• Journal of Powder Materials
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• v.4 no.3
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• Applied Chemistry for Engineering
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• v.34 no.1
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• pp.86-93
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• 2023

In this study, we investigated the various adsorption factors influencing the adsorption of heavy metal ions based on the study of the composition and physicochemical properties of scoria dispersed throughout Jeju Island. Analysis of the distribution characteristics of scoria samples collected from five areas of Jeju showed that reddish-brown-colored scoria were predominant. Analysis of scoria collected from Jeju Island showed that its mineral components are ordered as follows: SiO₂ > Al₂O₃ > Fe₂O₃ > CaO and MgO. The experimental data did not show a linear relationship in the pseudo-first-order adsorption kinetics. In contrast, a pseudo-second-order model yielded a positive linear relationship, and this model was subsequently used. It could be concluded based on an intraparticle diffusion model indicating linear relationships that the capture of metal ions on scoria is dominated by the primary adsorption step.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.10
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• pp.1480-1488
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• 2003

Synthesis of carbon nanomaterials on a substrate coated with metal nitrates using an ethylene fueled inverse diffusion flame was illustrated. The effects of radial distance, residence time of the substrate, and hydrocarbon composition on the synthesis of carbon nanomaterials were investigated. The effects of catalyst metal particles were also studied using SUS304 substrates coated with Fe(NO$_3$)$_3$ (ferric nitrate, nonahydrate) and Ni(NO$_3$)$_2$(nickel nitrate, hexahydrate), and Cu substrate. Carbon nanomaterials, with diameters ranging from 30 - 70 nm, were observed on the substrate for both cases of using substrates only and using them with metal nitrates. In case of using the substrate with metal nitrates, the formation and growth of carbon nanomaterials were occurred in the lower temperature region than that of using the substrates only due to the easy activation of the metal particles coated on the surface of the substrates.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• Journal of Korea Foundry Society
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• v.13 no.1
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• pp.42-49
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• 1993

Conventional manufacturing process for cast iron-babbitt metal composite is complicate and bimetallic bonding by centrifugal casting is also difficult because their melting point is largely different and nonmetallic inclusion exists on outer shell. This study is aiming to simplify multistage process by adding Cu-powder as insert metals during cast iron solidification. The variables on fabrication of composite pipe are mold rotating speed and inner surface temperature of outer metal. The optimum temperature range for fusion bonding between cast iron and Cu-layer was $1100^{\circ}C-1140^{\circ}C$ in case of mold rotating speed was 700rpm. When the inner surface of Cu-layer was at $900^{\circ}C$, the value of interfacial hardness between Cu-layer and babbitt metal were higher than Cu-matrix by forming diffusion layer, interfacial products between Cu-layer and babbitt metal are proved to be $Cu_6Sn_5({\eta})$by XRD.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.2
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• pp.25-30
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• 2015

This study involved the fabrication of precision machine tools using a polycrystalline diamond tip [sintered PCD and cemented carbide (WC-Co) tip] and WC-Co shanks via diffusion bonding with a paste-type nickel alloy filler metal. Diffusion bonding is a process whereby two materials are pressed together at high temperature and high pressure for a sufficient period of time to allow significant atomic diffusion to occur. For smooth progress, a filler metal of nickel alloy was used at the interface. Optical microscopy images were used to observe the copula of the bonded layer. It was confirmed that cracks occurred near the junction in all cases. The tensile strength of the bond was measured using a universal testing machine (UTM) with WC-Co proportional test specimens.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.11
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• pp.683-689
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• 2015

