• Journal of Sensor Science and Technology
• /
• v.19 no.4
• /
• pp.259-270
• /
• 2010

MEMS(micro electro mechanical systems) is a technology for the manufacture hyperfine structure, as a micro-sensor and a driving device, by a variety of materials such as silicon and polymer. Many study for utilizing the MEMS applications have been performed in variety of fields, such as light devices, high frequency equipments, bio-technology, energy applications and other applications. Especially, the field of Bio-MEMS related with bio-technology is very attractive, because it have the potential technology for the miniaturization of the medical diagnosis system. Bio-MEMS, the compound word formed from the words 'Bio-technology' and 'MEMS', is hyperfine devices to analyze biological signals in vitro or in vivo. It is extending the range of its application area, by combination with nano-technology(NT), Information Technology(IT). The LOC(lab-on-a-chip) in Bio-MEMS, the comprehensive measurement system combined with Micro fluidic systems, bio-sensors and bio-materials, is the representative technology for the miniaturization of the medical diagnosis system. Therefore, many researchers around the world are performing research on this area. In this paper, the application, development and market trends of Bio-MEMS are investigated.

• Proceedings of the KIEE Conference
• /
• 2001.07c
• /
• pp.1896-1898
• /
• 2001

An offset problem caused by the static parasitic capacitors is analyzed and then some techniques to reduce their effect on the capacitive position sensor are presented. Also new offset compensation technique is proposed that by adjusting the magnitudes of the modulating signals independently, the charge imbalance between electrodes caused by the parasitic capacitors is eliminated without sensor gain variation. Simulation results are given to validate the proposed compensation technique.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.42 no.11
• /
• pp.1-8
• /
• 2005

In this paper, we present design and prototyping of a low-cost, integrated multi-functional micro health sensor chip that can be used or embedded in widely consumer devices, such as cell phone and PDA, for monitoring environmental condition including air pressure, temperature and humidity. This research's scope includes basic individual sensor study, architecture for integrating sensors on a chip, fabrication process compatibility and test/evaluation of prototype sensors. The results show that the integrated TPH sensor has good characteristics of ${\pm}\;1\%FS$ of linearity and hysteresis for pressure sensor and temperature sensor and of ${\pm}\;5\%FS$ of linearity and hysteresis But if we use 3rd order approximation for humidity sensor, full scale error becomes much smaller and this will be one of our future study.

• Journal of Mechanical Science and Technology
• /
• v.20 no.4
• /
• pp.505-512
• /
• 2006

This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.23 no.11
• /
• pp.1364-1370
• /
• 2019

Tilt sensors are mainly used to measure the collapse of structures such as buildings, bridges and tunnels. Recently, due to the ease of use and low price, many tilt sensors using MEMS sensors have been used, but the measurement angle range is limited, and thus, they do not have high precision for 360 degree. This is due to the inherent offset and scale errors of MEMS sensors. In this paper, we proposed an algorithm for the calculation of precision angles to reduce the mechanical error of MEMS sensors, and produced a MEMS sensor module and a transmission module to compare the angle accuracy of sensor modules before calibration and the angle measurement accuracy after calibration. Experimental results show that the proposed technique has a precision of ± 0.015 degrees for all 360-degree.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.05a
• /
• pp.497-502
• /
• 2002

This paper describes a design methodology of a tri-axial silicon-based farce sensor with square membrane by using micromachining technology (MEMS). The sensor has a maximum farce range of 5 N and a minimum force range of 0.1N in the three-axis directions. A simple beam theory was adopted to design the shape of the micro-force sensor. Also the optimal positions of piezoresistors were determined by the strain distribution obtained from the commercial finite element analysis program, ANSYS. The Wheatstone bridge circuits were designed to consider the sensitivity of the force sensor and its temperature compensation. Finally the process for microfabrication was designed using micromachining technology.

• Journal of Korean Association for Spatial Structures
• /
• v.18 no.4
• /
• pp.49-59
• /
• 2018

Wireless sensors are more favorable in measuring structural response compared to conventional sensors. This is because they are easier to use with no issues with cables and are considerably cheaper. There are several applications that can be used in recording and analyzing data from MEMS sensor installed on an iPhone. The Vibration App is one of the applications used and there has not been adequate research conducted in analyzing the performance of this App. This paper analyzed the performance of the Vibration App by comparing it with the performance of an ICP sensor. Results show that natural frequency results are more accurate (error less than 5%) in comparison to the amplitude results. This means that built- in MEMS sensor in smartphones are good at estimating natural frequency of structures. In addition, it was seen that the results became more accurate at higher frequencies (5.0Hz and 10.0Hz).

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.56 no.8
• /
• pp.1461-1465
• /
• 2007

A micromachined sensor part for an infrared focal plane array has been designed and fabricated. Amorphous silicon was adapted as a sensing material, and silicon nitride was used as a membrane material. To get a good efficiency of infrared absorption, the sensor was made as a ${\lambda}/4$ cavity structure. All the processes were done in $0.5\;{\mu}m$ iMEMS fab. in the Electronics and Telecommunication Research Institute (ETRI). The processed MEMS sensor structure had a small membrane deflection less than $0.3\;{\mu}m$. This excellent deflection property can be attributed to the rigorous balancing of the stresses of individual layers. The efficiency of infrared absorption was more than 75% in the wavelength range $8\;-\;14\;{\mu}m$.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2007.05a
• /
• pp.448-452
• /
• 2007

Many industrial operations require continuous or nearly-continuous operation of machines, which if interrupted can result in significant financial loss. The condition monitoring of these machines has received considerable attention recent years. Rapid developments in semiconductor, computing, and communication with a remote site have led to a new generation of sensor called "smart" sensors which are capable of wireless communication with a remote site. The purpose of this research is the development of smart sensor using which can on-line perform condition monitoring. This system is addressed to detect conditions that may lead to equipment failure when it is running. Moreover it will reduce condition monitoring expense using low cost MEMS accelerometer. This sensor can receive data in real-time or periodic time from MEMS accelerometer. Furthermore, this system is capable for signal preprocessing task (High Pass Filter, Low Pass Filter and Gain Amplifier) and analog to digital converter (A/D) which is controlled by CPU. A/D converter that converts 10bit digital data is used. This sensor communicates with a remote site PC using TCP/IP protocols. Wireless LAN contain IEEE 802.11i-PSK or WPA (PSK, TKIP) encryption. Developed sensor executes performance tests for data acquisition accuracy estimations.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.4
• /
• pp.9-17
• /
• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.