• 제목/요약/키워드: Mechanical etching

검색결과 400건 처리시간 0.076초

나노 임프린트 리소그라피에 의한 마스터 복제 공정 (Fabrication of Master Replication by Nanoimprint Lithography)

  • 정명영
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1078-1082
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    • 2003
  • A feasibility study for the fabrication of master replication with nanostructures by Nanoimprint Lithography (NIL) was investigated for application of polymer Photonic Bandgap (PBG) devices used in photonic IC. Large area gratings of $9{\times}15(mm^2)$ with p = 400 nm was successfully embossed on PMMA on silicon wafer and the embossing parameters (temperature, pressure, time) were established. A precise control of $O_2$ plasma Reactive Ion Etching (RIE) process time allowed window opening over the whole area despite the presence of wafer bending. Master replication with aspect ratio 1 was successfully fabricated, but master replication with aspect ratio 3 needs to optimize parameters. All replications were done in a NIL process.

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Powder Blasting을 이용한 미세 포켓가공 (Micromachining of Pocket by Powder Blasting)

  • 박경호;최종순;김광현;박동삼
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.1060-1063
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    • 2001
  • The mechanical etching technique has recently been developed to a powder blasting technique for various materials, capable of producing micro structures larger than 100$\mu$m. This paper describes the performance of powder blasting technique in micro-pocketing of stainless steel and the effect of the number of nozzle scanning and the nozzle height on the depth and width of pockets. Experimental results showed that increasing the no. of nozzle scanning and decreasing the nozzle height resulted in the increase of depth and width in pockets. Increase of width results from wear of mask film.

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Probe-based Storage Device(PSD)용 정전형 2축 MEMS 스테이지의 설계 및 제작 (Electrostatic 2-axis MEMS Stage for an Application to Probe-based Storage Devices)

  • 백경록;전종업
    • 한국정밀공학회지
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    • 제22권11호
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    • pp.173-181
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    • 2005
  • We report on the design and fabrication of an electrostatic 2-axis MEMS stage possessing a platform with a size of $5{times}5mm^2$. The stage, as a key component, would be used in developing probe-based storage devices in the future. It was fabricated by forming numerous $5{\times}5{\mu}m^2$ etching holes in the central platform, as a result, reducing the total number of masks to 1, thereby simplifying the whole fabrication process. Experimental results show that the driving range of the stage was $32{\mu}m$ at the supplied voltage of 20V and the natural frequency was approximately 300Hz. The mechanical coupling between x- and y-motion was also measured and verified to be $25\%$.

전해 프로세스에 의한 초미세 펀치의 제작 (Fabrication of Ultrathin Punch by Electrochemical Process)

  • 임형준;임영모;김수현;곽윤근
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 춘계학술대회논문집A
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    • pp.792-796
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    • 2000
  • With the development of micro machining, it becomes an important part to fabricate an electrode which has tens of ${\mu}m$ or less. There are two methods to get a narrow hole; non-contact type such as EDM(Electro-discharge machining) and contact type such as punching. A punch which has a tapered shape with a cylindrical tip is fabricated in this paper. To make this punch, a method which was used to fabricate a cylindrical shape by electrochemical process was applied. The control factors for the shape and their limits are verified through an experiment.

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초기 스퍼터링조건이 스테인리스강의 이온질화시 지로하층 형성거동에 미치는 영향 (The Effects of Sputtering conditions in Pre Sputtering on the Formation Behavior of Nitride Layer in the Ion Nitriding of Stainless Steel)

  • 최상진
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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    • pp.197-203
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    • 1999
  • Stainless steels in general has passive film having strong corrosion resistance on surface. Therefore it must be necessarily removed by etching in mixing solution of sulfuric and chloric acid before Nitriding treatment. But in the ion nitriding, nitride layer was easily formed because passive film was removed without difficult by sputtering effect. The removal extent of these passive films was greatly effected by gas mixing ratios and pressure and holding times of pre sputtering factors in pre sputtering stage. As a results of experiment it has been known that pre sputtering pressure and holding time was not nearly effective on the formation behavior of nitride layer. But when A/H2 gas mixing ratios was 1/2 (vol%) was the most effective of the all pre sputtering conditions. It was resulted from the combination of mechanical reaction byArgon bombardment and chemical reaction by reduction of hydrogen on the passive film.

