• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2005년도 종합학술발표회 논문집 Vol.15 No.1
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• pp.353-356
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• 2005

There have been many researches on the antenna performance degradation with the presence of the human body around the antenna structure to accomodate personal communication service [1][2]. To better understand the human body effects on the antenna resonance, radiation pattern, and input impedance, simulation was carried out with changing of the distance between antenna and lossy material. Effects on the antenna performance by the surrounding materials are also important in the case of the RFID system. It is desirable that the tag antennas for RFID system must reveal isotropic radiation pattern as well as attain the good impedance matching. In this paper, we investigated the antenna resonance and input impedance characteristic when there exist a lossy material sphere near various types of antenna at 900 MHz. In short antenna resonance was mostly affected by lossy material in the case of a rectangular loop antenna, and impedance variation was smallest in the case of a halfwave dipole.

• 소성∙가공
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• 제30권6호
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• pp.284-290
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• 2021

Manufacturing using a 3D printer has recently increased in many fields and the material extrusion method, which is a lamination method, is commonly used. Since it uses a plastic material, the strength of the output of 3D printing is lower than that of steel material. For this reason, research on improving the mechanical properties of the output of 3D printing is continuously being conducted. In this study, tensile strength was compared with changes in the material type (PLA+, ABS) and density (60, 80, and 100%), layer height (0.1, 0.2, and 0.3 mm), layer direction (transverse and lengthwise), and fill pattern (zigzag, honeycomb, and concentric) among 3D printing output conditions. Tensile tests according to 3D printing output conditions were performed using a Universal Testing Machine. The results showed that tensile strength ranged from 21.10 MPa to 43.65 MPa according to the 3D printing output conditions.

• 전기학회논문지P
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• 제58권3호
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• pp.357-361
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• 2009

This study performed analysis on the thermal pattern and current characteristics of an LED ((Light Emitting Diode) street lamp. It did this using a TVS (Thermal Video System) to analyze the LED street lamp's thermal pattern, and measured its characteristics using an oscilloscope. The ambient temperature and humidity during the experiment were maintained at $24{\pm}2[^{\circ}C]$ and 50~60[%]. The capacity of the LED street lamp was 120[W] and nine sets of modules were arranged at uniform intervals. On one module, 24 LED lamps were arranged in a radial pattern. The analysis of the thermal diffusion pattern at the front of the LED lamp showed that the maximum surface temperature was approximately $34[^{\circ}C]$. In addition, there was almost no change in the temperature of the upper cover, and the temperature at the side showed a uniform thermal diffusion pattern. The surface temperature of the converter converting AC to DC increased to approximately $46[^{\circ}C]$. The analysis results of the thermal characteristics of one LED indicated uniform thermal characteristics for an initial eight minutes. However, the temperature at the center of the LED increased to approximately $82[^{\circ}C]$ after 12 minutes had elapsed. It can be seen from this that the temperature at the center of the LED was higher than the allowable temperature, $70[^{\circ}C]$ of the insulating material for general electrical devices. Therefore, it is necessary to design a lamp in such a way that the plastic insulating material does not come into contact with or get close to the LED lamp. The voltage of the LED lamp converted by the AC/DC converter was measured at DC 27[V] and the current was DC 13[A]. Consequently, it can be seen that in order to secure an adequate light source, it is important to supply a stable current that was greater than the current of other light sources. Therefore, appropriate radiation of heat is required to secure the stability and reliability of the system.

• 한국구조물진단유지관리공학회 논문집
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• 제25권2호
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• pp.58-65
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• 2021

도로의 유지관리 방안으로 미끄럼 방지포장에 대한 시공사례가 급증하고 있다. 패턴 프레임 공법은 도로 표면에 신재료를 추가하는 방식으로 미끄럼 저항 성능향상과 함께 미관을 향상시킬 수 있는 장점을 지니고 있다. 하지만 시공되고 있는 패턴 프레임 공법은 수입산 소재에 의존하고 있으며, 수출규제로 인한 중요소재수급에도 문제를 보이고 있다.. 본 논문에서는 국내형 패턴 프레임 공법 개발을 위하여 사용되는 중요소재를 국산화 하고 개발 공법에 대한 중요지표 성능 검증을 진행하였다. 중요 성능 지표는 언더코팅 소재의 부착강도, 시공 완료된 패턴 프레임의 미끄럼 저항 성능이다. 부착강도는 1.4MPa를 목표로 진행하였으며 국산화 대체 소재는 2.35MPa로 목표 성능을 만족하였고, 미끄럼 저항 성능은 40BPN을 목표로 진행하였으며 국산화 대체 소재는 75BPN으로 목표 성능을 만족하였다. 경제성 분석 결과, 국산화 소재의 경우 패턴 프레임 전 공정에 사용되는 재료비가 1m² 기준으로 해외 소재 대비 40% 절감되는 것을 확인하였다. 추가적으로 현장 시범 시공 및 관련 지표 모니터링을 통하여 개발 공법을 검증완료 하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.221-224
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• 2002

Recently, simulation of Chemical Mechanical Polis hing is becoming more important because Process parameters on the material removal rate are complicated. And pattern-depent effects are a key concern in CMP processes. In this paper, we have been studied the changes of pattern density vs. oxide thickness with Stine's simulation model. We also have estimated the effective density using optimal window size with density mask, and have made a study of the change of oxide thickness as a function of polishing time.

