• 암석학회지
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• 제4권2호
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• pp.168-177
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• 1995

Crystal boundaries in igneous rocks are genetically classified in order to predict the geometric patterns of the boundaries which may aid deciphering the textural code in igneous rocks. Crystal boundaries may be formed by two end-member processes;(1) mechanical and (2) chemical removal of interstitial melt. Mechanical removal of the melt will form displacement impingement boundaries, while chemical removal of the melt will form growth impingement boundaries. The positions of boundaries relative to the material points may be affected by secondary processes such as (1) migration and (2) dissolution. The geometric features of crystal boundaries, suggested in this study, may be useful when studying igneous textures and processes, although it may be impossible to determine the suggested features with the analytical techniques currently avilable.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.93-96
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• 대한기계학회논문집B
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• 제24권8호
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• pp.1069-1076
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• 2000

As the environmental problems grow, the regulation of the pollutants emitted from power plants increases. Most of the pollutants in particle phase are removed by particle removal facilities, but fine particles between 0.1 micron and I micron in diameter have a low removal efficiency compared to particles in other size ranges. Therefore the present concern has concentrated on the removal of those fine particles. The purpose of this study is to grow fine particles by condensation to the range larger than I micron. Theoretically the general dynamic equation is solved with an assumption that the particle size follows a log-normal distribution to calculate the temporal behavior of the size distribution. Experiments have been carried out to compare the results with the theoretical predictions. Particles grown by condensation are sampled by impactors and observed with SEM photographs.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.206-209
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• 2002

The fixed abrasive pad(FAP) has been introduced in chemical mechanical polishing(CMP) field recently. In comparison with the general CMP which uses the slurry including abrasives, FAP takes advantage of planarity. resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of $Al_2$O$_3$-FAP using hydrophilic polymers with swelling characteristic in water and explains the self.texturing phenomenon. It also focuses on the chemical effects on tungsten film and the FAP is evaluated on the removal rate as a function of chemicals such as oxidizer, catalyst, and acid. The removal rate is achieved up to 1000A1min as about 70 percents of the general one. In the future. the research has a plan of the advanced FAP and chemicals in tungsten CMP considering micro-scratch, life-time, and within wafer non-uniformity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.555-556
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• 2007

Through the single head kinematics, sliding distance is a movement of a pad within wafer. The sliding distance is very important to frictional heat, material removal, and so on. A Temperature distribution is similar to sliding distance. But is not same. Because of complex process factor in CMP. A platen velocity is a dominant factor in a temperature and material removal. WIWNU is low in head faster condition.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.184-187
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) lyaer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2-CMP$ process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis or used slurry.

• 대한기계학회논문집B
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• 제29권4호
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• pp.435-440
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• 2005

In this paper, slurry fluid motion, abrasive particle motion, and roles of groove patterns on the pads are numerically investigated in the 2D and 3D geometries. The simulation results are analyzed in terms of experimental removal rate and WIWNU (Within Wafer Non-Uniformity) for ILD (Inter Level Dielectric) CMP process. Numerical investigations reveal that the grooves in the pad behave as uniform distributor of abrasive particles and enhance the removal rate by increasing shear stress. Higher removal rate and desirable uniformity are numerically and experimentally observed at the pad with grooves. Numerical analysis is very well matched with experimental results and helpful fur understanding polishing mechanism and local physics.

• Journal of Industrial and Engineering Chemistry
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• 제67권
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• pp.326-332
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• 2018

In this study,the result shows that polyvinyl alcohol-sodium alginate (PVA-SA) gel bead crosslinked with sodium sulfate are better among the different methods by comparing the relative mechanical strength, mechanical strength swelling and expansion coefficient of beads in water. Subsequently, anammox biomass entrapment by PVA-SA gel was introduced into continuous stirred tank reactor (CSTR). After 24 operation days, the nitrogen removal efficiency achieved 60%, while the nitrogen loading rate (NLR) was $0.14kgN/m^3/d$ and the experiment data indicated that PVA-SA gel bead crosslinked with sodium sulfate can be used to initiate anammox process. Furthermore, it is an alternative for culturing anammox in a long-term operation.

• Nuclear Engineering and Technology
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• 제52권10호
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• pp.2230-2237
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• 2020

Self-priming venturi scrubber is one of the most effective devices used to collect aerosols and soluble gas pollutants from gaseous stream during severe accident in a nuclear power plant. The present study focuses on investigation of dust particle removal efficiency of the venturi scrubber both experimentally and theoretically. Venturi scrubber captures the dust particles in tiny water droplets flowing into it. Inertial impaction is the main mechanism of particles collection in venturi scrubber. The water injected into venturi throat is in the form of jets through multiple holes present at venturi throat. In this study, aerosols removal efficiency of self-priming venturi scrubber was experimentally measured for different operating conditions. Alumina (Al₂O₃) particles with 0.4-㎛ diameter and 3950 kg/㎥ density were treated as aerosols. Removal efficiency was calculated for different gas flow rates i.e. 3-6 ㎥/h and liquid flow rates i.e. 0.009-0.025 ㎥/h. Experimental results depict that aerosols removal efficiency increases with the increase in throat velocity and liquid head. While at lower air flow rate of 3 ㎥/h, removal efficiency decreases with the increase in liquid head. A theoretical model of venturi scrubber was also employed and experimental results were compared with mathematical model. Experimental results are found to be in good agreement with theoretical results.