• Title/Summary/Keyword: Mask material

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Development of Finite Element Model for Dynamic Characteristics of MEMS Piezo Actuator in Consideration of Semiconductor Process (반도체 공정을 고려한 유한요소해석에 의한 MEMS 압전 작동기의 동특성 해석)

  • Kim, Dong Woohn;Song, Jonghyeong;An, Seungdo;Woo, Kisuk
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2013.04a
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    • pp.454-459
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    • 2013
  • For the purpose of rapid development and superior design quality assurance, sophisticated finite element model for SOM(Spatial Optical Modulator) piezo actuator of MOEMS device has been developed and evaluated for the accuracy of dynamics and residual stress analysis. Parametric finite element model is constructed using ANSYS APDL language to increase the design and analysis performance. Geometric dimensions, mechanical material properties for each thin film layer are input parameters of FE model and residual stresses in all thin film layers are simulated by thermal expansion method with psedu process temperature. $6^{th}$ mask design samples are manufactured and $1^{st}$ natural frequency and 10V PZT driving displacement are measured with LDV. The results of experiment are compared with those of the simulation and validate the good agreement in $1^{st}$ natural frequency within 5% error. But large error over 30% occurred in 10V PZT driving displacement because of insufficient PZT constant $d_{31}$ measurement technology.

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Fabrication of the Acceleration Sensor Body of Glass by Powder Blasting (미립분사가공을 이용한 유리 소재의 가속도 센서 구조물 성형)

  • Park, Dong-Sam;Kang, Dae-Kyu;Kim, Jeong-Keun
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.2 s.179
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    • pp.146-153
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    • 2006
  • Acceleration sensors have widely been used in the various fields of industry. In recent years, micromachining accelerometers have been developed and commercialized by the micromachining technique or MEMS technique. Typical structure of such sensors consist of a cantilever beam and a vibrating mass fabricated on Si wafers using etching. This study investigates the feasibility of powder blasting technique for microfabrication of sensor structures made of the pyrex glass alternating the existing Si based acceleration sensor. First, as preliminary experiment, effect of blasting pressure, mass flow rate of abrasive and no. of nozzle scanning on erosion depth of pyrex and soda lime glass is studied. Then the optimal blasting conditions are chosen for pyrex sensor. Structure dimensions of designed glass sensor are 2.9mm and 0.7mm for the cantilever beam length and width and 1.7mm for the side of square mass. Mask material is from aluminium sheet of 0.5mm in thickness. Machining results showed that tolerance errors of basic dimensions of glass sensor ranged from 3um in minimum to 20um in maximum. This results imply the powder blasting can be applied for micromachining of glass acceleration sensors alternating the exiting Si based sensors.

Fabrication and Properties of MFSFET′s Using $BaMgF_4$/Si Structures for Non-volatile Memory ($BaMgF_4$/Si 구조를 이용한 비휘발성 메모리용 MFSFET의 제작 및 특성)

  • 이상우;김광호
    • Electrical & Electronic Materials
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    • v.10 no.10
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    • pp.1029-1033
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    • 1997
  • A prototype MFSFET using ferroelectric fluoride BaMgF$_4$as a gate insulator has been successfully fabricated with the help of 2 sheets of metal mask. The fluoride film was deposited in an ultrai-high vacuum system at a substrate temperature of below 30$0^{\circ}C$ and an in-situ post-deposition annealing was conducted for 20 seconds at $650^{\circ}C$ in the same chamber. The interface state density of the BaMgF$_4$/Si(100) interface calculated by a MFS capacitor fabricated on the same wafer was about 8$\times$10$^{10}$ /cm$^2$.eV. The I$_{D}$-V$_{G}$ characteristics of the MFSFET show a hysteresis loop due to the ferroelectric nature of the BaMgF$_4$film. It is also demonstrated that the I$_{D}$ can be controlled by the “write” plus which was applied before the measurements even at the same “read”gate voltage.ltage.

