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Preparation of tungsten metal film by spin coating method  

Lee, Kwan-Young (Department of Chemical and Biological Engineering Applied Rheology Center, Korea University)
Kim, Hak-Ju (Department of Chemical and Biological Engineering Applied Rheology Center, Korea University)
Lee, Jung-Ho (Samsung Electronics)
Sohn, Il-Hyun (Samsung Electronics)
Hwang, Tae-Jin (Samsung Electronics)
Publication Information
Korea-Australia Rheology Journal / v.14, no.2, 2002 , pp. 71-76 More about this Journal
Abstract
Metal thin films, which are indispensable constituents of ULSI (Ultra Large Scale Integration) circuits, have been fabricated by physical or chemical methods. However, these methods have a drawback of using expensive high vacuum instruments. In this work, the fabrication of tungsten metal film by spin coating was investigated. First of all, inorganic peroxopolytungstic acid (W-IPA) powder, which is soluble in water, was prepared by dissolving metal tungsten in hydrogen peroxide and by evaporating residual solvent. Then, the solution of W-IPA was mixed with organic solvent, which was spin-coated on wafers. And then, tungsten metal films, were obtained after reduction procedure. By selecting an appropriate organic solvent and irradiating UV, the sheet resistance of the tungsten metal film could be remarkably reduced.
Keywords
spin coating; tungsten; metal film; sheet resistance; isopolyacid; reduction; hydrogen peroxide;
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Times Cited By Web Of Science : 7  (Related Records In Web of Science)
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