• 제목/요약/키워드: Manufacturing Defect

검색결과 413건 처리시간 0.024초

반도체 생산공정의 감광액 도포를 위한 FPCS에 관한 연구 (Study on the FPCS for Photoresist Coating of Semiconductor Manufacturing Process)

  • 박형근
    • 한국산학기술학회논문지
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    • 제14권9호
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    • pp.4467-4471
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    • 2013
  • 본 연구에서는 Nano급 반도체 생산공정에서 필수적인 스피너(spinner) 설비의 감광액 도포(photo resist coating)시스템의 효율을 획기적으로 개선할 수 있는 새로운 완전스캔(Full-scan) 방식의 감광액 도포시스템(FPCS : Full-scan Photo-resist Coating System)을 개발하였다. 또한, 감광액의 미 도포로 인한 복합적인 공정불량을 예방하기 위하여 실시간(real-time)으로 상태요소들을 감시할 뿐만 아니라 상태요소의 비정상적 변화나 웨이퍼 가공불량이 발생할 경우 해당 유니트(unit)를 정지시킴과 동시에 원격지에 있는 엔지니어에게 경보를 전송함으로써 즉각적인 대처가 가능할 수 있도록 개발하였다.

A Study on the Fault Process and Equipment Analysis of Plastic Ball Grid Array Manufacturing Using Data-Mining Techniques

  • Sim, Hyun Sik
    • Journal of Information Processing Systems
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    • 제16권6호
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    • pp.1271-1280
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    • 2020
  • The yield and quality of a micromanufacturing process are important management factors. In real-world situations, it is difficult to achieve a high yield from a manufacturing process because the products are produced through multiple nanoscale manufacturing processes. Therefore, it is necessary to identify the processes and equipment that lead to low yields. This paper proposes an analytical method to identify the processes and equipment that cause a defect in the plastic ball grid array (PBGA) during the manufacturing process using logistic regression and stepwise variable selection. The proposed method was tested with the lot trace records of a real work site. The records included the sequence of equipment that the lot had passed through and the number of faults of each type in the lot. We demonstrated that the test results reflect the real situation in a PBGA manufacturing process, and the major equipment parameters were then controlled to confirm the improvement in yield; the yield improved by approximately 20%.

XAI(eXplainable Artificial Intelligence) 알고리즘 기반 사출 공정 수율 개선 방법론 (Injection Process Yield Improvement Methodology Based on eXplainable Artificial Intelligence (XAI) Algorithm)

  • 홍지수;홍용민;오승용;강태호;이현정;강성우
    • 품질경영학회지
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    • 제51권1호
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    • pp.55-65
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    • 2023
  • Purpose: The purpose of this study is to propose an optimization process to improve product yield in the process using process data. Recently, research for low-cost and high-efficiency production in the manufacturing process using machine learning or deep learning has continued. Therefore, this study derives major variables that affect product defects in the manufacturing process using eXplainable Artificial Intelligence(XAI) method. After that, the optimal range of the variables is presented to propose a methodology for improving product yield. Methods: This study is conducted using the injection molding machine AI dataset released on the Korea AI Manufacturing Platform(KAMP) organized by KAIST. Using the XAI-based SHAP method, major variables affecting product defects are extracted from each process data. XGBoost and LightGBM were used as learning algorithms, 5-6 variables are extracted as the main process variables for the injection process. Subsequently, the optimal control range of each process variable is presented using the ICE method. Finally, the product yield improvement methodology of this study is proposed through a validation process using Test Data. Results: The results of this study are as follows. In the injection process data, it was confirmed that XGBoost had an improvement defect rate of 0.21% and LightGBM had an improvement defect rate of 0.29%, which were improved by 0.79%p and 0.71%p, respectively, compared to the existing defect rate of 1.00%. Conclusion: This study is a case study. A research methodology was proposed in the injection process, and it was confirmed that the product yield was improved through verification.

