• Journal of Powder Materials
• /
• v.11 no.5
• /
• pp.412-420
• /
• 2004

The purpose of the present study is to determine an optimum composition using cheaper powders keeping with high performance of hard rock cutting diamond saw blade. With 50Fe-20(Cu . Sn)-30Co specimen, a part of Co was replaced by Ni(5%, 10%, and 15%, respectively). These specimens were hot pressed and sintered for predetermined time at various temperature. Sintering is performed by two different methods of temperature controlled method and specimen dimension controlled method. In order to determine the property of the sintered diamond saw blade, 3 point bending tester, X-ray diffractometer, and SEM were used. As the Co in the bond alloy was replaced by Ni, the hardness of the specimen increased. Thus the 50Fe-20(CuㆍSn)-15Co-15Ni specimen showed the maximum hardness of 104(HRB). The results of 3 point bending test showed that flexure strength decreased along with increase in Ni content. This is attributed to the formation of intermetallic compound(Ni$_{x}$Sn) determined by X-ray diffraction. The fracture surface after 3 point bending test showed that diamond was fractured in the specimen containing 0%, 5%, and 10%Ni, and the fracture occurred at the interface between diamond and matrix in the specimen containing 15%Ni. The cutting ability test showed that the abrasive property was not changed in the specimen containing 0%, 5%, and 10%Ni. The optimum composition determined in this study is 50Fe-20(CuㆍSn)-20Co-10Ni.

• Bulletin of the Korean Chemical Society
• /
• v.29 no.9
• /
• pp.1717-1722
• /
• 2008

The 70 kDa heat-shock protein (Hsp70) involved in various cellular functions, such as protein folding, translocation and degradation, regulates apoptosis in cancer cells. Recently, it has been reported that the green tea flavonoid (−)-epigallocatechin 3-gallate (EGCG) induces apoptosis in numerous cancer cell lines and could inhibit the anti-apoptotic effect of human Hsp70 ATPase domain (hATPase). In the present study, docking model between EGCG and hATPase was determined using automated docking study. Epi-gallo moiety in EGCG participated in hydrogen bonds with side chain of K71 and T204, and has metal chelating interaction with hATPase. Hydroxyl group of catechin moiety also participated in metal chelating hydrogen bond. Gallate moiety had two hydrogen bondings with side chains of E268 and K271, and hydrophobic interaction with Y15. Based on this docking model, we determined two pharmacophore maps consisted of six or seven features, including three or four hydrogen bonding acceptors, two hydrogen bonding donors, and one lipophilic. We searched a flavonoid database including 23 naturally occurring flavonoids and 10 polyphenolic flavonoids with two maps, and myricetin and GC were hit by map I. Three hydroxyl groups of B-ring in myricetin and gallo moiety of GC formed important hydrogen bonds with hATPase. 7-OH of A-ring in myricetin and OH group of catechin moiety in GC are hydrogen bond donors similar to gallate moiety in EGCG. From these results, it can be proposed that myricetin and GC can be potent inhibitors of hATPase. This study will be helpful to understand the mechanism of inhibition of hATPase by EGCG and give insights to develop potent inhibitors of hATPase.

• The korean journal of orthodontics
• /
• v.29 no.5 s.76
• /
• pp.599-611
• /
• 1999

The purpose of this study was to evaluate shear, tensile and shear/tensile combined bond strengths(SBS, TBS, S/TBS) in various orthodontic brackets bonded to human teeth with chemically cured adhesive (Ortho-one, Bisco, USA). Five types of metal brackets with various bracket base configurations (Micro-Loc base(Tomy, Japan), Chessboard base(Daesung, Korea), Non-Etched Foil Mesh base(Dentarum, Germany), Micro-Etched Foil Mesh base(Ortho Organiners, USA), Integral base(Unitek, USA)) were used in this study. Shear, tensile and shear/tensile combined bond strengths according to the direction of force were measured by universal testing machine. The bracket base surface after bond strength test were examined by stereoscope and scanning electron microscope. The assessment of resin remnant on bracket base surface was carried out by ARI(adhesive remnant index). The results obtained were summarized as follows, 1. In all brackets, SBS was in the greatest value(p<0.05), TBS was in 50% level and S/TBS was in 30% level of SBS. 2. In bond strength, Micro-Loc base bracket showed the maximum bond strength($SBS:22.86{\pm}1.37kgf,\;TBS:11.37{\pm}0.42kgf,\;S/TBS:6.69{\pm}0.34kgf$) and Integral base bracket showed the minimum bond strength($SBS:10.52{\pm}1.27kgf,\;TBS:4.27{\pm}1.08kgf,\;S/TBS:2.94{\pm}0.58kgf) (p<0.05). 3. In bond strength per unit area, Integral base bracket showed the minimum value, Micro-Loc base and Chessboard base brackets were in similar value(p>0.05). Non-Etched Foil Mesh base and Micro-Etched Foil Mesh base bracket were similar in SBS and TBS(p>0.05), but Micro-Etched Foil Mesh base bracket was greater than Non-Etched Foil Mesh base bracket in S/TBS(p<0.05). 4. Bond failure sites were mainly between bracket base and adhesive, therefore ARI scores were low.

