• 한국포장학회지
• /
• 제30권1호
• /
• pp.43-51
• /
• 2024

The addition of oxygen scavengers to food products helps to reduce oxygen exposure, thereby mitigating deterioration, including changes in taste, odor, and color, as well as inhibiting microbial growth. Despite the advantages of the existing non-metallic oxygen removal materials in terms of safety for the human body and suitability for use in microwave ovens, their utilization has been limited due to their slow reaction initiation speed. Therefore, in the current study, sodium metabisulfite was impregnated into various porous media, including halloysite nanoclay, activated carbon, montmorillonite, and silica gel. The oxygen scavenger, produced by impregnating silica gel with sodium metabisulfite, demonstrated a 425% improvement in the initial oxygen removal rate compared to pure sodium metabisulfite. Additionally, sachets containing an oxygen-removing composition with an enhanced oxygen removal rate effectively decreased the oxygen concentration to less than 0.5% on the third day of storage in apple packaging, without elevating carbon dioxide levels. Moreover, it proved effective in preventing the browning of the apple surface. Therefore, the SM/SG oxygen-removal composition can be effectively applied to active food packaging by controlling the oxygen concentration within the packaging.

• Tribology and Lubricants
• /
• 제33권5호
• /
• pp.228-233
• /
• 2017

Chemical Mechanical Polishing of chemically stable sapphire substrates is dominantly affected by the mechanical processing of abrasives, in terms of the material removal rate. In this study, we investigated the effect of electrostatic force between the abrasives and substrate, on the polishing. If potassium chloride (KCl) is added to slurry, water molecules are decomposed into $H^+$ and $OH^-$ ions, and the amount of ions in the slurry changes. The zeta potential of the abrasives decreases with an increase in the amount of $H^+$ ions in the stern layer; consequently, the electrostatic force between the abrasives and substrate decreases. The change in zeta potential of abrasives in the slurry is affected by the slurry pH. In acidic zones, the amount of ions bound to the abrasives increases if the amount of $H^+$ ions is increased by adding KCl. However, in basic zones, there is no change in the corresponding amount. In acidic zones, zeta potential decreases as molar concentration of potassium increases; however, it does not change significantly in basic zones. The removal rate tends to decrease with increase in molar amount of potassium in acidic zones, where zeta potential changes significantly. However, in basic zones, the removal rate does not change with zeta potential. The tendencies of zeta potential and that of the frictional force generated during polishing show strong correlation. Through experiments, it is confirmed that the contact probability of abrasives changes according to the electrostatic force generated between the abrasives and substrate, and variation in removal rate.

• 대한기계학회논문집
• /
• 제18권8호
• /
• pp.2073-2080
• /
• 1994

In this paper, a model of material removal in abrasive water jet machining of brittle material is developed, and experimentally evaluated. Abrasive water jet machining proved to yield better material removal rate than other machining techniques for hard and brittle material (alumina ceramics). It was also found that large scale fracture may develop at the exit of the jet from the material. The fracture size was predicted as a function of water jet pressure and size of the hole. Finally, the feasibility of using acoustic emission signals for in-process monitoring of the abrasive water jet machining process is investigated.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
• /
• pp.88-91
• /
• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina ($Al_2O_3$) abrasive containing slurry with $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
• /
• pp.33-36
• /
• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• 상하수도학회지
• /
• 제26권1호
• /
• pp.123-129
• /
• 2012

A septic tank is a purification treatment system where night soil and other waste matter is converted into harmless material by the activities of bacteria. Effluent from the septic tank flows into the sewer pipe, and then this effluent affects the quality of water environment and makes foul smell. In this study, through the proper maintenance of septic tank it was tried to minimize the impact of sewer pipe on water quality and fouling smell. BOD removal rate from the septic tank's effluent which exceeded legal cleaning period was investigated for the proper maintenance. BOD Removal rate of the twelve septic tank's effluent is -62.5% to 43.9%. According to the result of BOD removal rate, septic tank cleaning should be done at least once a year. And the pathogenic coliform bacillus in the twelve septic tank's effluent is average 768,000 (MPN/$100m{\ell}$). The chlorine disinfection is needed to remove the pathogenic coliform bacillus in septic tank effluent.

• Transactions on Electrical and Electronic Materials
• /
• 제8권1호
• /
• pp.26-31
• /
• 2007

The goal of this study is to determine if High Pressure Micro Jet (HPMJ) conditioning can be used as a substitute for, or in conjunction with, conventional diamond pad conditioning. Five conditioning methods were studied during which 50 ILD wafers were polished successively in a 100-mm scaled polisher and removal rate (RR), coefficient of friction (COF), pad flattening ratio (PFR) and scanning electron microscopy (SEM) measurements were obtained. Results indicated that PFR increased rapidly, and COF and removal rate decreased significantly, when conditioning was not employed. With diamond conditioning, both removal rate and COF were stable from wafer to wafer, and low PFR values were observed. SEM images indicated that clean grooves could be achieved by HPMJ pad conditioning, suggesting that HPMJ may have the potential to reduce micro scratches and defects caused by slurry abrasive particle residues inside grooves. Regardless of different pad conditioning methods, a linear correlation was observed between temperature, COF and removal rate, while an inverse relationship was seen between COF and PFR.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2007년도 춘계학술대회 논문집
• /
• pp.31-32
• /
• 2007

• Korean Journal of Chemical Engineering
• /
• 제35권11호
• /
• pp.2198-2206
• /
• 2018

We addressed the development of a novel, low-cost, and high-efficient material from hybrid materials, known as microcapsules. Microcapsules are a composite adsorbent made of a mixture of tannin, sericite and chitosan. The FT-IR analysis showed that the microcapsules contain hydroxyl, carboxyl, carbonyl, and amino groups, which play an important role in the adsorption of heavy metals. The microcapsules were able to remove 99% of Pb(II) in 30 min, and obtained a removal efficiency of more than (13-50)%, compared with the single adsorbents of tannin, chitosan, and sericite. In adsorption kinetic analysis, pseudo-second-order adsorption was more suitable than pseudo-first-order adsorption, and chemical adsorption did not limit the adsorption rate of Pb(II) ion. In isothermal adsorption, Langmuir adsorption was more suitable than Freundlich adsorption, and the maximum Langmuir adsorption capacity was 167.82 (mg/g). Furthermore, desorption and reusability studies, as well as the applicability of the material for wastewater treatment, demonstrated that microcapsules offer a promising hybrid material for the efficient removal of significant water pollutants, i.e., Pb(II) from aqueous solutions.

• Tribology and Lubricants
• /
• 제40권2호
• /
• pp.67-70
• /
• 2024

Chemical mechanical planarization (CMP) is an essential process for ensuring high integration when manufacturing semiconductor devices. CMP mainly requires the use of polyurethane-based polishing pads as an ultraprecise process to achieve mechanical material removal and the required chemical reactions. A diamond disk performs pad conditioning to remove processing residues on the pad surface and maintain sufficient surface roughness during CMP. However, the diamond grits attached to the disk cause uneven wear of the pad, leading to the poor uniformity of material removal during CMP. This study investigates the pad wear rate profile according to the swing motion of the conditioner during swing-arm-type CMP conditioning using deep learning. During conditioning, the motion of the swing arm is independently controlled in eight zones of the same pad radius. The experiment includes six swingmotion conditions to obtain actual data on the pad wear rate profile, and deep learning learns the pad wear rate profile obtained in the experiment. The absolute average error rate between the experimental values and learning results is 0.01%. This finding confirms that the experimental results can be well represented by learning. Pad wear rate profile prediction using the learning results reveals good agreement between the predicted and experimental values.