• Journal of Radiation Industry
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• v.7 no.1
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• pp.23-28
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• 2013

In this study, we fabricated high density polyethylene (HDPE) composites filled with antioxidants and UV stabilizers. The electron beam irradiation on the fabricated composites was carried out over a range of absorbed doses from 50 to 200 kGy to confirm the changes of discoloration. The changes of discoloration were characterized using a color difference meter and FT-IR for confirming the changes of the color difference and structural change. It was observed that the color difference of IRGANOX 1010-, IRGAFOS 168-, and TINUVIN 328- added HDPE was higher than that of the control HDPE by electron beam irradiation. The melting temperature of UV stabilizer-added HDPE was not significantly changed by electron beam irradiation. However, the melting temperature of phenol-containing antioxidant-added HDPE was increased with increasing the absorbed dose. And the melting temperature of phosphorus-containing antioxidant-added composite was decreased with increasing the absorbed dose.

• Journal of the Korean Society for Heat Treatment
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• v.11 no.2
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• pp.75-81
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• 1998

The effect of thermomechanical treatment on thermal expantion and melting point of Fe-30%Ni-0.35%C alloy was investigated. The dimention changes of the ausformed martensite and the marformed martensite were decreased with increasing deformation degree in the range of $25{\sim}350^{\circ}C$ prior to reverse transformation but became larger in the range of $500{\sim}800^{\circ}C$ after the reverse transformation. The dimension change and the thermal expansion coefficient were reduced in the order of the deformed austenite, the marformed martensite and the ausformed martensite in the range of $25{\sim}800^{\circ}C$. Therefore, the ausforming treatment is more effective than the marforming treatment in improving the heat-resistance. The melting points of the deformed austenite, the ausformed martensite and the marformed martensite were lowered as either the heating rate or the degree of deformation was increased.

• Journal of the Korean Ceramic Society
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• v.16 no.2
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• pp.83-88
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• 1979

The Anorthite is useful compound for some ceramic industries but it is difficult to produce Anorthite because of its high melting point (1553$^{\circ}C$) and narrow firing range. On this study, glass frit was added to Anorthite batch composition to widen firing range and lower melting point. After mixing a glass frit $(Na_2O-CaO-6SiO_2)$ with Anorthite, it was melted and quenched. Ratio of Anorthite vs. glass frit was 9 : 1, 8.5 : 1.5, 8 : 2, 7.5 : 2.5, 7 : 3. In those batch composition added amount of $No_2O$ were between 1.3wt.% and 3.9wt.%. To find the thermal change of the quenched, D.T.A. was surveyed. The quenched were fired at various vitrification temperature and detected by X-Raydiffraction analysis. With addition of glass frit, firing range and vitrification temperature of Anorthite was 100~15$0^{\circ}C$ and 1050~115$0^{\circ}C$ respectively. Optimum amount of glass frit was 20wt.% for the upper mentioned.

• Journal of the Korean institute of surface engineering
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• v.41 no.3
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• pp.94-101
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• 2008

A new convenient magnet array module is designed to investigate effects of magnetic field array on magnetron discharge characteristics. Magnetic field analysis showed good agreement of measured discharge region by a CCD device which has a high quantum efficiency over visible wavelength range. OES (optical emission spectroscopy) showed major emission peaks are from electronic transitions in 400 nm range and 800 nm range. Effects of driving voltage characteristics were analyzed in a point of electron drift trajectories and ionizing collision frequencies. Pulsed dc with a fast rising and falling time was analyzed to have potential to increase ionization collisions by putting a burst of hot electrons and to raise sheath potential. From measured voltage and current waveform, maximum of -1000 V peak was generated with $-400\;V_{rms}$ conditions. Possibility of a properly designed magnetron cathode was shown to be used as a melting device. Cu was successfully melted with power density of a several tens of $W/cm^2$.

• Journal of Welding and Joining
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• v.16 no.3
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• pp.157-166
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• 1998

Recently as environmental pollution caused by Pb has posed a serious threat to the global environment, the trend to regulate the usage of Pb in electronic industry is one the rise. Currently, the solder alloy with high Pb content, Sn-37%Pb, is utilized in the electronic assembly therefore, the objective of this study is to develop an alternative solder alloy for the existing Sn-37%Pb solder alloy. First thing, this work choosed Sn-5%Pb-1.5%Ag, Sn-5%Pb-1.5%Ag-x%Bi(x=1~5%) for candidate solder alloys, and examined their properties such as melting range, wettability, microhardness, tensile property, oxidation behavior and microstructure. Wettability was on the same level of Sn-37%Pb. Dissolution of Pb ion in Sn-5%Pb solder was 0.46ppm. This solder alloy revealed cellular dendrite microstructure $\beta$-Sn matrix, Pb-rich phase, Ag/Sn, and Cu/Sn Intermetallic compounds. The range of solidification temperature was within 3$0^{\circ}C$. Also these alloy displayed higher tensile strength and lower elongation than Sn-37%Pb. The resistance of oxidation in Sn-5%Pb-1.5%Ag solder alloy was superior to that of Sn-37%Pb solder alloy. But that of Sn-5%Pb-1.5%Ag-5%Bi solder alloy was equal to that of Sn-37%Pb solder alloy.