• Journal of the Korean Chemical Society
• /
• v.56 no.6
• /
• pp.679-691
• /
• 2012

New series of metal complexes of Co(II), Ni(II), Cu(II), Zn(II), Pd(II) and Pt(II) with 4-(p-chlorophenyl)-1-(pyridin-2-yl)thiosemicarbazide (HCPTS) have been synthesized and characterized by elemental analyses, magnetic moment, spectra (IR, UV-Vis, $^1H$ NMR, mass and ESR) and thermal studies. The IR data suggest different coordination modes for HCPTS which behaves as a monobasic bidentate with all metal ions except Cu(II) and Zn(II) which acts as a monobasic tridentate. Based on the electronic and magnetic studies, Co(II), Cu(II), Pd(II) and Pt(II) complexes have square - planner, Ni(II) has mixed stereochemistry (tetrahedral + square planar), while Zn(II) is tetrahedral. Molar conductance in DMF solution indicates the non-ionic nature of the complexes. The ESR spectra of solid copper(II) complex show $g_{\parallel}$ (2.2221) > $g_{\perp}$ (2.0899) > 2.0023 indicating square-planar structure and the presence of the unpaired electron in the $d_x2_{-y}2$ orbital with significant covalent bond character. The thermal stability and degradation kinetics of the ligand and its metal complexes were studied by TGA and DTA and the kinetic parameters were calculated using Coats-Redfern and Horowitz-Metzger methods. The complexes have more antibacterial activity against some bacteria than the free ligand. However, the ligand has high anticancer activities against HCT116 (human colon carcinoma cell line) and HEPG2 (human liver hepatocellular carcinoma cell line) compared with its complexes.

• Korean Chemical Engineering Research
• /
• v.58 no.2
• /
• pp.176-183
• /
• 2020

In this study, synthesis of a hydrogel consisted of a coordination bond network between small organic molecules and transition metals had been carried out. By adding a tackifying material to the gel, the potential of the gel to be used as an adhesive material had been also confirmed. Synthesis of the adhesive had been done with simple mixing of 3 components: tannic acid, transition metal, and polymer. The tannic acid molecule possesses multiple hydroxyl groups that can form coordination bonds with the transition metals and hydrogen bonds with the hydrophilic polymers. Due to the morphology of the metal-organic complex and polymer dispersed in water, the fabricated material exhibited high adhesiveness and cohesiveness. Optimizing the rheological property had been conducted for use in adhesive by the synthesis with varying the transition metal (Fe³⁺, Ti⁴⁺), polymer, and treatment conditions. Rheological measurement results demonstrate the promising potential of the material as a bio-compatible and versatile pressure-sensitive adhesive with both high adhesiveness and cohesiveness.

