• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.533-538
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• 2001

The barrier height is found to increase from 0.25 to 0.690 eV for Schottky contacts on n-InGaAs using deposition of Ag on a substrate cooled to 77K(LT). Surface analysis leads to an interface model for the LT diode in which there are oxide compounds of In:O and As:O between the metal and semiconductor, leading to behavior as a metal-insulator-semiconductor diode. The metal film deposited t LT has a finer and more uniform structure, as revealed by scanning electron microscopy and in situ metal layer resistance measurement. This increased uniformity is an additional reason for the barrier height improvement. In contrast, the diodes formed at room temperature exhibit poorer performance due to an unpassivated surface and non-uniform metal coverage on a microscopic level.

• The Korean Journal of Ceramics
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• v.5 no.4
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• pp.395-399
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• 1999

MgO/metal nanocomposite powder mixtures were prepared by solution chemical processes to obtain suitable structure for ceramic/metal nanocomposites. Nickel or cobalt nitrate, as a source of metal dispersion, was dissolved into alcohol and mixed with magnesia powder. After calcined in air, these powders were reduced by hydrogen. Densified nanocomposites were successively obtained by Pulse Electric Current Sintering (PECS) process. The dispersed metal partical size depended on temperature and time in calcination and reduction processes. The phase analyses in the synthesized powders as a functioni of temperature were tracked using a dynamic high temperature X-ray diffractioni (HTXRD) system. Phase and crystallite size analyses were done using X-ray diffractioni and TEM. The MgO/metal nanocomposites were successfully fabricated, and ferromagnetic responses with enhanced coercive force were also investigated for these composites.

• Journal of Environmental Science International
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• v.5 no.2
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• pp.195-201
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• 1996

This study was conducted for the efficient utilization of a scoria, which is abundantly found in Cheju island, as adsorbent and the scoria was examined for its performance in clarification of adsorption of heavy metal ions. The order in heavy metal ions adsorbed on scoria was; Pb+>Cd^{2+}$>Cu^{2+}$>Ag^+$>Co^{2+}$>Zn^{2+}$>Cr^{3+}$>Cr^{6+}$. This tendency was relatively consistent with the decreasing order of radius of hydrated metal ion. Also, the smaller scoria size and the larger amounts of scoria showed higher removal efficiency for heavy metal ions. The same scoria size showed more effective removal efficiency for heavy metal ions at lower initial concentration than at higher initial concentration. The adsorption abilities of original scoria and chemically treated scoria were compared. Adsorption isotherm of scoria was generally obeyed to Freundlich formula than langmuir formula and Freundlich constant, than was obtained in the range of 0.2~0.4.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.225-228
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• 2002

The adhesion effect between the oxide layer and the metal layer has been studied by RTP anneal. Two types of oxides, BPSG and P-TEOS, were used as a bottom layer under multi-layered metal film. We observe the interface between oxide and metal layer using SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy). Adhesion failure was occurred by interfacial reaction between the BPSG oxide and the multi-layered metal film at 650"C RTP anneal. The phosphorus rich layer was observed at interface between BPSG oxide and metal layer by AES and TEM measurements. On the other hand adhesion was a)ways good in the sample used P-TEOS oxide as a bottom layer. We have known that adhesion between BPSG and multi-layered metal film was improved when the sample was annealed below $650^{\circ}C$.TEX>.

• Journal of Korea Foundry Society
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• v.16 no.6
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• pp.523-536
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• 1996

This paper relates to fabrication processing analysis of metal matrix composites by the injection of liquid metal into a fibrous preforms. One dimensional heat transfer analysis during squeeze infiltration process of aluminum base composites has been studied. An analysis method was investigated for the temperature distribution, infiltration velocity and melt infiltration characteristics with the commercial preform with short fiber array. When molten metal is infiltrated in a fibrous preform with random orientation, phase transformation will be occurred in a region such as molten metal, solidified region, preform region and infiltration composites region. a mathematical modelling for a solidification phenomena in fabrication process of metal matrix composites using a squeeze infiltration technique was investigated by the basic relations for liquid metal into a fibrous preform. The temperature distribution of theoretical results was compared with experimental data.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.151-161
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• 1994

FCAW has wide application in ship fabrication, maintenance and field erection. It has many advantages over SMAW.SAW and GMAW process. In many applications, the FCAW provides highquality weld metal. This method can reduce weld defects especially porosity and spatter. But the fatigue characteristics of those deposited metal have been rarely investigated. The purpose of this study is to investigate the cyclic stress-strain behavior and fatigue tests by the constant strain control were carried out on the rounded smooth specimen with deposited metal using the metal type flux cored wire. As the results of this study for the deposited metal welded by the metal type flux cored wire, the hardening or softening characteristics under cyclic load were investigated and cyclic stress-strain curve, strain-fatigue life curve, stress-strain function and fatigue life relation which are useful to estimate the fatigue life under the stress concentration condition were obtained.

• Journal of Welding and Joining
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• v.22 no.2
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• pp.46-50
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• 2004

In today's highly competitive marketplace, it is of great significance for the manufacturing industry to reduce lead-time and costs fur the product development. Since first emerged in 1986, Rapid Prototyping (RP) technology has helped successfully to reduce time and costs. Recently, RP using functional materials such as metal has been researched. However RP using the molten metal has been struggling to resolve several drawbacks, such as dimensional inaccuracy, poor surface finish, post finishing, etc., that originate primarily from the overall deposition of molten metal for each layer. So, the purpose of this study is to develop a new RP technique using sheet metal and projection welding for reducing several drawbacks in occurring RP using molten metal. Also tensile and bending specimens were made by the developed RP process using projection welding and were verified.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.352-354
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• 1995

The optical and electrical properties of High Speed AlGaAs infrared LED by using metal wet etch process instead of metal lift-off process are investigated. The power out increases when metal contact is patterned by wet etch process. Forward voltage and Reverse voltage for metal wet etch process represent higher value than the metal lift-off process. The aging effect of power out also indicates good results with wet etch process. The wet etch process for metal contact reveals reliable LED device properties.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.2
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• pp.239-244
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• 2008

In order to improve cost and efficacy of AC PDP with metal discharge electrodes, a new II-type metal electrodes are suggested. The suggested asymmetrical II-type metal electrode is improved in the luminance, power and efficacy than the conventional metal electrode by 7.5%, 6%, and 14%, respectively. The efficacy of the suggested asymmetrical II-type metal electrode is almost the same with the conventional ITO electrode. Moreover, the address time of the II-type metal electrode is shorter than the conventional ITO electrode.

• Korea-Australia Rheology Journal
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• v.14 no.2
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• pp.71-76
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• 2002

Metal thin films, which are indispensable constituents of ULSI (Ultra Large Scale Integration) circuits, have been fabricated by physical or chemical methods. However, these methods have a drawback of using expensive high vacuum instruments. In this work, the fabrication of tungsten metal film by spin coating was investigated. First of all, inorganic peroxopolytungstic acid (W-IPA) powder, which is soluble in water, was prepared by dissolving metal tungsten in hydrogen peroxide and by evaporating residual solvent. Then, the solution of W-IPA was mixed with organic solvent, which was spin-coated on wafers. And then, tungsten metal films, were obtained after reduction procedure. By selecting an appropriate organic solvent and irradiating UV, the sheet resistance of the tungsten metal film could be remarkably reduced.