For the formation of $N^+$ doping, the antimony ions are mainly used for the fabrication of a BJT (bipolar junction transistor), CMOS (complementary metal oxide semiconductor), FET (field effect transistor) and BiCMOS (bipolar and complementary metal oxide semiconductor) process integration. Antimony is a heavy element and has relatively a low diffusion coefficient in silicon. Therefore, antimony is preferred as a candidate of ultra shallow junction for n type doping instead of arsenic implantation. Three-dimensional (3D) profiles of antimony are also compared one another from different tilt angles and incident energies under same dimensional conditions. The diffusion effect of antimony showed ORD (oxygen retarded diffusion) after thermal oxidation process. The interfacial effect of a $SiO_2/Si$ is influenced antimony diffusion and showed segregation effects during the oxidation process. The surface sputtering effect of antimony must be considered due to its heavy mass in the case of low energy and high dose conditions. The range of antimony implanted in amorphous and crystalline silicon are compared each other and its data and profiles also showed and explained after thermal annealing under inert $N_2$ gas and dry oxidation.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.76-83
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• 2013

This study investigated the effect of bonding temperature and holding time on microstructures and mechanical properties of diffusion bonded joint of Haynes230. The diffusion bonds were performed at the temperature of 950, 1050, and $1150^{\circ}C$ for holding times of 30, 60, 120 and 240 minutes at a pressure of 4MPa under high vacuum condition. The amount of non-bonded area and void observed in the bonded interface decreased with increasing bonding temperature and holding time. Cr-rich precipitates at the linear interface region restrained grain migration at $950^{\circ}C$ and $1050^{\circ}C$. However, the grain migration was observed in spite of short holding time due to the dissolution of precipitates to base metal in the interface region at $1150^{\circ}C$. Three types of the fracture surface were observed after tensile test. The region where the coalesce and migration of grain occurred much showed high fracture load because of base metal fracture whereas the region where those did less due to the precipitates demonstrated low fracture load because of interface fracture. The expected fracture load could be derived with the value of fracture area of base metal ($A_{BF}$) and interface ($A_{IF}$), $Load=201A_{BF}+153A_{IF}$. Based on this equation, strength of base metal and interface fracture were calculated as 201MPa and 153MPa, respectively.

• Journal of Welding and Joining
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• v.17 no.4
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• pp.60-68
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• 1999

The previously developed two dimensional model was modified in order to predict more accurately the degree of microsegregation and eutectic fraction on in weld metal whose solidification rate is very fast. The model employed the same assumptions with previous model but considered of a tip undercooling. The previously predicted microsegregation and eutectic fraction has the discrepancies between simulated and examined results in the weld metal solidification. The experiments for the weld metal solidification of 2024 A1 and Fe-Ni alloy were carried out in order to examine the reasonability and feasibility of this modified model. The concentration profile of the solute and eutectic fraction predicted by the simulation agreed well with those found from experimental works. According to the results, it was believed that the dendrite tip undercooling considered in the modified model be reasonable for predicting the degree of microsegregation more accurately in weld metla solidification. In the GTA welds, degree of dendrite-tip undercooling increases with increasing solidification rage(welding speed). This serves to increase the concentration of dendrite core and thus result in reducing the degree of segregation. And solid state diffusion(back diffusion) during solidification is very low in the weld metal solidification so that little additional homogenization of solute occurs during solidification. With consideration of tip undercooling this modified model can predict exactly degree of microsegregation and eutectic fraction from slow solidification(casting) to fast solidification(welding).

• Membrane Journal
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• v.12 no.1
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• pp.51-53
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• 2002

The hydrogen ions in poly (vinyl alcohol) (PVA)/sulfosuccinic acid (SSA) membranes substiuted with $Li^+, Na^+, and K^+/ $of monvoalent metal ions, $Mg^{2+}, Ca^{2+} and Ba^{2+}$ of divalent metal ions, and $Al^{3+}$ of trivalent metal ion. In addition, $Li^+ ions were exchanged with varing reaction time. The effects of metal ions exchanged were investigated in terms of methanol permeability -uling diffusion cell. The methanol permeabilies decreased in the sequence of $Na^+, Li^+ and K^+$ and this might be due to the 'Salting-out' effect while the methanol permeabilities for divalent and trivalent ion-substituted membranes were affected by the combined effects of salting-out, eletrostatic crosslinking and extent of metal ion substiution. As for $Li^+$ ions, methanol permeabilities of PVA/SSA membranes decreased in proportion to the degrees of subsituted $Li^+$ ions.