• 방사선산업학회지
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• 제7권1호
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• pp.23-28
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• 2013

In this study, we fabricated high density polyethylene (HDPE) composites filled with antioxidants and UV stabilizers. The electron beam irradiation on the fabricated composites was carried out over a range of absorbed doses from 50 to 200 kGy to confirm the changes of discoloration. The changes of discoloration were characterized using a color difference meter and FT-IR for confirming the changes of the color difference and structural change. It was observed that the color difference of IRGANOX 1010-, IRGAFOS 168-, and TINUVIN 328- added HDPE was higher than that of the control HDPE by electron beam irradiation. The melting temperature of UV stabilizer-added HDPE was not significantly changed by electron beam irradiation. However, the melting temperature of phenol-containing antioxidant-added HDPE was increased with increasing the absorbed dose. And the melting temperature of phosphorus-containing antioxidant-added composite was decreased with increasing the absorbed dose.

• 열처리공학회지
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• 제11권2호
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• pp.75-81
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• 1998

The effect of thermomechanical treatment on thermal expantion and melting point of Fe-30%Ni-0.35%C alloy was investigated. The dimention changes of the ausformed martensite and the marformed martensite were decreased with increasing deformation degree in the range of $25{\sim}350^{\circ}C$ prior to reverse transformation but became larger in the range of $500{\sim}800^{\circ}C$ after the reverse transformation. The dimension change and the thermal expansion coefficient were reduced in the order of the deformed austenite, the marformed martensite and the ausformed martensite in the range of $25{\sim}800^{\circ}C$. Therefore, the ausforming treatment is more effective than the marforming treatment in improving the heat-resistance. The melting points of the deformed austenite, the ausformed martensite and the marformed martensite were lowered as either the heating rate or the degree of deformation was increased.

• 한국세라믹학회지
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• 제16권2호
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• pp.83-88
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• 1979

The Anorthite is useful compound for some ceramic industries but it is difficult to produce Anorthite because of its high melting point (1553$^{\circ}C$) and narrow firing range. On this study, glass frit was added to Anorthite batch composition to widen firing range and lower melting point. After mixing a glass frit $(Na_2O-CaO-6SiO_2)$ with Anorthite, it was melted and quenched. Ratio of Anorthite vs. glass frit was 9 : 1, 8.5 : 1.5, 8 : 2, 7.5 : 2.5, 7 : 3. In those batch composition added amount of $No_2O$ were between 1.3wt.% and 3.9wt.%. To find the thermal change of the quenched, D.T.A. was surveyed. The quenched were fired at various vitrification temperature and detected by X-Raydiffraction analysis. With addition of glass frit, firing range and vitrification temperature of Anorthite was 100~15$0^{\circ}C$ and 1050~115$0^{\circ}C$ respectively. Optimum amount of glass frit was 20wt.% for the upper mentioned.

• 한국표면공학회지
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• 제41권3호
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• pp.94-101
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• 2008

A new convenient magnet array module is designed to investigate effects of magnetic field array on magnetron discharge characteristics. Magnetic field analysis showed good agreement of measured discharge region by a CCD device which has a high quantum efficiency over visible wavelength range. OES (optical emission spectroscopy) showed major emission peaks are from electronic transitions in 400 nm range and 800 nm range. Effects of driving voltage characteristics were analyzed in a point of electron drift trajectories and ionizing collision frequencies. Pulsed dc with a fast rising and falling time was analyzed to have potential to increase ionization collisions by putting a burst of hot electrons and to raise sheath potential. From measured voltage and current waveform, maximum of -1000 V peak was generated with $-400\;V_{rms}$ conditions. Possibility of a properly designed magnetron cathode was shown to be used as a melting device. Cu was successfully melted with power density of a several tens of $W/cm^2$.

