• Title/Summary/Keyword: Mechanical propert

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Bend Deformation Behavior of Silicon Carbide Reticulated Porous Ceramics

  • Zhu, Xinwen;Sakka, Yoshio;Tan, Shouhong;Jiang, Dongliang
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.608-609
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    • 2006
  • The deformation behavior under three-point bend test was found to depend on the loading uniformity and the macrostructure for SiC reticulated porous ceramics (RPCs). However, this dependence of loading uniformity is alleviated by improved macrostructure with fewer flaws and clogged pores. Even, this dependence becomes less important as the struts become thicker and stronger. The bend result of RPCs with highly uniform macrostructure is in excellent agreement with the GA (Gibson and Ashby) model, but the one with un-uniform macrostructure deviates from the GA model, suggesting that the macrostructure plays an important role in deformation behavior of RPCs under bend.

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A Characteristics of Zn-Al-Cu System Pb-free Solder Alloys for Ultra High Temperature Applications (초고온용 Zn-Al-Cu계 Pb-free 솔더 합금의 특성)

  • Kim Seong-Jun;Na Hye-Seong;Han Tae-Kyo;Lee Bong-Keun;Kang Cung-Yun
    • Journal of Welding and Joining
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    • v.23 no.6
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    • pp.93-98
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    • 2005
  • The purpose of this study is to investigate the characteristics of pb-free $Zn-(3\~6)\%Al-(1\~6)\%Cu$ solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. $Zn-4\%Al-(1\~3)\%Cu,\;Zn-5\%Al-(2\~4)\%Cu\;and\;Zn-6\%Al-(3\~5)\%Cu$ alloys satisfied the optimum melting range of 643 to 673k for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing hi content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic $\varepsilon$ phase(Zn-Cu), dendritic $\eta$ phase(Zn-Cu-Al), $\alpha(Al-Zn)-\eta$ eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased f phases. Also, the addition of Cu increased slightly the volume fraction of e, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but anelongation was linearly decreased.