• Proceedings of the KAIS Fall Conference
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• 2002.11a
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• pp.201-204
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• 2002

Overlay margin 확보를 위한 oversizing과, design rule checking, jog filtering를 통하여 side-lobe를 추출하였다. 이렇게 추출한 side-lobe를 extent하고, Cr pattern을 정의하여 side-lobe 현상을 해결할 수 있었다. 하지만 이 방법은 mask제조 공정이 복잡하므로 Cr shield방식의 단점인 복잡한 mask제작공정과 구조를 단순화하기 위하여 scattering bar를 이용하였다. 따라서, scattering bar를 삽입하기 위한 rule을 생성하여 metal layer에 적용하고 aerial image simulation을 통해 side-lobe 현상이 억제되었음을 확인하였다. 그리고 앞에서와는 반대로 background clear의 경우에 발생하는 side-lobe에 scattering bar를 적용하여 억제됨을 확인하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.133-136
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• 2002

It is very important to get a stable and large-capacity organic effusion source for achievement of OLED mass-production equipment. We present an organic effusion source with film uniformity less than ${\pm}$ 5%, the material charge volume, 300cc for $400{\times}400\;mm^2$ substrate. The fine metal shadow mask alignment technology, one of the color forming technique, also have to support more accurate and fast operating in mass-production. In this paper, we will describe the OLED mass-production equipment with the large volume effusion source and the precision shadow mask alignment technique.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.186-189
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• 2007

The organic deposition chamber has been developed using belt source evaporation techniques for the first time. The deposition chamber is consisted of the belt source, organic vapor source, and the mask alignment assembly. The rollers operate for the thin metal belt to continuously move with the automatic tension control. It has been proved for the belt source evaporation easy to operate and the alignment of the substrate/shadow mask becomes so simple to use in AMOLED manufacturing industry.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.10
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• pp.1011-1017
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• 2012

We report the development of an optical micro-nanolithography method by using a roll-type mask. It includes phase-shift lithography and photolithography for realizing various target dimensions. For sub-wavelength resolution, a structure is achieved using the near-field exposure of a photoresist through a cylindrical phase-mask, allowing high-throughput continuous patterning. By using a film-type metal mask, continuous photolithography was achieved, and this method could be used to control the period of resultant patterns in real time by changing the rotating speed of the cylinder mask. As an application, we present the fabrication of a transparent electrode in the form of a metallic mesh by using the developed roll-type photolithography process. As a result, a transparent conductor with good properties was achieved by using a recently built cylindrical phase-shift lithography prototype, which was designed for patterning on 100-mm2 substrates.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.4 no.1
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• pp.22-26
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• 2003

Overlap Errors and side-lobes have been simultaneously solved by the rule-based correction using the rules extracted from test patterns. Lithography process parameters affecting attPSM lithography process have been determined by the fitting method to the real process data. The correction using scattering bars has been compared to the Cr shield method. The optimal insertion rule of the scattering bal's has made it possible to suppress the side-lobes and to enhance DOF at the same time. Therefore, in this paper, the solution to both side-lobe and overlap Error has been proposed using rule-based confection. Compared to the existing Cr shield method, the proposed rule-based correction with scattering bars can reduce the process complexity and time for mask production.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.1253-1256
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• 2005

We have developed an electron lithography method, Electron Emission Lithography (EEL), which is capable of printing integrated circuits with an exposure time of only a few seconds. The basic design of the mask, manufactured by standard MIM technology, will be discussed. Patterns printed into e-beam resist by a 1:1 projection system show the applicability of the mask for lithography purposes. The minimum feature size projected so far is 10 um in a system capable of 100 m resolution. Further improvements in resolution to 50 nm are possible.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.537-538
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• 2012

• Design & Manufacturing
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• v.14 no.3
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• pp.44-49
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• 2020

One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

• Journal of the Korean institute of surface engineering
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• v.56 no.2
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• pp.115-124
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• 2023

Anodization is an electrochemical process that electrochemically converts a metal surface into an oxide layer, resulting in enhanced corrosion resistance, wear resistance, and improved aesthetic appearance. Local anodization, also known as selective anodization, is a modified process that enables specific regions or patterns on the metal surface to undergo anodization instead of the entire surface. Several methods have been attempted to produce oxide layers via localized anodic oxidation, such as using a mask or pre-patterned substrate. However, these methods are often intricate, time-consuming, and costly. Conversely, the direct writing or patterning approach is a more straightforward and efficient way to fabricate the oxide layers. This review paper intends to enhance our comprehension of local anodization and its potential applications in various fields, including the development of nanotechnologies. The application of anodization is promising in surface engineering, where the anodic oxide layer serves as a protective coating for metals or modifies the surface properties of materials. Furthermore, anodic oxidation can create micro- and nano-scale patterns on metal surfaces. Overall, the development of efficient and cost-effective anodic oxidation methods is essential for the advancement of various industries and technologies.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.1 s.190
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• pp.71-78
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• 2007

Abrasive jet machining (AJM) has been traditionally used for removing rusts or paints. Nowadays, this is promising technology for micro bulk machining where brittle substrate materials are used. In order to get accurate details, masks such as metal, polymer or elastomer is inevitable. Among them, photo polymer which is sensitive to the light has been attractive for it's high accuracy using photolithography. In this research, SU-8 as a photo polymer is used since it is adequate for making thick mask. So, this paper describes how to make AJM masks using SU-8 with a photolithography process, and investigates the characteristics of SU-8 masks during AJM process. Also, an example of fabrication using AJM was shown.