• Title/Summary/Keyword: Manufacturing Yield

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TFT-LCD 산업에서의 품질마이닝 시스템

  • Lee, Hyeon-U;Nam, Ho-Su;Choe, Gyeong-Ho
    • Proceedings of the Korean Society for Quality Management Conference
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    • 2006.04a
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    • pp.142-148
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    • 2006
  • Data mining is a useful tool for analyzing data from different perspectives and for summarizing them into useful information. Recently, the data mining methods are applied to solving quality problems of the manufacturing processes. This paper discusses the problems of construction of a quality mining system, which is based on the various data mining methods. The quality mining system includes recipe optimization, significant difference test, finding critical processes, forecasting the yield. The contents and system of this paper are focused on the TFT-LCD manufacturing process. We also provide some illustrative field examples of the quality mining system.

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Advancement of Sequential Particle Monitoring System (측정점 교환방식 미세입자 모니터링 시스템 고도화)

  • An, Sung Jun
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.1
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    • pp.17-21
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    • 2022
  • In the case of the manufacturing industry that produces high-tech components such as semiconductors and large flat panel displays, the manufacturing space is made into a cleanroom to increase product yield and reliability, and various environmental factors have been managed to maintain the environment. Among them, airborne particle is a representative management item enough to be the standard for actual cleanroom grade, and a sequential particle monitoring system is usually used as one parts of the FMS (Fab or Facility monitoring system). However, this method has a problem in that the measurement efficiency decreases as the length of the sampling tube increases. In this study, in order to solve this problem, a multiple regression model was created. This model can correct the measurement error due to the decrease in efficiency by sampling tube length.

Finite Element Analysis of Powder Injection Molding Filling Process Including Yield Stress and Slip Phenomena (항복응력과 미끄럼현상을 고려한 분말사출성형 충전공정의 유한요소해석)

  • 박주배;권태헌
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.17 no.6
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    • pp.1465-1477
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    • 1993
  • Powder Injection Molding(PM) is an advanced and complicated technology for manufacturing ceramic or metal products making use of a conventional injection molding process, which is generally used for plastic products. Among many technologies involved in the successful PIM, injection molding process is one of the key steps to form a desired shape out of powder/binder mixtures. Thus, it is of great importance to have a numerical tool to predict the powder injection molding filling process. In this regard, a finite element analysis system has been developed for numerical simulations of filling process of powder injection molding. Powder/polymer mixtures during the filling pro cess of injection molding can be rheologically characterized as Non-Newtonian fluids with a so called yield phenomena and have a peculiar feature of apparent slip phenomena on the wall boundaries surrounding mold cavity. Therefore, in the present study, a physical modeling of the filling process of powder/polymer mixtures was developed to take into account both the yield stress and slip phenomena and a finite element formulation was developed accordingly. The numerical analysis scheme for filling simulation is accomplished by combining a finite element method with control volume technique to simulate the movement of flow front and a finite difference method to calculate the temperature distribution. The present study presents the modeling, numerical scheme and some numerical analysis results showing the effect of the yield stress and slip phenomena.

Study on Tensile Properties of AlSi10Mg produced by Selective Laser Melting (SLM 공정 기법으로 제작한 AlSi10Mg 인장특성에 관한 연구)

  • Kim, Moosun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.12
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    • pp.25-31
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    • 2018
  • Selective Laser Melting is one of the representative 3D printing techniques for handling metal materials. The main factors influencing the characteristics of structures fabricated by the SLM method include the build-up angle of structures, laser power, laser scan speed, and scan spacing. In this study, the tensile properties of AlSi10Mg alloys were investigated by considering the build-up angle of tensile test specimens, laser scanning speed and scan spacing as variables. The yield stress, tensile strength, and elongation were considered as tensile properties. From the test results, it was confirmed that the yield stress values were lowered in the order of 0, 45, and 90 based on the manufacturing direction of the tensile specimen. The maximum yield stress value was obtained at 1870 mm / min based on the laser scan speed. The yield stress size decreased with decreasing scan speed. Based on the laser scan spacing, as the value increases, the yield stress increases, but the variation is smaller than the other test criteria. The tendency of the tensile strength and elongation variation depending on the test conditions was difficult to understand.

Analysis of Thermal Shock in Tool Steels for Hot Forging (열간단조 금형강의 열충격특성연구)

  • Kim, J.W.;Kim, B.J.;Jo, I.S.;Moon, Y.H.
    • Journal of the Korean Society for Heat Treatment
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    • v.14 no.3
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    • pp.155-159
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    • 2001
  • The thermal shock resistance has been investigated and compared in three hot-work tool steels. The resistance to thermal shock is first of all a matter of good toughness and ductility. Therefore, a proper hot-work tool steel should be characterized by high fracture strength and high temperature toughness. In this study, new test method is proposed to measure the thermal shock resistance. New method is basically based on Uddeholm' thermal shock test but some modification has been properly applied. Based on these results, some critical temperature($T_{fractures}$) at which fracture occur can be measured to characterize the thermal resistance of the materials. The specific values of ${\Delta}T$, the temperature difference between holding temperature and $T_{fractures}$, has been successfully used as a measure of the thermal shock resistance in this study, the results showed that the thermal shock method used in this study was properly modified.