• Journal of Food Hygiene and Safety
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• v.20 no.3
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• pp.134-140
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• 2005

Boiling point and distillation range, melting range, and identification methods in general test method of Korea, Japan, Joint FAO/WHO Expert Committee of Food Additives (JECFA), and USA on chemical food additives were compared. Boiling point of propylene glycol was indicated as boiling point in Korea, distillate in Japan, distillation range in JECFA and USA, and its value was up to the standard. Distillation range of propionic acid was indicated as distillate in Korea and Japan, distillation range in JECFA and USA, and its value was up to the standard. There is no standard on distillation range of isopropyl alcohol in Japanese method. Test method of melting range on synthetic food additives was identical in all organizations, and there are 28 items to which this test method applies in Korean Food Additives Code. The standards on molting range of D-mannitol were different in various organizations, and in USA method there are no standards to which L-ascorbic acid, calciferol, and fumaric acid apply. Synthetic food additives performing the identification test were 251 items in Korean Food Additives Code, but there are no items to which manganese, glycerophosphate, bromate, thiosulfate, and bromide apply. Calcium benzoate was dissolved by heating in benzoate test and we could not identify the citrate in ferric citrate by method (2) of Korea and Japan. Identification test methods for ammonium, lactate, magnesium, copper, sulfate, phosphate, and zinc were identical in all organizations, and these could be identifed by current identification methods.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.8 no.3
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• pp.437-450
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• 1996

A set of stability equations is formulated for natural convection flows adjacent to a vertical isothermal surface melting in cold pure water. It takes account of the nonparallelism of the base flows. The melting rate is regarded as a blowing velocity at the ice surface. The numerical solutions of the linear stability equations which constitute a two-point boundary value problem are accurately obtained for various values of the density extremum parameter $R=(T_m-T_{\infty})/(T_0-T_{\infty})$ in the range $0.3{\leq}R{\leq}0.6$, by using a computer code COLNEW. The blowing effects on the base flow becomes more significant as ambient temperature ($T_{\infty}$) increases to $T_{\infty}=10^{\circ}C$. The maximum decrease of heat transfer rate is about 6.4 percent. The stability results show that the melting at surface causes the critical Grashof number $G^*$ and the maximum frequency of disturbances to decrease. In comparision with the results for the conventional parallel flow model, the nonparallel flow model has a higher critical Grashof number but has lower amplification rates of disturbances than does the parallel flow model. The spatial amplification contours exhibit that the selective frequency $B_0$ of the nonparallel flow model is higher than that of the parallel flow model and that the effects of melting are rather small. The present study also indicates that the selective frequency $B_0$ can be easily predicted by the value of the frequency parameter $B^*$ at $G^*$, which comes from the neutral stability results of the nonparallel flow model.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.598-603
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• 2005

To develope new lead-free solders with the melting temperature close to that of Sn-37Pb$(183^{\circ}C)$, Sn-0.7Cu-5Pb-1Ga, Sn-0.7Cu-5Pb-1Ag, Sn-0.7Cu-5Pb-5Bi-1Ag, and Sn-0.7Cu-SBi-1Ag alloys were composed by adding low-netting elements such as Ga, Bi, Pb, and Ag to Sn-0.7Cu. Then the melting temperatures, microstructures, wettability, and adhesion properties of these alloys were evaluated. DSC analysis showed that the melting temperature of Sn-0.7Cu-SPb-1Ga was $211^{\circ}C$, and those of other alloys was in the range of $192\~200^{\circ}C$. Microstructures of these alloys after heat-treatment at $150^{\circ}C$ for 24 hrs were basically composed of coarsely- grown $\beta-Sn$ grains, and $Cu_6Sn_5$ and $Ag_3Sn$ intermetallic precipitates. Sn-0.7Cu-5Pb-1Ga and Sn-0.7Cu-5Pb-5Bi-1Ag showed excellent wettability, while Sn-0.7Cu-5Bi-1Ag and Sn-0.7Cu-5Pb-5Bi-1Ag revealed good adhesion strength with the Cu substrates. Among 4 alloys, Sn-0.7Cu-5Pb-5Bi-1Ag with the lowest melting temperature $(192^{\circ}C)$ and relatively excellent wettability and adhesion strength was suggested to be the best candidate solder to replace Sn-37Pb.

• Korean Journal of Metals and Materials
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• v.50 no.2
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• pp.107-115
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• 2012

Direct laser melting (DLM) is a powder-based additive manufacturing process to produce parts by layer-by-layer laser melting. As the properties of the manufactured parts depend strongly on the deposited laser-melted bead, deposited layers obtained by the DLM process were characterized in this study. This investigation used a 200 W fiber laser to produce single-line beads under a variety of different energy distributions. In order to obtain a feasible range for the two main process parameters (i.e. laser power and scan rate), bead shapes of single track deposition were intensively investigated. The effects of the processing parameters, such as powder layer thickness and scan spacing, on geometries of the deposited layers have also been analyzed. As a result, minimum energy criteria that can achieve a complete melting have been suggested at the given powder layer thickness. The surface roughnesses of the deposited beads were strongly dependent on the overlap ratio of adjacent beads and on the energy distributions of laser power. Through microstructural analysis and hardness measurement, the morphological and mechanical properties of the deposited layers at various overlapped beads have also been characterized.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.168-170
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• 2007

Sn-Bi eutectic solder alloy have is good wetting and physical properties. The results of solder paste properties test, melting point is about $139^{\circ}C$ and spread test is represent spread properties of $7{\sim}16%$. The results of shear strength after as reflowed, thermal shock test, high temperature storage test of 500hr and 1000hr at $100^{\circ}C$. The shear strength value range is from 6000 to 11000gf, pull strength value range is from 2200 to 3300gf.