• 지능정보연구
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• 제29권4호
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• pp.271-286
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• 2023

COVID-19 팬데믹의 확산은 마스크를 일상생활에서의 필수품으로 변화시켰으며, 마스크에 대한 대중의 인식과 행동에 큰 변화를 일으켰다. 마스크 착용 의무의 완화가 진행되고 있는 가운데, 여전히 많은 사람들이 마스크 착용을 유지하며, 마스크를 개인의 개성과 정체성을 표현하는 패션 수단으로 활용하는 추세가 나타나고 있다. 그러나 마스크와 관련된 기존 연구는 주로 마스크의 감염 예방 효과나 팬데믹 상황에서의 채택 태도를 탐구하는 등 제한된 분야에 국한되어 있어, 마스크 디자인에 대한 소비자 선호도를 이해하기 위한 연구의 필요성이 대두되고 있다. 본 연구는 마스크의 접이 방식에 따라 마스크 디자인을 수평 접이형 마스크와 수직 접이형 마스크 두 가지 유형으로 구분하고, 각각의 디자인에 대한 소비자 지각과 선호도를 설문 및 시선 추적 방법론을 활용하여 조사하였다. 소비자 설문에 대한 T 검정을 수행한 결과, 수직 접이형 마스크가 수평 접이형 마스크 대비 소비자에게 선호되며, 독특성, 세련미, 입체감, 생동감이 높게 평가되는 경향이 나타났다. 이후, 수직 접이형 마스크가 매력적으로 인식되는 원인을 실증적으로 이해하기 위해 각 마스크 디자인에 대한 아이트래킹 분석을 수행하고, 마스크 디자인 별 시선 패턴의 차이를 도출하였다. 본 연구는 마스크 관련 연구의 범위를 감염 예방 효과 검증 등의 제한적인 영역에서 나아가, 소비자의 디자인 지각 및 평가 영역까지 확장한 점, 마스크의 접이 방식이라는 디자인 요소가 소비자의 지각, 태도 및 생리적 반응에 미치는 잠재적 영향력을 설명하고자 한 점에서 이론적인 공헌이 있으며, 소비자에게 선호되는 마스크 디자인을 위한 의사결정을 지원할 수 있다는 측면에서 실무적인 함의가 있다.

• 대한전자공학회논문지
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• 제13권3호
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• pp.22-27
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• 1976

집적회로(I.C)의 설계에 있어서는 평수구조의 변형만이 가능하므로 여러가지 다른 트랜지스터 (Transistor)가 결합하여 하나의 특정한 기능을 발휘하게 되는 선형회로에는 회로의 설계와 동시에 사용될 적층(EPI)의 비저항 및 두께와 적층(EPI)과 기판 사이에 삽입되는 이침층(Buried Layer)의 구조 등을 정확히 알아야 한다. 본 연구에서는 집적회로의 동작전압과 적층 두께및 비저항과의 관계를 실측치와 비교분석 하였고 이 결과를 선형 집적회로 설계에 이용 가능하도록 도시하였다. For linear IC design, one has to know the epi thickness, resistivity, and structure of buried island inserted between epi and substrate because the mask structure can only be changed for linear IC consisted of various type of transistors to be made for desired specific function. The interrelation of IC operational and saturation voltages with epi resistivity, theckness and divice structure are studied and presented in graphic forms so that IC design engineers can utilize them.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.130-133
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• 2003

Vertical Colour Selection (VCS) is an option for slim CRTs with increased sharpness and brightness. The direction of self-convergence of the DY is changed to vertical in order to obtain better spot uniformity, but the line scan direction remains horizontal. Hence, no video conversion is needed, contrary to transposed scan. In this paper we address two issues: First, there is a high risk of moire, since the scan lines and the phosphor stripes are parallel. We propose a feedback mechanism guiding the electron beams towards the middle of the mask slots. As positive side effects, the brightness is improved and the shadow mask can be made of a cheap type of steel. Secondly, VCS deflection coils have to satisfy different requirements than coils in ordinary CRTs. We discuss the design rules for self-convergent VCS coils and present simulation results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.18-21
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• 2002