제조물책임법 입증책임에 관한 연구 (Study on Proof of Product Liability Act)

  • 김은빈;하충룡
    • 무역학회지
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    • 제44권6호
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    • pp.135-150
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    • 2019
  • Under the Manufacturing Liability Act, consumers want to be protected from manufacturers by mitigating burden of proof as an important target to be protected. However, due to the complexity of the product, it is very difficult for consumers to prove defects from the manufacturing defect. This situation has led to a major revision of the Manufacturing Liability Act, which mitigates the burden of proof of consumers by applying fruitless liability. The Manufacturing Liability Act is comparable to the U.S., which has strong consumer rights and is protected by the Manufacturing Liability Act. The burden of proof can be regarded as the most necessary content for consumers within the manufacturing product liability law when responding to manufacturing defects. The U.S. intends to provide implications for achieving consumer protection in Korea's Manufacturing Liability Act by imitating the U.S. based on the burden of proof. Case comparison regarding burden of proof can be conducted based on various criteria, including criteria for each product and key features for determining the importance of the manufacturing product liability law. The Act on the Responsibility of Korean Manufacturing Products for the Protection of Consumers was developed based on the assessment criteria, and a remedy was proposed to protect consumers who suffered from manufacturing defects.

The Scanning Laser Source Technique for Detection of Surface-Breaking and Subsurface Defect

  • Sohn, Young-Hoon;Krishnaswamy, Sridhar
    • 비파괴검사학회지
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    • 제27권3호
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    • pp.246-254
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    • 2007
  • The scanning laser source (SLS) technique is a promising new laser ultrasonic tool for the detection of small surface-breaking defects. The SLS approach is based on monitoring the changes in laser-generated ultrasound as a laser source is scanned over a defect. Changes in amplitude and frequency content are observed for ultrasound generated by the laser over uniform and defective areas. The SLS technique uses a point or a short line-focused high-power laser beam which is swept across the test specimen surface and passes over surface-breaking or subsurface flaws. The ultrasonic signal that arrives at the Rayleigh wave speed is monitored as the SLS is scanned. It is found that the amplitude and frequency of the measured ultrasonic signal have specific variations when the laser source approaches, passes over and moves behind the defect. In this paper, the setup for SLS experiments with full B-scan capability is described and SLS signatures from small surface-breaking and subsurface flaws are discussed using a point or short line focused laser source.

Via 이동을 통한 결함 민감 지역 감소를 위한 시뮬레이티드 어닐링 (Simulated Annealing for Reduction of Defect Sensitive Area Through Via Moving)

  • 이승환;손소영
    • 대한산업공학회지
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    • 제28권1호
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    • pp.57-62
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    • 2002
  • The semiconductor industry has continuously been looking for the ways to improve yield and to reduce manufacturing cost. The layout modification approach, one of yield enhancement techniques, is applicable to all design styles, but it does not require any additional resources in terms of silicon area. The layout modification method for yield enhancement consists of making local variations in the layout of some layers in such a way that the critical area, and consequently the sensitivity of the layer to point defects, is reduced. Chen and Koren (1995) proposed a greedy algorithm that removes defect sensitive area using via moving, but it is easy to fall into a local minimum. In this paper, we present a via moving algorithm using simulated annealing and enhance yield by diminishing defect sensitive area. As a result, we could decrease the defect sensitive area effectively compared to the greedy algorithm presented by Chen and Koren. We expect that the proposed algorithm can make significant contributions on company profit through yield enhancement.

단결정 실리콘 잉곳 결정성장 속도에 따른 고-액 경계면 형성 및 Defect 최적화 (Melt-Crystal Interface Shape Formation by Crystal Growth Rate and Defect Optimization in Single Crystal Silicon Ingot)

  • 전혜준;박주홍;블라디미르 아르테미예프;정재학
    • Current Photovoltaic Research
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    • 제8권1호
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    • pp.17-26
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    • 2020
  • It is clear that monocrystalline Silicon (Si) ingots are the key raw material for semiconductors devices. In the present industries markets, most of monocrystalline Silicon (Si) ingots are made by Czochralski Process due to their advantages with low production cost and the big crystal diameters in comparison with other manufacturing process such as Float-Zone technique. However, the disadvantage of Czochralski Process is the presence of impurities such as oxygen or carbon from the quartz and graphite crucible which later will resulted in defects and then lowering the efficiency of Si wafer. The heat transfer plays an important role in the formation of Si ingots. However, the heat transfer generates convection in Si molten state which induces the defects in Si crystal. In this study, a crystal growth simulation software was used to optimize the Si crystal growth process. The furnace and system design were modified. The results showed the melt-crystal interface shape can affect the Si crystal growth rate and defect points. In this study, the defect points and desired interface shape were controlled by specific crystal growth rate condition.

