• Journal of Magnetics
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• 제8권1호
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• pp.1-6
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• 2003

The new class of $Gd_5(Si_xGe_{1-x})_4$ compounds undergoes a simultaneous magnetic/structural phase transition giving a high level of strain that can be induced either by change in temperature or by application of a magnetic field. Profound changes of structural, magnetic, and electronic changes occur in the $Gd_5(Si_xGe_{1-x})_4$ system lead to extreme behavior of the material such as the giant magnetocaloric effect, colossal magnetostriction, and giant magnetoresistance. These unique material characters can be utilized for various applications including magnetic solid refrigerants, sensors, and actuators.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.303.2-303.2
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• 2014

The oxides of group IV transition metals such as titanium, zirconium, hafnium have many important current and future application, including protective coatings, sensors and dielectric layers in thin film electroluminescent (TFEL) devices. Recently, group IV transition metal oxide films have been intensively investigated as replacements for SiO2. Due to high permittivities (k~14-25) compared with SiO2 (k~3.9), large band-gaps, large band offsets and high thermodynamic stability on silicon. Herein, we report the synthesis of new group IV transition metal complexes as useful precursors to deposit their oxide thin films using chemical vapor deposition technique. The complexes were characterized by FT-IR, 1H NMR, 13C NMR and thermogravimetric analysis (TGA). Newly synthesised compounds show high volatility and thermal stability, so we are trying to deposit metal oxide thin films using the complexes by Atomic Layer Deposition (ALD).

• 한국재료학회지
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• 제17권3호
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• pp.179-183
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• 2007

A plate heat exchanger (PHE) normally uses vacuum brazing technology for connecting plates and fins. However, the reliability of high temperature brazing, especially with nickel-based filler metals containing boron the formation of brittle intermetallic compounds (IMCs) in brazed joints is of major concern. since they considerably degrade the mechanical properties. This research was examined the vacuum brazing of commercially SUS304 stainless steel with BNi-2 (Ni-Cr-B-Si) filler metal, and discussed to determine the influence of brazing temperatures on the microstructure and mechanical strength of brazed joints. In the metallographic analysis it is observed that considerable large area of Cr-B intermetallic compound phases at the brazing layer and the brazing tensile strength is related to removal of this brittle phase greatly. The mechanical properties of brazing layer could be stabilized through increasing the brazing temperature over $100^{\circ}C$ more than melting temperature of filler metals, and diffusing enough the brittle intermetallic compound formed in the brazing layer to the base metal.

• 한국재료학회지
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• 제17권3호
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• pp.142-146
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• 2007

Vacuum brazing method has been coming to an important process as one of the new fabricating techniques of metals and alloys. In this study, a vacuum brazing of SUS304 stainless steel with BNi-2 filler metal was carried out in $1{\times}10^{4}$ Torr of vacuum atmosphere. The formation of brittle intermetallic compounds in brazed joints between SUS304 stainless steel and BNi-2 filler metal is a major concern, since they considerably degrade the mechanical properties of joints. To obtain enough stable joining strength, it is necessary to understand the unique properties of brazing process with Ni-based filler metals containing boron. So, in this research we investigated the performance of SUS304/BNi-2 brazed system and the brazed joint properties were evaluated at room temperature by using tensile test. Metallurgical and fractographic analysis were used to characterize the microstructure, the mechanisms of brazing, and joint failure modes.

• Bulletin of the Korean Chemical Society
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• 제32권3호
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• pp.815-820
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• 2011

Three kinds of organometallic compounds (chromium acetylacetonate, magnesium acetate and vanadyl acetylacetonate) were used as transition metal precursor, titanium n-butoxide and multi-walled carbon nanotube as titanium and carbon precursor to prepare metal oxide-CNT/$TiO^2$ composites. The surface properties and morphology of metal oxide-CNT/$TiO^2$ composites were by Brauer-Emett-Teller (BET) surface area measurement, scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD) and energy dispersive X-ray (EDX) analysis. The photocatalytic activity of prepared metal oxide-CNT/$TiO^2$ composites was determined by the degradation effect of methylene blue in an aqueous solution under irradiation of visible light.

• 한국기계가공학회지
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• 제14권2호
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• pp.87-92
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• 2015

The injection molding process is widely used in the production of most plastic products. In order to make metal-colored plastic products like those found in modern luxury home alliances, metallic pigments are mixed with a basic resin material for injection molding. However, process control for metal-colored plastic products is extremely difficult due to the non-uniform melt flow of the metallic resin pigments. In this study, the effect of process parameters on the quality of a metal-colored plastic product is evaluated. A rapid mold cooling method using a compressed cryogenic fluid is also proposed to decrease the content of undesired compounds within the plastic product.

• Bulletin of the Korean Chemical Society
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• 제27권3호
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• pp.363-367
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• 2006

The structure-property relations of ternary copper chalcogenides, $TlCu_{3-x}S_2$ and $\alpha-BaCu_{2-x}S_2$ are examined. The density of states, band dispersions, and Fermi surfaces of these compounds are investigated to verify the reason of the metal-insulator transitions by extended Huckel tight-binding band calculations. The origin of the metalinsulator transitions of non-stoichiometric $TlCu_{3-x}S_2$ and $\alpha-BaCu_{2-x}S_2$ is thought to be the electronic instability induced by their Fermi surface nesting.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.1-7
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• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• 한국세라믹학회지
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• 제16권3호
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• pp.169-177
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• 1979

The effect of apparent porosity of the fired ceramics, metallizing temperature, and metallizing mixtures on the bond strength in metal-to-ceramic seals was investigated. Three different metallizing compounds were metallized on dense alumina bodies at 1300~$1500^{\circ}C$ in dry hydrogen atmosphere. Bond strength between metal and alumina body was measured by means of nstron test machine. The greater bond strength was observed as the apparent porosity and metallizing temperature was increased. This work indicated that the glassy phase in metallizing mixture, having had sufficient fluidity to migrate into the alumina body, reacted with alumina and thereby forming strong metal-ceramic interface bond. It also showed that the glassy phase having higher thermal expansion cofficient than molybdenum might contribute to the strong bond formation by providing compressive stress around the molybdenum particle.

• Korean Journal of Hydrosciences
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• 제2권
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• pp.61-68
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• 1991

This study assessed the contribution of heavy metals to total toxicity as well as the presence other toxic compounds before and after adding the chemical P to concurrently conducted bioassay tests of Daphnia magna and P. Phosphoreum. The following conclusions were drawn from this study : With excessive EDTA dosage, a toxicity reduction in Microtox would occur due to a metal-comples being formed. Microtox was far less sensitive than D. magna to heavy metal toxicity, but extended exposure time and reagent could increase the sensitivity.