• Journal of Welding and Joining
• /
• v.2 no.1
• /
• pp.4-17
• /
• 1984

Overlaid weld metals of austenitic stainless steel in a pressure vessel of power reactor are usually post-weld heated for a long period of time after welding. The PWHT is considered as a kind of sensitizing and it is important to check the soundness of the weld metal after PWHT, especially about the precipitation of carbides. The purpose of this report is to obtain information on the relation between the change of microstructure and Post-Weld Heat Treatment in the overlaid weld metals. Metallurgical aspects of the problem on austenitic stainless steel heated at $625^{\circ}C$, $670^{\circ}C$, $720^{\circ}C$ and $760^{\circ}C$ for 3, 10, 30, 100 and 300 hours have been investigated by means of optical-micrography, micro-hardness measurement, scanning electron microscope and electron-probe micro analysis. From the results obtained, the following conclusions are drawn; 1) The PWHT above $625^{\circ}C$ for a long time causes a diffusion of carbon atoms from low alloy steel into stainless steel, and consequently carbon is highly concentrated at the boundary layer of stainless steel. 2) C in ferritic steel migrated to austenitic steel and carbides precipitated in austenitic steel along fusion line. At higher temperatures, the ferrite grains coarsened in the decarburized zone. 3) In the change of microstructure of stainless steel overlaid weld metal, the width of carbides precipitated zone and decarburized zone increased with increase of PWHT temperature and time. 4) At about $625^{\circ}C$ to $760^{\circ}C$, chromium carbides, mainly $M_{23} C_6$, precipitate very closely in the carburized layer with remarkable hardening. 5) Precipitation of delta ferrite from molten weld metal depends on solidification phenomenon. There was a small of ferrite near the bond in which the local solidification time was short, comparing with after parts of weld metal. Shape and amount of ferrite were not changed by Post-Weld Heat Treatment after solidification.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.52 no.11
• /
• pp.29-35
• /
• 2015

The photo-response characteristics of polysilicon based metal-semiconductor-metal (MSM) photodetector structure, depending on deuterium treatment method, was analyzed by means of the dark-current and the light-current measurements. Al/Ti bilayer was used as a Schottky metal. Our purpose is to incorporate the deuterium atoms into the absorption layer of undoped polysilicon, effectively, for the defect passivation. We have introduced two deuterium treatment methods, a furnace annealing and an ion implantation. In deuterium furnace annealing, deuterium bond was distributed around polysilicon surface where the light current flows. As for the ion implantation, even thought it was a convenient method to locate the deuterium inside the polysilicon film, it creates some damages around polysilicon surface. This deteriorated the photo-response in our photodetector structure.

• Bulletin of the Korean Chemical Society
• /
• v.27 no.5
• /
• pp.759-761
• /
• 2006

The compound B(C6F5)3 and its variations have been widely employed as alkyl carbanion abstracting reagents to produce metallocene cations for olefin polymerization.1-3 Weakly coordinating anions containing boron can greatly improve the activity of metallocene catalysts used in industrial olefin polymerization4 and thus group IV and V metallocene complexes of the organohydroborate anions have been intensively investigated.5 Recently, many organohydroborate metallocene complexes have been reported by Shore and co-workers.6-8 A common structural feature of those complexes is the three-center two electron M-H-B bond, like that observed in transition metal tetrahydroborate complexes but the reactivity and fluxional behavior of organohydroborate complexes are unlike those of the tetrahydroborate analogues.6 Although many of those metallocenes have been synthesized, few complexes could be used in the olefin polymerization and then this laboratory has been involved in the chemistry of the cyclic organohydroborate anions, and their group IV metallocene derivatives for the catalyst.9 Described here is recent work that led to the preparation of a novel cyclic organohydroborate hafnocene complex (h5-C5H5)2Hf ？(μ-H)2BC8H14 ,Cl. The hafnocene complex contains the three-center two electron bond Hf-H-B10 in which the hydride abstraction for olefin polymerization may occur.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.434-437
• /
• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.4
• /
• pp.155-162
• /
• 2000

전해 인프로세스 드레싱(ELID)의 응용기술로써 간헐적 드레싱(ELID II) 및 무전극 드레싱(ELID III)이 원통내면 마무리 연삭에 이용되고 있다. 주철본드(CIB-D) 및 메탈레진본드 다이아몬드 숫돌(HRB-D)이 이 방식들에 사용되고 있다. 경면 가공에 있어서 이 두방식은 미립의 숫돌이용으로 일반연삭기에 정밀부속 장치의 보완없이 이용될 수 있다. ELID II 연삭에서 CIB-D숫돌은 파이프 형상의 전극에 의하여 간헐적으로 드레싱되고, 반면에 MRB-D 숫돌은 인프로세스 드레싱 되며 전극은 필요로 하지 않는다. 본 연구에서는 ELID II 및 ELID III 방식에 있어서, 연삭조건 및 연삭입자크기에 대한 연삭특성을 비교검토 하였다. 그 결과, ELID II, III방식 공히 대단히 작은 표면거칠기를 갖는 경면이 얻어짐을 확인하였다.