• 소성∙가공
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• 제11권7호
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• pp.614-619
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• 2002

For an accurate measurement of the material behavior of small structures, a new optical experimental technique is proposed to measure the deformation. The test method uses the dual microscope that can measure the relative deformation of two adjacent regions. The magnified view is captured by CCD cameras and the relative deformation can be measured by the pattern matching and tracing method. Using this experimental technique, the deformation of solder joints in electronic packaging and the strain of the nickel thin film are measured.

• 한국전기전자재료학회논문지
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• 제23권6호
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• pp.440-443
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• 2010

We report a top-down approach based on atomic force microscopy (AFM) local anodic oxidation for the fabrication of the nano-pattern field effect transistors (FETs). AFM anodic oxidation is relatively a simple process in atmosphere at room temperature but it still can result in patterns with a high spatial resolution, and compatibility with conventional silicon CMOS process. In this work, we study nano-pattern FETs for various cross-bar distance value D, from ${\sim}0.5\;{\mu}m$ to $1\;{\mu}m$. We compare the optical characteristics of the patterned FETs and of the reference FETs based on both 2-dimensional simulation and experimental results for the wavelength from 100 nm to 900 nm. The simulated the drain current of the nano-patterned FETs shows significantly higher value incident the reference FETs from ${\sim}1.7\;{\times}\;10^{-6}A$ to ${\sim}2.3\;{\times}\;10^{-6}A$ in the infrared range. The fabricated surface texturing of photo-transistors may be applied for high-efficiency photovoltaic devices.

• 한국전기전자재료학회논문지
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• 제24권2호
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• pp.147-151
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• 2011

We were analyzed the piezoelectric characteristic for electronics printing to inkjet printing system. These applications were possible use to Actuator, MEMS, FPCB, RFID, Solar cell and LCD color filter etc. Piezoelectric print head is firing from ink droplet control consideration ink viscosity properties. At this time, micro pattern for PCB metal printing was possible by droplet control of piezoelectric driving. These driving characteristics are variable voltage pulse waveform. We are used the piezoelectric analysis software of Finite Element Method (FEM), Piezoelectric design parameters are acquired from piezoelectric analysis, and measurement of piezoelectric. It designed for piezoelectric head to possible electric print pattern of inkjet printing system. For this validity we were established through in comparison with simulation and measurement. Designed piezoelectric specification obtained voltage 98V, firing frequency 10 kHz, resolution 360dpi, drop volume 20pl, nozzle number 256, and nozzle pitch 0.33 mm.

• 한국전기전자재료학회논문지
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• 제13권6호
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• pp.538-544
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• 2000

The laser patterning of sputter-deposited CoNdZr/Cu/CoNbZr multi-layered films had been tried using Nd:YAG laser. However generally it is very difficult to remove metal films because of their high reflectance of the laser on the surfaces. As a counterproposal for this problem authors for the first time tried to deposit energy-absorbing layers on the metal films and then irradiated the laser on the surfaces of energy-absorbing layers. Here the energy-absorbing layers consisted of laser energy-absorbing fine powders and binding polymers. Three kinds of powders for the energy-absorbing layers had been used to see the difference in the pattern formation with the degree of laser energy absorption. They were electrically conductive silver powders insulating BaTiO$_3$powder and semiconducting carbon powder. Remarkable difference in width of the formed pattern and the roughness of pattern edge were observed with the characteristic of the powder for the energy-absorbing layer. The pattern width using carbon paste was about three times larger than that using BaTiO$_3$paste. It was observed that the energy-absorbing layer with carbon was the most effective on this micro-patterning.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.666-670
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• 2004

VLSI 소자에서 design rule(D/R)이 작아져 각 단위 Pattern의 size가 작아짐에 따라 aspect ratio가 커지게 되었다. 산화막 contact etch를 하는데 있어 산화막 측벽을 보호하는데, 이러한 보호막은 주로 fluoro-carbon 계열의 polymer precursor들이 사용된다. Aspect ratio(A/R)가 5 이하일 때에는 측벽의 보호막에 의한 바닥 변형이 문제가 되지 않으나, 10 이상의 A/R를 가진 contact에서는 크기가 줄고, 모양이 불균형하게 변하는 바닥 변형을 쉴게 관찰할 수 있다. 이러한 바닥 변형이 커지면 contact 저항이 높아지는 것은 물론이고, 심하게는 하부 pattern과 overlap 불량을 유발할 수 있다. 본 논문에서는 바닥변형을 일으키는 원인을 분석하고 fluoro-carbon 계열의 polymer precursor의 종류$(C_4_F6\;vs.\;C_3F_8)$에 따른 polymer증착 상태 확인 및 pattern비대칭에 따른 바닥 변형의 고찰과 plasma etching 시 H/W 변형을 통해 바닥 변형이 거의 없는 조건을 찾아낼 수 있었다.