• Journal of the Korean Wood Science and Technology
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• v.32 no.2
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• pp.90-95
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• 2004

Pitch pine (Pinus rigida) has been planted in Korean forests for several decades, primarily for erosion control and use as a fuel supply. To enhance its value, and especially potential use as lamina for structural glued laminated timber (glulam), log quality and lumber yield of pitch pine were evaluated in this study. Trees from pure pitch pine stands with an average diameter at breast height of 32 cm were felled and bucked into 3.6m long 15 cm minimum butt-end diameter logs. Over 80% of the logs were classified to No.2 or No.3 visual grade group. Upon sawing total lumber yield was 55.2%, 39.9% for structural glulam lamina, 7.2% for louver, and 8.1% for miscellaneous use. The final lumber yield for manufacturing structural glulam, after cross-cutting to eliminate knots and finger jointing, was only 15.3%. To enhance this manufacturing yield requires that the rate of knot-included lumber used as lamina be raised. However arrangement of the knot-included lamina, whose mechanical properties need to be accurately evaluated, must be optimized to minimize any reduction to the structural glulam strength. The log quality and lumber yield of pitch pine evaluated in this study are expected to facilitate proper planning for wood product manufacture in the Korean lumbering and glulam industrial field, which has not previously dealt with this species.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.4
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• pp.23-29
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• 2001

The compression behavior of semi-solid materials is studied from a viewpoint of yield criteria and analysis methods. To describe the behavior of materials in semi-solid state, several theories have been proposed by extending the concept of plasticity of porous compressible materials. In the present work, the upper-bound method and the finite element method are used to model the simple compression process using yield criteria of Kuhn and Doraivelu. Segregation between solid and liquid which cause defect of product is analysed for Sn-15%Pb and A356 alloys during deformation in semi-solid state. The comparison of analyses is made according to yield criteria and analysis methods. In addition, the analysis result for semi-solid dendritic Sn-15%Pb alloy is compared with the experimental result of Charreyron et al..

• Structural Engineering and Mechanics
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• v.58 no.4
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• pp.661-676
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• 2016

This paper presents an elastic/plastic model that neglects strain hardening during loading, but accounts for the Bauschinger effect. These mathematical features of the model represent reasonably well the actual behavior of several materials such as high strength steels. Previous attempts to describe the behavior of this kind of materials have been restricted to a class of boundary value problems in which the state of stress in the plastic region is completely controlled by the yield stress in tension or torsion. In particular, the yield stress is supposed to be constant during loading and the forward plastic strain reduces the yield stress to be used to describe reversed yielding. The new model generalizes this approach on plane stress problems assuming that the material obeys the von Mises yield criterion during loading. Then, the model is adopted to describe reversed yielding in thin hollow discs subject to external pressure.

• ETRI Journal
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• v.36 no.2
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• pp.301-308
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• 2014

Three-dimensional integration technology results in area savings, platform power savings, and an increase in performance. Through-silicon via (TSV) assembly and manufacturing processes can potentially introduce defects. This may result in increases in manufacturing and test costs and will cause a yield problem. To improve the yield, spare TSVs can be included to repair defective TSVs. This paper proposes a new built-in self-test feature to identify defective TSV channels. For defective TSVs, this paper also introduces dynamic self-repair architectures using code-based and hardware-mapping based repair.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.6
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• pp.1-11
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• 1998

This paper presents performance analyses of three types of the cylindrical-type ER(electro-rheo-logical) valves, which have different electrode length and width but same electrode area. Following the composition of silicone oil-based ER fluid, the field-dependent yield stresses are obtained from experimental investigation on the Bingham property of the ER fluid. The ER valve which is dependent on the applied electric field is devised and its theoretical model is derived. On the basis of the pressure-drop analysis, three types of the ER valves are designed and manufactured. After experimentally evaluation field-dependent pressure drops, PI controller is formulated to achieve tracking control on desired pressure drop. The controller is then experimentally implemented and tracking control performance is presented in order to demonstrate superior controllability of the ER valve. In addition, the response characteristic of the ER valve with respect to the excitation frequency of the electric fiedls is provided to show the feasibility of practical application.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.3 no.1
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• pp.84-89
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• 2004

This study is a basic one for application of ER Fluid to fluid power systems. By mixing silicone oil with zeolite particles, four kinds of ER fluids were made, in which the weight ratio of zeolite particles are different. We examined how the Yield shear stress and Bingham characteristics of the ER fluids are effected by varying electric field intensity. We designed and constructed a disk type power transmission clutch in which ER fluid fills and this ER fluid transmits the power of drive shaft to the driven shaft. With this equipment, the revolution transmission ratio from the chive shaft to the driven shaft by varying electric field density of the ER fluid was examined.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.55-60
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• 2020

The hard mask photo-resist strip inspection system for the semiconductor wafer manufacturing process inspects the position of the circuit pattern formed on the wafer by measuring the distance from the edge of the wafer to the strip processing area. After that, it is an inspection system that enables you to check the process status in real time. Process defects can be significantly reduced by applying a tester that has not been applied to the existing wafer strip process, edge etching process, and wafer ashing process. In addition, it is a technology for localizing semiconductor process inspection equipment that can analyze the outer diameter of the wafer and the state of pattern formation, which can secure process stability and improve wafer edge yield.

• IE interfaces
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• v.23 no.3
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• pp.205-212
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• 2010

The learning curve model is a mathematical form which represents the relationship between the manufacturing experience and its effectiveness. The semiconductor manufacturing is widely known as an appropriate example for the learning effect due to its complicated manufacturing processes. In this paper, I propose a new compound learning curve model for semiconductor products in which the general learning curve model and the growth curve are composed. The dependent variable and the effective independent variables of the model were abstracted from the existing learning curve models and selected according to multiple regression processes. The simulation results using the historical DRAM data show that the proposed compound learning curve model is one of adequate models for describing learning effect of semiconductor products.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.397-401
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• 2008

Most of the topic in PCB industry was about increasing the volume of product for the development of electronics in numerous industrial application area. However, it has been emerged that yield improvement quality manufacturing via detecting any suspicious process in order to minimize the scrapped product and material waste. In addition, recently, restriction of hazardous substances (RoHS) claims that electronic manufacturing environment should reduce the harmful chemicals usage, thus the importance of monitoring copper etchant and detecting any mis-processing is crucial for electronics manufacturing. In this paper, we have developed real-time chemical monitoring system using RGB sensor, which is simpler but more accurate method than commercially utilized oxidation reduction potential (ORP) technique. The developed Cu etchant monitoring system can further be utilized for copper interconnect process in future nano-semiconductor process.

• Journal of Korean Institute of Industrial Engineers
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• v.40 no.4
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• pp.404-414
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• 2014

Yield prediction is important to manage semiconductor quality. Many researches with machine learning algorithms such as SVM (support vector machine) are conducted to predict yield precisely. However, yield prediction using SVM is hard because extremely imbalanced and big data are generated by final test procedure in semiconductor manufacturing process. Using SVM algorithm with imbalanced data sometimes cause unnecessary support vectors from major class because of unselected support vectors from minor class. So, decision boundary at target class can be overwhelmed by effect of observations in major class. For this reason, we propose a under-sampling method with minor class based SVM (MCSVM) which overcomes the limitations of ordinary SVM algorithm. MCSVM constructs the model that fixes some of data from minor class as support vectors, and they can be good samples representing the nature of target class. Several experimental studies with using the data sets from UCI and real manufacturing process represent that our proposed method performs better than existing sampling methods.