제조 실행 시스템 기반 정밀 가공 생산 시스템 연구 (Research on Precision Processing Production System based on Manufacturing Execution System)

  • 신성욱;이현무;박승호
    • 디지털정책학회지
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    • 제2권4호
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    • pp.17-23
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    • 2023
  • 본 논문에서는 중소 규모의 정밀 가공 기업에 대한 생산 가공의 개선을 위하여 기존 공정 방식에 제조 실행 시스템을 적용하고 정밀가공의 데이터를 통합하였다. 이에 따른 기업 내 공정 관리 시스템의 강화, 장비 운용 효율의 증대, 불량률 감소를 통한 생산성 향상 및 작업 공수 감소에 따른 원가 절감률의 차이를 비교 분석하였다. 그 결과 제조 실행 시스템 도입으로 인해 생산 업무 생산성이 7.0% 향상되었고, 제품 불량률은 0.1%p 개선되었다. 제조원가 절감은 10.0%, 납기 준수율은 1.1% 개선되었음을 확인하였다. 추후 본 연구에서 제안한 제조 실행 시스템을 기반으로 추가적인 스마트팩토리 기술을 적용하는 경우 PQCD 지표의 상승으로 인한 가공 산업의 매출 및 이익 증대가 예상된다.

Defect Diagnosis and Classification of Machine Parts Based on Deep Learning

  • Kim, Hyun-Tae;Lee, Sang-Hyeop;Wesonga, Sheilla;Park, Jang-Sik
    • 한국산업융합학회 논문집
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    • 제25권2_1호
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    • pp.177-184
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    • 2022
  • The automatic defect sorting function of machinery parts is being introduced to the automation of the manufacturing process. In the final stage of automation of the manufacturing process, it is necessary to apply computer vision rather than human visual judgment to determine whether there is a defect. In this paper, we introduce a deep learning method to improve the classification performance of typical mechanical parts, such as welding parts, galvanized round plugs, and electro galvanized nuts, based on the results of experiments. In the case of poor welding, the method to further increase the depth of layer of the basic deep learning model was effective, and in the case of a circular plug, the surrounding data outside the defective target area affected it, so it could be solved through an appropriate pre-processing technique. Finally, in the case of a nut plated with zinc, since it receives data from multiple cameras due to its three-dimensional structure, it is greatly affected by lighting and has a problem in that it also affects the background image. To solve this problem, methods such as two-dimensional connectivity were applied in the object segmentation preprocessing process. Although the experiments suggested that the proposed methods are effective, most of the provided good/defective images data sets are relatively small, which may cause a learning balance problem of the deep learning model, so we plan to secure more data in the future.

Synthesis of Intermetallics and Nanocomposites by High-Energy Milling

  • Bernd F. Kieback;H. Kubsch;Alexander Bohm;M. Zumdick;Thomas Weissgaerber
    • 한국분말재료학회지
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    • 제9권6호
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    • pp.416-421
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    • 2002
  • Elemental powders are used in high energy milling processes for the synthesis of new compounds. The low temperature solid state reactions during milling in inert gas atmosphere may result in intermetallic phases, carbides, nitrides or silicides with a nanocrystalline structure. To obtain dense materials from the powders a pressure assisted densification is necessary. On the other side the defect-rich microstructure can be used for activated sintering of elemental powder mixtures to obtain dense bodies by pressureless sintering. Results are discussed for nanocrystalline cermet systems and for the sintering of aluminides and silicides.