As the mask design rules get smaller, the probability of the process failure becomes higher due to the narrow overlay margin between the contact and metal interconnect layers. To obtain the minimum process margin, a tabbing and cutting method is applied with the rule based optical proximity correction to the metal layer, so that the protection to bridge problems caused by the insufficient space margin between the metal layers can be accomplished. The side-lobe phenomenon from the attenuated phase shift mask with the tight design nile is analyzed through the aerial image simulation for test patterns with variation of the process parameters such as numerical aperture, transmission rate, and partial coherence. The corrected patterns are finally generated by the rules extracted from the side-lobe simulation.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.79-94
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• 2002

Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.209-212
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• 2002

As the mask design rules get smaller, the probability of the process failure becomes higher doc to the narrow overlay margin between the contact and metal interconnect layers. To obtain the minimum process margin, a tabbing and cutting method Is applied with the rule based optical\ulcorner proximity correction to the metal layer, so that the protection to bridge problems caused by the insufficient space margin between the metal layers can be accomplished. The side-lobe phenomenon from the attenuated phase shift mask with the tight design rule is analyzed through the aerial image simulation for test patterns with variation of the process parameters such as numerical aperture, transmission rate, and partial coherence. The corrected patterns are finally generated by the rules extracted from the side-lobe simulation.

• Journal of the Optical Society of Korea
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• 제11권1호
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• pp.40-43
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• 2007

We propose a taper-underlaid spot-size converter (TU-SSC) with an offset which consists of two vertically stacked taper layers. The designed TU-SSC reduces coupling loss of a high index-contrast waveguide with $1.5%{\Delta}$ to a single mode fiber from 1.5 dB to 0.27 dB. We also considered the effects of mask misalignment in the fabrication process of TU-SSC, and optimized the design of TU-SSC so that the additional loss of TU-SSC for the mask misalignment of $3{\mu}m$ in the photo-lithography process was as low as 0.13 dB.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.8-11
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• 2007

The new technologies in mobile display developed in SEC are briefly reviewed. For a differentiation, SEC's LTPS line is based on SLS (Sequential Lateral Solidification) technology. In this paper, the characteristics of SEC's SLS in recent and future mobile displays were discussed. The microstructure produced by SLS crystallization is dependent on SLS process conditions such as mask design, laser energy density, and pulse duration time. The microstructure and TFT (Thin Film Transistor) performance are closely related. For an optimization of TFT performance, SLS process condition should be adjusted. Other fabrication processes except crystallization such as blocking layer, gate insulator deposition and cleaning also affect TFT performance. Optimized process condition and tailoring mask design can make it possible to produce high quality AMOLED devices. The TFT non-uniformity caused by laser energy density fluctuation could be successfully diminished by mixing technology.

• 패션비즈니스
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• 제26권6호
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• pp.105-115
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• 2022

Wearing a mask is still advised since COVID-19 continues to spread. However, masks may also irritate the skin and cause mask acne, often known as "maskne", which is a type of acne mechanica caused by friction between the skin and clothing. Therefore, there is a need to develop an effective maskne cosmetic. In this study, we made the maskne cosmetics containing humulus lupulus extract and copper tripeptide-1 and investigated its stability and safety. To measure stability, a centrifugation test and heat-cool cycling were done, and changes in viscosity and pH were measured for 8 weeks. The Cumulative Irritation Test (CIT, WKIRB-202111-HR-096) was performed and positive reactions were determined by the ICDRG criteria. The results indicated that the samples were stable after centrifugation, temperature cycling, viscosity, and pH tests. In addition, cosmetic safety test results revealed that maskne cosmetics containing humulus lupulus extract and copper tripeptide-1 did not cause any skin responses. These findings indicate that prepared maskne cosmetics' stability and safety were comparable to those of currently available commercial cosmetics.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.385-387
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• 2002

The electron beam simulation technology is indispensable for the recent electron gun design. The technology is becoming more and more important for deflection yoke (DY) design and investigation of the interference effects between gun and DY. Further, it may become vital even for shadow mask, glass funnel, exposure lens and magnetic shield.