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Photolithographic Silicon Patterns with Z-DOL (perfluoropolyether, PFPE) Coating as Tribological Surfaces for Miniaturized Devices

  • Singh, R. Arvind;Pham, Duc-Cuong;Yoon, Eui-Sung
    • KSTLE International Journal
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    • 제9권1_2호
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    • pp.10-12
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    • 2008
  • Silicon micro-patterns were fabricated on Si (100) wafers using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterned shapes included micro-pillars and micro-channels. After the fabrication of the patterns, the patterned surfaces were chemically modified by coating Z-DOL (perfluoropolyether, PFPE) thin films. The surfaces were then evaluated for their micro-friction behavior in comparison with those of bare Si (100) flat, Z-DOL coated Si (100) flat and uncoated Si patterns. Experimental results showed that the chemically treated (Z-DOL coated) patterned surfaces exhibited the lowest values of coefficient of friction when compared to the rest of the test materials. The results indicate that a combination of both the topographical and chemical modification is very effective in reducing the friction property. Combined surface treatments such as these could be useful for tribological applications in miniaturized devices such as Micro/Nano-Electro-Mechanical-Systems (MEMS/NEMS).

The Development of Optical Temperature Sensor Based on the Etched Bragg Gratings

  • Ahn, Kook-Chan;Lee, Sang-Mae
    • International Journal of Aeronautical and Space Sciences
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    • 제2권2호
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    • pp.56-64
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    • 2001
  • An optical temperature sensor based on the etched planar waveguide Bragg grating is developed and its performance is explored using theoretical and experimental methods. The planar waveguide is designed and fabricated using optical lithography and wet chemical etching. An efficient butt coupled optical fiber is used to examine the spectral characteristics of the grating sensor, and to investigate the grating parameters. The typical bandwidth and reflectivity of the surface etched grating has been ~0.2 nm and ~7%, respectively, at a wavelength of ~1,552 nm. The temperature-induced wavelength change of the optical sensor is found to be slightly non-linear over ${\sim}200^{\circ}C$ temperature range. Theoretical models for the grating response of the sensor based on waveguide and classical laminated plate deformation theories agree with experiments to within acceptable tolerance.

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공진주파수 분석을 통한 MEMS용 Si 소재의 기계적 물성 및 미세파손 분석 기법 (Characterization of the mechanical and micro-fracture properties of material for ME the resonance frequency)

  • 김재석;이세호;권동일
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 추계학술대회 논문집 학회본부 C
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    • pp.575-577
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    • 2000
  • (100) single crystal Si은 좋은 anisotropy etching 성질과 기계적 강도를 가지고 있어 MEMS 구조용 소재로 사용되고 있다. (100) Si의 신뢰성 평가를 위하여 필요한 탄성계수를 측정하고 반복동작에 의한 응력에 의한 파손특성을 평가하기 위하여 micromachining을 통해 resonator를 제작하였다. Resonator의 공진주파수를 분석함으로써 탄성계수를 추하고자 하였으며 반복응력에 대한 파괴특성을 평가하기 위하여 공진 상태에서 파괴가 일어날 때까지의 사이를 수를 측정함으로써 반복음력에 대한 Si의 피로특성을 평가하고자 하였다. 실험 결과 (100) Si의 <110> 방향으로의 탄성 개수를 측정할 수 있었으며 Si의 미세파손의 응력에 대한 의존성을 평가할 수 있었다. 평가결과 Si의 미세파손 메커니즘은 억제된 균열의 진전에 의한 subcritical crack에 의한 피로파괴 현상보다는 과도한 스트레스에 의한 순간적인 균열전파에 의해 지배됨을 관찰할 수 있었다.

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친환경 레이저 디캡슐레이션에 관한 연구 (Study of clean laser decapsulation process)

  • 홍윤석;문성욱;남기중;최지훈;윤면근
    • 한국레이저가공학회:학술대회논문집
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    • 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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    • pp.103-107
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    • 2006
  • Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

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정전척 온도분포 개선을 위한 냉각수 관로 형상 (Coolant Path Geometry for Improved Electrostatic Chuck Temperature Variation)

  • 이기석
    • 반도체디스플레이기술학회지
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    • 제10권4호
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    • pp.21-23
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    • 2011
  • Uniformity of plasma etching processes critically depends on the wafer temperature and its distribution. The wafer temperature is affected by plasma, chucking force, He back side pressure and the surface temperature of ESC(electrostatic chuck). In this work, 3D mathematical modeling is used to investigate the influence of the geometry of coolant path and the temperature distribution of the ESC surface. The model that has the coolant path with less change of the cross-sectional area and the curvature shows low standard deviation of the ESC surface temperature distribution than the model with the coolant path of the larger surface area and more geometric change.