• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.5
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• pp.99-107
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• 1989

This paper describes the KUI-LED (Kyungpook national University Intelligent CAD-Layout EDitor) which is a 2-dimensional graphics editor for IC mask layout. This system runs of IBM PC/AT with the ${\Omega}$/PC graphics board. It offers a sufficient set of facilities to do most kinds of layout. KUIC-LED is written in 'C' and 'Assembly' language.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.6
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• pp.115-123
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• 1989

This paper describes a new method of mask compaction to formulate a mixed integer linear programming problem from a user defined stick diagram. By solving this mixed integer program, a compacted and design rule violation free layout is obtained. Also, a new efficient algorithm is given which solves the longest problem in the constraint graph.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.209-212
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• 2002

As the mask design rules get smaller, the probability of the process failure becomes higher doc to the narrow overlay margin between the contact and metal interconnect layers. To obtain the minimum process margin, a tabbing and cutting method Is applied with the rule based optical\ulcorner proximity correction to the metal layer, so that the protection to bridge problems caused by the insufficient space margin between the metal layers can be accomplished. The side-lobe phenomenon from the attenuated phase shift mask with the tight design rule is analyzed through the aerial image simulation for test patterns with variation of the process parameters such as numerical aperture, transmission rate, and partial coherence. The corrected patterns are finally generated by the rules extracted from the side-lobe simulation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.7
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• pp.37-41
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• 2004

We have formulated an empirical analytic model for the static characteristics of implanted vertical-cavity surface-emitting lasers (VCSELs). Specifically, we have derived analytic formulas for the threshold current, slope efficiency, dynamic resistance, and the output power and forward voltage at the operation current of 12 ㎃ in terms of the implant and metal-aperture radii by fitting the measured results. The radii of the metal aperture and implant mask of the 850 nm VCSELs range from 4 to 12.5 ${\mu}{\textrm}{m}$ and 7 to 17.5 ${\mu}{\textrm}{m}$ respectively. The model shows the way of tailoring the VCSEL characteristics by changing the mask dimensions only.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.958-961
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• 1999

A new image encoding and identification scheme is proposed for security verification by using CGH(computer generated hologram), random phase mask, and correlation technique. The encrypted image, which is attached to the security product, is made by multiplying QPH(quadratic phase hologram) using SA(simulated annealing) algorithm with a random phase function. The random phase function plays a role of key when the encrypted image is decrypted. The encrypted image could be optically recovered by 2-f system and automatically verified for personal identification. Simulation results show the proposed method cand be used for the reconstruction and the recognition of the encrypted. Image.

• Journal of the Optical Society of Korea
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• v.11 no.1
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• pp.40-43
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• 2007

We propose a taper-underlaid spot-size converter (TU-SSC) with an offset which consists of two vertically stacked taper layers. The designed TU-SSC reduces coupling loss of a high index-contrast waveguide with $1.5%{\Delta}$ to a single mode fiber from 1.5 dB to 0.27 dB. We also considered the effects of mask misalignment in the fabrication process of TU-SSC, and optimized the design of TU-SSC so that the additional loss of TU-SSC for the mask misalignment of $3{\mu}m$ in the photo-lithography process was as low as 0.13 dB.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.115-121
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• 1995

A mask for x-ray lithography is fabricated with SiN membrane and WTi absorber. SiN membrane is deposited by plasma enhanced chemical vapor deposition, and the stress of SiN membrane is controlled to be less than 100 MPa by rapid thermal annealing. WTi absorber is reactively deposited by DC-magnetron type sputter, and the working gases are argon and nitrogen. Added nitrogen is contributed to the stress of WTi absorber. The stress of WTi absorber is controlled to be less than $\pm$ 100 MPa by controlling the deposition pressure. 10$\mu$m WTi pattern is delineated on SiN membrane by dry etching technique.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.173-183
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• 1995

Blue light of 0.15mW at 417.6nm is generated in a quasi-phase-matched LITaO$_{3}$ optical waveguide. A new heat-treatment technique using a metal-oxide mask is proposed to fabricate the periodic domain-inverted grating with less degraded optical properties. The mask promotes the proton indiffusion by inhibition of the proton outdiffusion during the heat treatment. It reduces the amount of the initial proton exchange for the domain inversion and prevents the formation of crystal defects on the surface accompanied by the proton outdiffusion. Consequently, it minimizes the degradation of nonlinear coefficient and scattering loss caused by the initial proton exchange.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.543-544
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• 2006

Pentacene thin film transistors fabricated without photolithographic patterning were fabricated on the plastic substrates. Both the organic/inorganic thin films and metallic electrode were patterned by shifting the position of the shadow mask which accompanies the substrate throughout the deposition process. By using an optically transparent zirconium oxide ($ZrO_2$) as a gate insulator and octadecyltrimethoxysilane (OTMS) as an organic molecule for self-assembled monolayer (SAM) to increase the adhesion between the plastic substrate and gate insulator and the mobility with surface treatment, high-performance transistor with field effect mobility $.66\;cm^2$/V s and $I_{on}/I_{off}$>$10^5$ was formed on the plastic substrate. This technique will be applicable to all structure deposited at low temperature and suitable for an easy process for flexible display.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.12
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• pp.43-50
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• 1993

Three-dimensional simulator for the ion implantation process is developed. The simulator based on an analytical model which would be a choice with high computational efficiency and accuracy. This is an important issue for the simulation of a numerous number of processing steps required in the fabrication of ULSI or GSI. The model can explain scattering and bulk channeling mechanism (1D). It can also explain depth dependent lateral diffusion effect(2D) and mask effect(3D). The model is consist of one-dimensional JPD(Joined Pearson Distribution) function and two-dimensional modified Gaussian functions. Final implanted profiles under typical mask structures such as hole, line and island structure are obtained with varying ion species.