해서 기초연구를 수행하였다. 증착 전 챔버(chamber) 내 기저압력은 $3{\times}10^{-7}Torr$이하로 유지하였으며 Ar 불활성 기체의 유입을 통해 작업압력을 $1{\times}10^{-2}Torr$로 상승시켜 증착을 실시하였다. DC 마그네트론 스퍼터링법을 이용하여 유리기판상에 Al 박막의 증착을 실시하였으며, 박막의 두께가 3-12 nm인 Al 박막을 각각 형성하였다. 두께가 7 nm 일 때 면저항은 $135{\Omega}/{\square}$로 측정되었고 7 nm 이상인 두께의 박막은 두께가 증가할 때 면저항이 점진적으로 감소되는 경향을 확인할 수 있었다. 두께가 10 nm인 박막의 측정된 면저항은 $13.1{\Omega}/{\square}$로 두께 7 nm인 박막과 비교하였을 때 약 10배의 차이를 확인할 수 있었다. 두께 6 nm 이하인 박막은 면저항 측정이 불가능하였는데 이는 SEM 분석 결과, 연속박막을 이루지 못 하였기 때문이라고 결론을 내릴 수 있었으며, 두께 12 nm인 박막까지 완전한 연속박막이 형성되지 않았다. 각각의 박막에서 입자의 크기는 선 교차법(line intercept method)을 이용하여 시편당 평균 120개의 입자에 대한 평균값을 측정하였으며, 이론적으로 예상할 수 있는 바와 같이 두께가 증가할수록 입자크기도 비례하여 증가하게 되는 것을 확인할 수 있었다. 가시광선 파장영역 내 투과도의 경우, 3 nm 두께에서 평균 80% 이상의 투과도가 측정된 데 반하여, 4-5 nm 두께에서 평균 60%로 급격하게 감소되기 시작하며 그 이후, 두께 증가에 따라 투과도가 점진적으로 감소되는 경향을 확인할 수 있었다. 또한 Al 박막은 시간의 경과에 따른 표면의 산화가 진행되어 기존에 측정된 면저항보다 10-60%의 면저항이 증가하였는데 이는 두께가 얇을수록 더 산화의 영향을 많이 받기 때문에 나타난 결과로 보인다. 추후 산화방지막 및 빛반사방지막 층을 초박형 Al박막과 함께 Oxide/Metal/Oxide 구조로 형성하여 위와 같은 현상들을 해결하고 박막물성의 증진을 통해 투명전극에 적용을 목표로 한다.

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Panoramic radiological study to identify locally displaced maxillary canines in Bangladeshi population

  • Alif, Sheikh Mohammad;Haque, Sejuty;Nimmi, Naima;Ashraf, Ali;Khan, Saeed Hossain;Khan, Mahfujul Haq
    • Imaging Science in Dentistry
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    • v.41 no.4
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    • pp.155-159
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    • 2011
  • Purpose : This study was performed to determine the prevalence of maxillary canine impaction on a basis of a single panoramic radiograph in Bangladeshi population. Materials and Methods : A random sample of seven hundred panoramic radiographs was collected from the patient record of a dental clinic. All the selected panoramic radiographs were taken from January 2009 to August 2010 by a single panoramic radiograph machine with the same exposure time (19 seconds) for all radiographs. One hundred and twenty panoramic radiographs were excluded to minimize the selection bias. In a dim lit room, an observer assessed the radiographs on a standard radiographic light box. The position of the impacted maxillary canine was recorded in line with the longitudinal axis of a tooth using the edge of a metal ruler. Data were subsequently put on SPSS 11.5 software and chi-square (${\chi}^2$) tests were applied to find out the association. Results : Among 580 panoramic radiographs it was found that impacted maxillary canines were present in only 7 (1.2%) radiographs. A statistical significant difference was found between the age of the patients and the vertical position of the impacted canines (p=0.000) and between the age of the patients and the horizontal position of the impacted canines (p=0.003). Conclusion : The prevalence was found to be low compared with the present study from the limitation of panoramic image. Further study needs to include three-dimensional imaging modality.