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A Study on the Laser Direct Imaging for FPD ( I ) (평판 디스플레이용 Laser Direct Imaging에 관한 연구( I ))

  • Kang, H.S.;Kim, K.R.;Kim, H.W.;Hong, S.K.
    • Proceedings of the Korean Society of Laser Processing Conference
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    • 2005.11a
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    • pp.37-41
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    • 2005
  • When screen size of the Flat Panel Display (FPD) becomes larger, the traditional photo-lithography using photomasks and UV lamps might not be possible to make patterns on Photo Resist (PR) material due to limitation of the mask size. Though the maskless photo-lithography using UV lasers and scanners had been developed to implement large screen display, it was very slow to apply the process for mass-production systems. The laser exposure system using 405 nm semi-conductor lasers and Digital Micromirror Devices (DMD) has been developed to overcome above-mentioned problems and make more than 100 inches FPD devices. It makes very fine patterns for full HD display and exposes them very fast. The optical engines which contain DMD, Micro Lens Array (MLA) and projection lenses are designed for 10 to 50 ${\mu}m$ bitmap pattern resolutions. The test patterns for LCD and PDP displays are exposed on PR and Dry Film Resists (DFR) which are coated or laminated on some specific substrates and developed. The fabricated edges of the sample patterns are well-defined and the results are satisfied with tight manufacturing requirements.

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Manufacturing SiNx Extreme Ultraviolet Pellicle with HF Wet Etching Process (HF 습식 식각을 이용한 극자외선 노광 기술용 SiNx)

  • Kim, Ji Eun;Kim, Jung Hwan;Hong, Seongchul;Cho, HanKu;Ahn, Jinho
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.3
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    • pp.7-11
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    • 2015
  • In order to protect the patterned mask from contamination during lithography process, pellicle has become a critical component for Extreme Ultraviolet (EUV) lithography technology. According to EUV pellicle requirements, the pellicle should have high EUV transmittance and robust mechanical property. In this study, silicon nitride, which is well-known for its remarkable mechanical property, was used as a pellicle membrane material to achieve high EUV transmittance. Since long silicon wet etching process time aggravates notching effect causing stress concentration on the edge or corner of etched structure, the remaining membrane is prone to fracture at the end of etch process. To overcome this notching effect and attain high transmittance, we began preparing a rather thick (200 nm) $SiN_x$ membrane which can be stably manufactured and was thinned into 43 nm thickness with HF wet etching process. The measured EUV transmittance shows similar values to the simulated result. Therefore, the result shows possibilities of HF thinning processes for $SiN_x$ EUV pellicle fabrication.

Effect of surface roughness of AZO thin films on the characteristics of OLED device (AZO 박막의 표면 거칠기에 따른 OLED 소자의 특성)

  • Lee, B.K.;Lee, K.M.
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.4
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    • pp.25-29
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    • 2010
  • We have investigated the effect of surface roughness of TCO substrate on the characteristics of OLED (organic light emitting diodes) devices. In order to control the surface roughness of AZO thin films, we have processed photo-lithography and reactive ion etching. The micro-size patterned mask was used, and the etching depth was controlled by changing etching time. The surface morphology of the AZO thin film was observed by FESEM and atomic force microscopy (AFM). And then, organic materials and cathode electrode were sequentially deposited on the AZO thin films. Device structure was AZO/${\alpha}$-NPD/DPVB/$Alq_3$/LiF/Al. The DPVB was used as a blue emitting material. The electrical characteristics such as current density vs. voltage and luminescence vs. voltage of OLED devices were measured by using spectrometer. The current vs. voltage and luminance vs. voltage characteristics were systematically degraded with increasing surface roughness. Furthermore, the retention test clearly presented that the reliability of OLED devices was directly influenced with the surface roughness, which could be interpreted in terms of the concentration of the electric field on the weak and thin organic layers caused by the poor step coverage.