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A Study on Laser-Assisted Machining Process of Silicon Nitride (질화규소의 Laser-Assisted Machining 공정에 관한 연구)

  • Lim, Se-Hwan;Lee, Jae-Hoon;Shin, Dong-Sig;Kim, Jong-Do;Kim, Joo-Hyun
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.5
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    • pp.48-56
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    • 2009
  • In this paper, laser-assisted machining(LAM) has been employed to machine hot isostatically pressed (HIPed) Si3N4 work pieces. Due to little residual flaws and porosity, HIPed $Si_3N_4$ work pieces are more difficult to machine compared to normally sintered $Si_3N_4$ workpieces. In LAM, the intense energy of laser was used to enhance machinability by locally heating the workpiece and thus reducing yield strength. In experiments, the laser power ranges from 200W to 800W and the diameter of work pieces is 16mm. While machining, the surface temperature was kept nearly constant by laser heating except for a short period of rise time of max. 58 seconds. Results showed as feed rate increases the surface temperature of $Si_3N_4$ workpieces decreases slightly, whereas the effect of depth of cut is disregardable. With a laser power of 800W, achievable maximal depth of cut as 0.7mm and feed rate was 0.03mm/rev.

Prediction of thermal shock failure of glass during PDP manufacturing process (PDP 제조 공정시 유리의 열충격 파손 예측)

  • 김재현;최병익;이학주
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.2
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    • pp.122-129
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    • 2004
  • There is an increasing need for large flat panel display devices. PDP (Plasma Display Panel) is one of the most promising candidates for this need. Thermal shock failure of PDP glass during manufacturing process is a critical issue in PDP industry since it is closely related to the product yield and the production speed. In this study, thermal shock resistance of PDP glass is measured by water quenching test and an analysis scheme is described for estimating transient temperature and stress distributions during thermal shock. Based on the experimental data and the analysis results, a simple procedure for predicting the thermal shock failure of PDP glass is proposed. The fast cooling process for heated glass plates can accelerate the speed of PDP production, but often leads to thermal shock failure of the glass plates. Therefore, a design guideline for preventing the failure is presented from a viewpoint of high speed PDP manufacturing process. This design guideline can be used for PDP process design and thermal -shock failure prevention.

Feature Based Decision Tree Model for Fault Detection and Classification of Semiconductor Process (반도체 공정의 이상 탐지와 분류를 위한 특징 기반 의사결정 트리)

  • Son, Ji-Hun;Ko, Jong-Myoung;Kim, Chang-Ouk
    • IE interfaces
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    • v.22 no.2
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    • pp.126-134
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    • 2009
  • As product quality and yield are essential factors in semiconductor manufacturing, monitoring the main manufacturing steps is a critical task. For the purpose, FDC(Fault detection and classification) is used for diagnosing fault states in the processes by monitoring data stream collected by equipment sensors. This paper proposes an FDC model based on decision tree which provides if-then classification rules for causal analysis of the processing results. Unlike previous decision tree approaches, we reflect the structural aspect of the data stream to FDC. For this, we segment the data stream into multiple subregions, define structural features for each subregion, and select the features which have high relevance to results of the process and low redundancy to other features. As the result, we can construct simple, but highly accurate FDC model. Experiments using the data stream collected from etching process show that the proposed method is able to classify normal/abnormal states with high accuracy.

Study on the FPCS for Photoresist Coating of Semiconductor Manufacturing Process (반도체 생산공정의 감광액 도포를 위한 FPCS에 관한 연구)

  • Park, Hyoung-Keun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.9
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    • pp.4467-4471
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    • 2013
  • In this research, developed full-scan photoresist coating system(FPCS) can improve the efficiency of the photoresist coating system essential for spinner equipment in nano semiconductor manufacturing process. The devices developed in this research, which can be swiftly replaced in case abnormal state element changes or wafer manufacturing defect occurs, are anticipated to improve module yield as well as real-time monitoring on the state element in order to prevent the complex process defect due to the photoresist miss coating.

Quantitative Analysis of Dammarane-type Ginsenosides in Different Ginseng Products

  • Lee, Dong Gu;Quilantang, Norman G.;Lee, Ju Sung;Geraldino, Paul John L.;Kim, Hyun Young;Lee, Sanghyun
    • Natural Product Sciences
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    • v.24 no.4
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    • pp.229-234
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    • 2018
  • Ginseng products available in different forms and preparations are reported to have varied bioactivities and chemical compositions. In our previous study, four new dammarane-type ginsenosides were isolated from Panax ginseng, which are ginsenoside Rg18 (1), 6-acetyl ginsenoside Rg3 (2), ginsenoside Rs11 (3), and ginsenoside Re7 (4). Accordingly, the goal of this study was to determine the distribution and content of these newly characterized ginsenosides in different ginseng products. The content of compounds 1 - 4 in different ginseng products was determined via HPLC-UV. The samples included ginseng roots from different ginseng species, roots harvested from different localities in Korea, and samples harvested at different cultivation ages and processed under different manufacturing methods. The four ginsenosides were present at varying concentrations in the different ginseng samples examined. The variations in their content could be attributed to species variation, and differences in cultivation conditions and manufacturing methods. The total concentration of compounds 1 - 4 were highest in ginseng obtained from Geumsan ($185{\mu}g/g$), white-6 yr ginseng ($150{\mu}g/g$), and P. quinquefolius ($186{\mu}g/g$). The results of this study provide a basis for the optimization of cultivation conditions and manufacturing methods to maximize the yield of the four new ginsenosides in ginseng.