• Korean Journal of Materials Research
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• v.16 no.12
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• pp.731-738
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• 2006

It is seriously considered using Al CMP (chemical mechanical planarization) process for the next generation 45 nm Al wiring process. Al CMP is known that it has a possibility of reducing process time and steps comparing with conventional RIE (reactive ion etching) method. Also, it is more cost effective than Cu CMP and better electrical conductivity than W via process. In this study, we investigated 4 different kinds of slurries based on abrasives for reducing scratches which contributed to make defects in Al CMP. The abrasives used in this experiment were alumina, fumed silica, alkaline colloidal silica, and acidic colloidal silica. Al CMP process was conducted as functions of abrasive contents, $H_3PO_4$ contents and pressures to find out the optimized parameters and conditions. Al removal rates were slowed over 2 wt% of slurry contents in all types of slurries. The removal rates of alumina and fumed silica slurries were increased by phosphoric acid but acidic colloidal slurry was slightly increased at 2 vol% and soon decreased. The excessive addition of phosphoric acid affected the particle size distributions and increased scratches. Polishing pressure increased not only the removal rate but also the surface scratches. Acidic colloidal silica slurry showed the highest removal rate and the lowest roughness values among the 4 different slurry types.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.1
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• pp.103-109
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• 2021

Fine chips generated by machining have an impact on machine failure and quality of machined products, it is necessary to remove the chips, so the microchip collection and removal device by rotating conveyor belt with neodymium permanent magnets was developed. In this research, to solve the problem for reducing the existing microchips in the tank, a micro-chip removal device by rotating conveyor belt with neodymium permanent magnets developed. In the development of micro-chip removal device, 3D CATIA modeling was used, and the flow analysis and the electromagnetic force analysis were performed with COMSOL Multiphysics program. To evaluate the performance of the prototypes produced, design of experiments (DOE) is used to obtain the effect of neodymium conveyor movement speed on chip removal for the ANOVA analysis of recovered powders. An experiment was conducted to investigate the effect of the conveyor feed rate on the chip removal performance in detail. As a result of the experiment, it was confirmed that the slower the feeding speed of the fine chip removing device, the more efficient the chip removal.

• Journal of Korean Society on Water Environment
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• v.38 no.4
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• pp.171-176
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• 2022

Recently, an autotrophic single-stage nitrogen removal (ASSNR) process based on the anaerobic ammonium oxidation (ANAMMOX) reaction has been proven as an economical ammonia treatment. It is highly evident that double-layered gel beads are a promising alternative to the natural biofilm for ASSNR because of the high mechanical strength of poly(vinyl alcohol) (PVA)/alginate structure and efficient protection of ANAMMOX bacteria from dissolved oxygen (DO) due to the thick outer layer. However, the thick outer layer results in severe mass transport limitation and consequent lowered bacterial activity. Therefore, the effects of the thickness of the outer layer on the overall reaction rate were tested in the biofilm model using AQUASIM for ammonia-oxidizing bacteria (AOB), nitrite-oxidizing bacteria (NOB) and ANAMMOX bacteria. A thickness of 0.5~1.0 mm is preferred for the maximum total nitrogen (TN) removal. In addition, a DO of 0.5 mg/L resulted in the best total nitrogen removal. A higher DO induces NOB activity and consequent lower TN removal efficiency. The optimal density of AO B and NO B density was 1~10% for a 10% ANAMMOX bacterial in the double-layered PVA/alginate gel beads. The real effects of operating parameters of the thickness of the outer layer, DO and concentrations of biomass balance should be intensively investigated in the controlled experiments in batch and continuous modes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.1
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• pp.17-21
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• 2011

Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.5
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• pp.7-12
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• 2000

• Journal of Korean Society of Environmental Engineers
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• v.22 no.12
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• pp.2255-2261
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• 2000

To eliminate $NO_x$ in diesel emission. selective catalyst reduction (SCR) was used in real diesel engine. Among the SCR methods, metal oxide and perovskite catalysts were introduced in this paper. The removal efficiencies with various major, promoter catalysts on ${\gamma}-Al_2O_3$ at different reaction temperature were investigated, and $LaCuMnO_x$ catalyst which has high removal efficiency at the temperature of real diesel exhaust gas was selected. $NO_x$ reduction was carried out over these catalysts in the flow-through type reactor using by-pass ($SV=3,300h^{-1}$). Under the given condition to this study, perovskite catalysts showed considerably high removal efficiency and $LaCuMnO_x$ was the best one among these catalysts in the temperature range of $150{\sim}450^{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.193-194
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• 2012

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.7 s.178
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• pp.1787-1794
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• 2000

• Journal of Environmental Policy
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• v.9 no.2
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• pp.41-55
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• 2010

This paper analyzes optimal watershed management focusing on reservoir-level sediment removal techniques. Although dams and reservoirs provide several benefits, sedimentation may reduce their storage capacity. As of today, the Aswan High Dam (AHD) in Egypt faces approximately 76% reduced life of the reservoir. Since the AHD is the major fresh water source in Egypt, sustainable use of this resource is extremely important. A model is developed to simultaneously determine optimal sediment removal strategies for upstream soil conservation efforts and reservoir-level sediment control. Two sediment removal techniques are considered: mechanical dredging and hydro-suction sediment removal system (HSRS). Moreover, different levels of upstream soil conservation efforts have introduced to control soil erosion, which is a major contributor of reservoir storage capacity reduction. We compare a baseline case, which implies no management alternative, to non-cooperative and social planners' solution. Our empirical results indicate that the socially optimal sediment removal technique is a mechanical dredging with unconstrained amount with providing a sustainable life of the reservoir. From the empirical results, we find that social welfare can be as high as $151.01 billion, and is sensitive to interest rates and agricultural soil loss.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.5
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• pp.3298-3303
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• 2014

In order to recycle the waste bumper, techniques removing coated paint on a bumper is crucial. Chemical methods are known to be much more effective in removing the paint compared to physical methods. However, the chemical methods generally use toxic solvents and consequently cause environmental pollution. In this study, we tested a new method which combines the chemical and physical method to reduce the amount of solvent and increase the paint removal efficiency. We found that mechanical stirring increases the paint removal efficiency in soaking stage of solvent. When solid particles as a stress transfer media are incorporated into the solvent and high mechanical stirring is applied, the paint removal efficiency is very high. It was proved that the combined method can accomplish high level of the paint removal efficiency maintaining low amount of solvent consumed.