X-ray grayscale lithography for sub-micron lines with cross sectional hemisphere for Bio-MEMS application (엑스선 그레이 스케일 리소그래피를 활용한 반원형 단면의 서브 마이크로 선 패턴의 바이오멤스 플랫폼 응용)

  • Kim, Kanghyun;Kim, Jong Hyun;Nam, Hyoryung;Kim, Suhyeon;Lim, Geunbae
    • Journal of Sensor Science and Technology
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    • v.30 no.3
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    • pp.170-174
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    • 2021
  • As the rising attention to the medical and healthcare issue, Bio-MEMS (Micro electro mechanical systems) platform such as bio sensor, cell culture system, and microfluidics device has been studied extensively. Bio-MEMS platform mostly has high resolution structure made by biocompatible material such as polydimethylsiloxane (PDMS). In addition, three dimension structure has been applied to the bio-MEMS. Lithography can be used to fabricate complex structure by multiple process, however, non-rectangular cross section can be implemented by introducing optical apparatus to lithography technic. X-ray lithography can be used even for sub-micron scale. Here in, we demonstrated lines with round shape cross section using the tilted gold absorber which was deposited on the oblique structure as the X-ray mask. This structure was used as a mold for PDMS. Molded PDMS was applied to the cell culture platform. Moreover, molded PDMS was bonded to flat PDMS to utilize to the sub-micro channel. This work has potential to the large area bio-MEMS.

A Study on the Actual Condition for Air Respirators Using Air-breathing (공기호흡기용 압축공기 시스템에 대한 실태 연구)

  • Lee Chang-Woo;Lee Young-Jae;Hyun Seong-Ho;Seong Jae-Man;Song Yun-Suk;Choi Don-Muk;Yoon Myung-O
    • Fire Science and Engineering
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    • v.18 no.4
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    • pp.16-21
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    • 2004
  • This paper has investigated influences of pollutants in air-breathing on the respirators and it by year of disused air respirators that fire fighter is using in domestic cutting done air respirators after collection observed state of cylinder material through instrumental analysis, and cut open pipe to confirm pollution degree of pipe from cylinder of air respirators to airline mask and confirm pollution availability. The metal surface inside the air respirators was corroded by moisture included in the compressed air. The material generated by corrosion is white powder of less then 100㎛, which is analyzed as aluminum hydroxide corroded by moisture. This aluminum hydroxide powder may get into the lung while one breathes in, and it is easy to be attached to the lung so it will cause a serious influences to human health. This study suggests that Korea should set out the standards for components and composition of breathing air as soon as possible.

Humidity Sensitive Characterization by Electrode Pattern on the Capacitive Humidity Sensor Using Polyimide (폴리이미드 용량형 습도센서의 전극 패턴에 따른 감습 특성)

  • Park, Sung-Back;Shin, Hoon-Kyu;Lim, Jun-Woo;Chang, Sang-Mok;Kwon, Young-Soo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.9
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    • pp.566-570
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    • 2014
  • Electrode pattern effects on the capacitive humidity sensor were investigated. The fabrication of the capacitive humidity sensor was formed with three steps. The bottom electrode was formed on the silicon substrate with Pt/Ti thin layer by using shadow mask and e-beam evaporator. The photo sensitive polyimide was formed on the bottom electrode by using photolithography process as a humidity sensitive thin film. The upper electrode was formed on the polyimide thin film with Pt/Ti thin layer by using e-beam evaporator and lift-off method. Three electrode patterns, such as circle, square, and triangle pattern, were used and changed the sizes to investigate the effects. The capacitances of the sensors were decreased 622 to 584 pF with the area decreament of patterns 250,000 to $196,250{\mu}m^2$. From these results, a capacitive humidity sensor with photo sensitive polyimide is expected to be applied to a high sensitive humidity sensor.

Effects of Process Conditions on Electrode Patterning by Screen Printing Method (스크린 인쇄법의 공정 조건이 전극 패턴 균일성에 미치는 영향)

  • Lee, Na-Young;Kim, Dong-Chul;Yeo, Dong-Hun;Lee, Joo-Sung;Yoon, Sang Ok;Shin, Hyo-Soon;Lee, Joon-Hyung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.5
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    • pp.355-359
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    • 2020
  • In this study, image analysis and surface roughness measurements using an optical microscope are presented as a method to quantitatively evaluate the results of screen printing. Using this method, the squeegee speed, which is the printing process condition, and the printability of the electrode according to the screen mesh were evaluated. Increasing the squeegee speed in the printing process acts as a process element that increases the line width precision of the printed electrode and lowers the surface roughness of the printed surface. Furthermore, the edge roughness, which indicates the clarity of printing, was not significantly affected by the speed of the squeegee during printing. The print thickness increases in proportion to the squeegee speed, but is largely dependent on the screen thickness.