• Journal of Welding and Joining
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• 제16권3호
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• pp.157-166
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• 1998

Recently as environmental pollution caused by Pb has posed a serious threat to the global environment, the trend to regulate the usage of Pb in electronic industry is one the rise. Currently, the solder alloy with high Pb content, Sn-37%Pb, is utilized in the electronic assembly therefore, the objective of this study is to develop an alternative solder alloy for the existing Sn-37%Pb solder alloy. First thing, this work choosed Sn-5%Pb-1.5%Ag, Sn-5%Pb-1.5%Ag-x%Bi(x=1~5%) for candidate solder alloys, and examined their properties such as melting range, wettability, microhardness, tensile property, oxidation behavior and microstructure. Wettability was on the same level of Sn-37%Pb. Dissolution of Pb ion in Sn-5%Pb solder was 0.46ppm. This solder alloy revealed cellular dendrite microstructure $\beta$-Sn matrix, Pb-rich phase, Ag/Sn, and Cu/Sn Intermetallic compounds. The range of solidification temperature was within 3$0^{\circ}C$. Also these alloy displayed higher tensile strength and lower elongation than Sn-37%Pb. The resistance of oxidation in Sn-5%Pb-1.5%Ag solder alloy was superior to that of Sn-37%Pb solder alloy. But that of Sn-5%Pb-1.5%Ag-5%Bi solder alloy was equal to that of Sn-37%Pb solder alloy.

• 한국식품위생안전성학회지
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• 제20권3호
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• pp.134-140
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• 2005

식품첨가물공전의 일반시험법 중 비점 및 유분측정법, 융점측정법 및 확인시험법에 대하여 국내에 유통되는 식품 첨가물을 대상으로 한국, 일본, JECFA및 미국의 시험법에 따라 비교?분석하였다. 한국의 식품첨가물공전에서 비점을 측정하는 품목은 프로필렌글리콜 1품목이었고, 이 품목에 대하여 한국방법에서는 비점으로, 일본방법은 유분으로, JECFA와 미국방법은 증류가 일어나는 온도로 표시하도록 되어 있었으며, 측정결과 규격에 적합하였다. 유분측정법은 한국과 일본방법에서는 유분으로, JECFA와 미국방법에서는 증류온도로 표시하였다. 프로피온산의 유분은 4 기관의 규격에 모두 적합하였으며, 일본방법에는 이소프로필알콜에 대한 규격기준이 없었다. 응점측정법은 4 기관의 방법이 동일하였으며, 한국 식품첨가물공전에서는 28품목이 해당되었다. D-Mannitol의 경우 기관마다 규격기준이 약간 달랐으며, 미국방법에서는 L-ascorbic acid, calciferol 및 fumaric acid에 대한 규격이 설정되어 있지 않았다. 한국 식품첨가물공전에서 확인시험을 하는 화학적합성품은 251품목이었으며, 과망간산염, 글리세로인산염, 브롬산염, 치오황산염 및 브롬화물 등 5항목에 해당하는 개별품목은 없었다. 안식향산염 시험에서 안식향산칼슘은 가열해야 녹았으며, 구연산철은 한국과 일본방법 (2)에서 모두 구연산염의 확인이 불가능하였다. 암모늄염, 젖산염, 마그네슘염, 제이동염, 황산염, 인산염 및 아연염 시험법은 4기관에 모두 동일하였으며, 현행 시험법에 의해 모두 확인이 가능하였다.

• 설비공학논문집
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• 제8권3호
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• pp.437-450
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• 1996

