• 제목/요약/키워드: Material Erosion

검색결과 327건 처리시간 0.029초

폴래머애자의 트래킹 특성에 미치는 염수농도의 영향 (Effect of the Salinity Level on Tracking Characteristics of Polymer Insulators)

  • 한재홍;송일근;김동명;정종욱
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.74-77
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    • 2001
  • In order to investigate the effect of salinity level on tracking characteristics of polymer insulators for distribution power systems, tracking tests were performed by tracking wheel tester under different salt concentration. In this study, 6 kinds of polymer insulators were tested under 2200 ${\mu}\textrm{s}$/cm and 4000${\mu}\textrm{s}$/cm salinity. The salinity level has a significant effect on the tracking characteristics. Namely, most polymer insulators showed the good tracking resistance in case of low salinity level. But, in case of high salinity level some polymer insulators showed the excessive erosion and tracking. These phenomena may come from the different aging mechanism. It can be concluded that too high salinity level is not desirable in aging test of polymer insulators.

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$SnO_2$ 박막의 CMP 특성 (CMP properties of $SnO_2$ thin film)

  • 최권우;이우선;고필주;김태완;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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    • pp.93-96
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    • 2004
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

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수변전설비에서 접점 불량에 따른 열 및 전계 분포 해석 (The Analysis of Temperature and Electric Field due to Contact Failure in Power Substation)

  • 김기준
    • 한국전기전자재료학회논문지
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    • 제29권5호
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    • pp.307-311
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    • 2016
  • Although there are existing Residual Current Protective Device (RCD) including detect electric leakage and elements such as short circuit and surge, the occurrence of incidents caused by electric faults, including fire, are still constant. The purpose of this study is to analyze the causes of accidents through the electric field distribution in the interpretation of the fault contact breaker. Simulation results by the arc fault has shown the convergence of temperature and electric field to the defect. Through their simulation results, the main cause of erosion phenomena in circuit breaker bar is the electric arc by concentration of electric field not due to dissolve by temperature.

고분자 절연재료의 트랙킹 열화에 미치는 오손액의 영향 (The Effect of Contaminants on Tracking Aging in Polymer Insulating Materials)

  • 조한구;박용관
    • E2M - 전기 전자와 첨단 소재
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    • 제10권8호
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    • pp.770-777
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    • 1997
  • Some polymer materials including epoxy resin are being instead of porcelain for outdoor insulating materials such as insulators bushings cable terminators and surge arrester housing. And the largest problem to be overcomed is the tracking and erosion of the outdoor polymer material brought about by dry band arcing during prolonged exposure to contaminations. In this paper the effect of surface tension wettability flow rate of contaminants with varying surfactant content and frequency of applied voltage on the tracking breakdown of epoxy insulating materials were investigated. As the flow rate of contaminant is increased the surface resistivity is decreased and the leakage current is increased the time to tracking breakdown is decreased. It is found that time to tracking breakdown depends on the surface tension of contaminant that is difference of wettability. And as the frequency of applied voltage is increased time to tracking breakdown decreased.

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가속열화시험에 의한 폴리머애자의 신뢰성 평가 (Reliability Assessment of Polymer Insulators by Accelerated Aging Test)

  • 한채홍;이병성;정종욱
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
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    • pp.10-14
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    • 2001
  • In order to assess the long-tenn reliability of polymer insulators for distribution power systems, we have developed the accelerated aging test method which can simulate the operation conditions. In this study, 3000 hours aging test for 4 kinds of polymer insulators has been completed by the developed accelerated aging test. After 3000 hours aging test, visual inspection and electrical tests were carried for identifying a change of characteristics. Some specimens showed the surface erosion and the manufacturing defect. In the electrical tests, the wet flashover voltage was significant1y decreased by the accelerated aging test. In comparison with the field-aged polymer insulators, it can be concluded that the developed test method can evaluate the long-tenn reliability within short time and screen the manufacturing defect.

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가속열화 실험에 의한 고분자 애자의 분해 (Degradation of Composite Insulator as Accelated Aging Test)

  • 이용희;장동욱;박영국;박정남;강성화;임기조
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 하계학술대회 논문집
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    • pp.144-147
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    • 2000
  • The effect of accelerated aging test on ethylene-propylene-diene monomer(EPDM) rubber used for outdoor insulation was studied by X-ray photoelectron spectroscopy(XPS), scanning electron microscope(SEM), FFT spectrum alalysis, and electrical pulse counts using PC by oscilloscope(300 MHz). In electrical alalysis, FFT spectrum analysis indicated arcing caused a significant increase in the third harmonic content of the leakage current of polluted insulator. Also, pulse counts increased as aging time. The surface oxygen and aluminum content were found to increase and that of carbon and nitrogen were found to decrease with time. The detailed XPS analysis indicated that the concentration of carbon in C-C decreased and concentration of highly oxidized carbons increased with time, which was due to the oxidation of EPDM rubber polymer SEM analysis indicated that crack and erosion of EPDM rubber occurred with time.

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송전용 폴리마 런자의 장기성능을 위한 복합열화시험 (Multi-aging Test for Estimating Long Time Performance of Polymer Insulators for Transmission line)

  • 조한구;한세원;이운용;윤문수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 추계학술대회 논문집
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    • pp.640-643
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    • 1999
  • This paper presents the results of multi-stress chamber experiments done to examine the tracking and erosion performance of polymer insulator. Multi-stress testing is able to demonstrate deficiencies of polymer insulator materials and designs, including the nature of interfaces in insulation design. Therefore, multi-stress testing is believed to a suitable test for evaluating the aging performance of polymer insulator designs. We have nvestigated IEC 61109 Annex C for estimating long time performance of polymer insulator.

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슬러리 종류에 따른 $SnO_2$ 박막의 광역평탄화 특성 (CMP properties of $SnO_2$ thin film by different slurry)

  • 최권우;이우선;고필주;김태완;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.389-392
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    • 2004
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

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$SnO_2$ 박막의 CMP 특성 (CMP properties of $SnO_2$ thin film)

  • 이우선;최권우;고필주;홍광준;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.184-187
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    • 2003
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) lyaer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2-CMP$ process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis or used slurry.

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대면적 마그네트론 스퍼터링 증착장비의 수냉시스템 방열성능 해석 (Cooling Performance Analysis of Water-Cooled Large Area Magnetron Sputtering System)

  • 김경진
    • 반도체디스플레이기술학회지
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    • 제9권2호
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    • pp.111-116
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    • 2010
  • In a large area magnetron sputtering system, which is under the influence of high heat load from the plasma, it is necessary to use the effective water cooling in order to maintain the proper deposition performance and the economic use of target materials. A series of three-dimensional numerical simulations are carried out on the simplified model of the large area magnetron sputtering system with the cooling plate that includes the U-shaped water channel. The analysis is focused on the effects of water channel geometry, cooling water flowrate, thermal conductivity of target material, and the degree of target erosion on the cooling performance of cooling plate, which is represented by the temperature distribution of target material.