• Journal of Powder Materials
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• v.6 no.4
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• pp.277-285
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• 1999

Mechanical properties of nanocrystalline Al-5at.%Ti alloy were investigated through high temperature compression test. Al-5at.%Ti nanocrystalline metal powders, which had finer and more equiaxed shape than those produced at room temperature, were produced by mechanical alloying at low temperature. The powders were successfully consolidated to 99fo of theoretical density by vacuum hot pressing. XRD and TEM analysis revealed that $Al_3Ti$ intermetallic compounds formed inside powders and pure Al region with coarse grains formed between powders, especially at triple junction. Mechanical properties in terms of hardness and strength were improved by grain size refinement, but ductility decreased presumably due to the formation of the weak interfaces between Al pool and powders.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.256-258
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• 2003

Hot-rolled and Extruded plates of AZ type magnesium alloys were successfully joined by friction stir welding(FSW). AZ31B-H24 and AZ61 plates with the thickness of 4mm were used, and the microstructural development in the stir zone were investigated using optical and scanning electron microscopes. The grain size of base metal and stir zone were investigated using the line-intersecter method. Hardness of the stir zone was remarkably increased due to very fine recrystallized grain structure both in AZ3l and AZ6l alloys. Tensile strengths of the FS welded Mg alloys AZ31 and AZ61 were strongly affected by formation of the intermetallic compounds, ${\beta}$-Al$\sub$12/Mg$\sub$17/.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.189-191
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• 2005

Dissimilar joining of AI 6013-T4 alloys and austenite stainless steel was carried out using friction stir welding technique. Microstructures near the weld zone and mechanical properties of the joint have been investigated. Microstructures in the stainless steel side and AI alloy were depended on the thermo-mechanical condition which they received. TEM micrographs revealed that the interface region was composed of the mixed layers of elongated stainless steel and ultra-fine grained AI alloy and intermetallic compound layer which was identified as the $Al_{4}Fe$ with hexagonal close packed structure. Mechanical properties were lower than those of 6013 AI alloy base metal, because tool inserting location was deviated to AI alloy from the butt line, which resulted in the lack of the stirring.

• Journal of Welding and Joining
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• v.33 no.1
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• pp.7-13
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• 2015

Magnetic pulse welding(MPW) is a solid state welding process that is accomplished by a magnetic pulse causing a high-velocity impact on two materials, resulting in a true metallurgical bond. One of the great advantages of MPW is that it is suitable for joining dissimilar metals. No heat affected zones are created because of the negligible heating and the clean surfaces formation that is a consequence of the jet and the metal is not degraded. Also, compared to other general welding processes, this process leads to only a low formation of brittle intermetallic compounds However, although this process has many advantages its application to industrial fields has so far been very low. Therefore, in this study we are presenting the principles, apparatus and application of MPW for application the industrial fields.

• Journal of Biomedical Engineering Research
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• v.20 no.4
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• pp.443-449
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• 1999

현재 시판되고 있는 치과용 76.5%Pd-11.6%Cu-7.2^%GarP 합금의 주조상태 및 임상열처리에 따른 미세조직의 변화를 X-선 회절기, 광학현미경, 시차열분석기를 이용하여 관찰하였다. 주조상태, 탈개스 및 세리믹소성처리 후 미세조직은 Pd고용체와 금속간화합물 Pd2Ga으로 구성되어 나타났고, 이들 상들은 열처리에 따라 상당한 변화를 보였다. 또한 Pd은 아르곤 분위기 내의 산소와 반응하여 산화물 형성 및 분해로 인해 질량변화곡선(TG)이 변하였고, 시차열분석(DTA)에서는 약 815$^{\circ}C$ 정도에서 Pd2Ga에 기인하는 흡열피크를 확인하였다. 이러한 실험의 결과들은 Cu가 이원계 Pd-Ga 합금의 Ga의 고용량을 낮추어 공정반응이 저 Ga 쪽으로 이동하기 때문인 것으로 설명하였다. 그러나 앞으로 보다 명확한 상변태 규명을 위해서 TEM등의 분석장비를 사용하여 체계적인 연구가 요구된다.

• Journal of the Korean institute of surface engineering
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• v.13 no.2
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• pp.81-86
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• 1980

The mechanical properties of aluminized steel were investigated after the JIS SB 41 plates were dipped in molten aluminum bath. (1) The growth rate of iron-aluminum alloy layer was fast in early stage of alumizing, and then gradually decreased with increasing time. However, over the time period above 10 minutes the growth of alloy layer did not occur. (2) The constituent of alloy layer formed on the steel surface was identified to be intermetallic compound of $Fe_2\;Al_5$. (3) The ultimate tensile strength and elongation of aluminized steel showed a nearly constant value over all thickness below about 0.15 mm. However, both properties decreased rapidly in showed a nearly constant value over all thickness above about 0.20 mm. (4) In case of aluminized steel with greater thickness, crack was formed below yield point of base metal, which is considered to be attributed to the alloy layer failure.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.7-13
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• 2019

Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.597-598
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• 2006

Gas filtration at high temperature from industrial processes offers various advantages such as increasing process efficiency, improving heat recovery and materials resource recovery, etc. At the same time, it is an advanced environment protection technology. This paper describes a newly developed metallic filter element. The manufacturing process of sintered $Fe_3Al$ metallic powder and the mechanical and filtration characteristics of this filter element were investigated. In this work, the phase constituent changes of the $Fe_3Al$ powder during sintering were studied. The newly developed filter elements were found to have excellent corrosion resistance, good thermal resistance, high strength and high filtration efficiency.

• Journal of Welding and Joining
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• v.22 no.3
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• pp.56-61
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• 2004

Friction stir weldability of AZ31B Mg alloy was studied using microstructural observation and mechanical tests. Defect free joints was obtained under the condition of 2000rpm-100mm/min. In TMAZ, a lot of twin deformation were observed due to the mechanical effect of the FSW tool and thus relatively high hardness was obtained. In SZ, the twin deformation was disappeared by recovery and the hardness decreased because the. grain structure was coarsened by dynamic recrystallization and grain growth. The Al-Mn precipitates were observed throughout the joint regions. On the other hand, $$\beta$-Mg_{17}Al_{12}$ intermetallic compounds were not observed in either of the zone. The joint efficiency was about 80% and the impact value of the joint was almost equal to that of base metal.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.91-96
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• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.