A set of stability equations is formulated for natural convection flows adjacent to a vertical isothermal surface melting in cold pure water. It takes account of the nonparallelism of the base flows. The melting rate is regarded as a blowing velocity at the ice surface. The numerical solutions of the linear stability equations which constitute a two-point boundary value problem are accurately obtained for various values of the density extremum parameter $R=(T_m-T_{\infty})/(T_0-T_{\infty})$ in the range $0.3{\leq}R{\leq}0.6$, by using a computer code COLNEW. The blowing effects on the base flow becomes more significant as ambient temperature ($T_{\infty}$) increases to $T_{\infty}=10^{\circ}C$. The maximum decrease of heat transfer rate is about 6.4 percent. The stability results show that the melting at surface causes the critical Grashof number $G^*$ and the maximum frequency of disturbances to decrease. In comparision with the results for the conventional parallel flow model, the nonparallel flow model has a higher critical Grashof number but has lower amplification rates of disturbances than does the parallel flow model. The spatial amplification contours exhibit that the selective frequency $B_0$ of the nonparallel flow model is higher than that of the parallel flow model and that the effects of melting are rather small. The present study also indicates that the selective frequency $B_0$ can be easily predicted by the value of the frequency parameter $B^*$ at $G^*$, which comes from the neutral stability results of the nonparallel flow model.

• 한국재료학회지
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• 제15권9호
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• pp.598-603
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• 2005

To develope new lead-free solders with the melting temperature close to that of Sn-37Pb$(183^{\circ}C)$, Sn-0.7Cu-5Pb-1Ga, Sn-0.7Cu-5Pb-1Ag, Sn-0.7Cu-5Pb-5Bi-1Ag, and Sn-0.7Cu-SBi-1Ag alloys were composed by adding low-netting elements such as Ga, Bi, Pb, and Ag to Sn-0.7Cu. Then the melting temperatures, microstructures, wettability, and adhesion properties of these alloys were evaluated. DSC analysis showed that the melting temperature of Sn-0.7Cu-SPb-1Ga was $211^{\circ}C$, and those of other alloys was in the range of $192\~200^{\circ}C$. Microstructures of these alloys after heat-treatment at $150^{\circ}C$ for 24 hrs were basically composed of coarsely- grown $\beta-Sn$ grains, and $Cu_6Sn_5$ and $Ag_3Sn$ intermetallic precipitates. Sn-0.7Cu-5Pb-1Ga and Sn-0.7Cu-5Pb-5Bi-1Ag showed excellent wettability, while Sn-0.7Cu-5Bi-1Ag and Sn-0.7Cu-5Pb-5Bi-1Ag revealed good adhesion strength with the Cu substrates. Among 4 alloys, Sn-0.7Cu-5Pb-5Bi-1Ag with the lowest melting temperature $(192^{\circ}C)$ and relatively excellent wettability and adhesion strength was suggested to be the best candidate solder to replace Sn-37Pb.

• 대한금속재료학회지
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• 제50권2호
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• pp.107-115
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• 2012

Direct laser melting (DLM) is a powder-based additive manufacturing process to produce parts by layer-by-layer laser melting. As the properties of the manufactured parts depend strongly on the deposited laser-melted bead, deposited layers obtained by the DLM process were characterized in this study. This investigation used a 200 W fiber laser to produce single-line beads under a variety of different energy distributions. In order to obtain a feasible range for the two main process parameters (i.e. laser power and scan rate), bead shapes of single track deposition were intensively investigated. The effects of the processing parameters, such as powder layer thickness and scan spacing, on geometries of the deposited layers have also been analyzed. As a result, minimum energy criteria that can achieve a complete melting have been suggested at the given powder layer thickness. The surface roughnesses of the deposited beads were strongly dependent on the overlap ratio of adjacent beads and on the energy distributions of laser power. Through microstructural analysis and hardness measurement, the morphological and mechanical properties of the deposited layers at various overlapped beads have also been characterized.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.168-170
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• 2007

Sn-Bi eutectic solder alloy have is good wetting and physical properties. The results of solder paste properties test, melting point is about $139^{\circ}C$ and spread test is represent spread properties of $7{\sim}16%$. The results of shear strength after as reflowed, thermal shock test, high temperature storage test of 500hr and 1000hr at $100^{\circ}C$. The shear strength value range is from 6000 to 11000gf, pull strength value range is from 2200 to 3300gf.