• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2012년도 추계학술대회 논문집
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• pp.394-399
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• 2012

최근 MEMS 센서는 기계상태감시에 있어서 전력소모, 크기, 비용, 이동성, 응용 등에 있어서 각광을 받고 있다. 특히, MEMS 센서는 스마트센서와 통합가능하고, 대량생산이 가능하여 가격이 저렴하다는 장점이 있다. 이와 관련한 기계상태감시를 위한 많은 실험적 연구가 수행되고 있다. 이 논문은 MEMS 센서들을 3 가지 인공지능 분류기 성능평가를 위한 비교연구에 대해 설명하고 있다. 회전기계에 MEMS 가속도와 전류센서들을 부착하여 데이터를 취득했고, 특징추출과 파라미터 최적화를 위해 Cross validation 기법을 사용하였다. MEMS 센서를 이용한 결함분류기 적용은 적합하다고 판단된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 The IMAPS-Korea Workshop 2000 Emerging Technology on Packaging
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• pp.55-85
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• 2000

MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

• 한국정보통신학회논문지
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• 제23권11호
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• pp.1364-1370
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• 2019

건축물이나 교량, 터널과 같은 구조물의 붕괴를 측정하기 위하여 기울기 센서를 사용하고 있으며 최근에는 사용성이 편리하고 가격이 저렴하여 MEMS(Micro-Electro-Mechanical System) 센서를 사용한 기울기 센서를 많이 사용하고 있으나 측정 범위가 한정되어 있어 360도 전 방위에 대해 고정밀도를 가지지는 못하고 있다. 이것은 MEMS 센서가 갖는 오프셋과 스케일 오차 때문이다. 본 논문에서는 MEMS 센서가 갖는 기계적 오차를 줄이기 위하여 정밀도가 높은 각도 계산을 위한 알고리즘을 제시하였고 MEMS 센서 모듈과 전송 모듈을 제작하여 교정 전 센서 모듈의 각도 정확도와 교정 후 각도 측정 정확도를 비교하여 교정 알고리즘의 효과를 제시하였으며, 실험 결과 제안 기술을 적용하였을 때 360도 전 방위에 대해 ±0.015도의 정밀도를 가짐을 확인하였다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권4호
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• pp.280-287
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• 2002

We present technical issues involved in the development of actuators and sensors for applications to high-precision Micro Electro Mechanical System (MEMS). The technical issues include fabrication uncertainty and noise disturbance, causing major difficulties for MEMS to achieve high-precision actuation and detection functions. For nano-precision actuators, we solve the fabrication instability and electrical noise problems using digital actuators coupled with nonlinear mechanical modulators. For the high-precision capacitive sensors, we present a branched finger electrodes using high-amplitude anti-phase sensing signals. We also demonstrate the potential applications of the nanoactuators and nanodetectors to high-precision positioning MEMS.

• 한국공간구조학회논문집
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• 제19권2호
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• pp.63-72
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• 2019

Wireless sensors are more favorable in measuring structural response compared to conventional sensors in terms of them being easier to use with no issues with cables and them being considerably cheaper. Previous tests have been conducted to analyze the performance of MEMS (Micro Electro Mechanical Systems) sensor in sinusoidal excitation tests. This paper analyzes the performance of in-built MEMS sensors in devices by comparing with an ICP sensor as the reference. Earthquake input amplitude excitation in shaking table tests was done. Results show that MEMS sensors are more accurate in measuring higher input amplitude measurements which range from 100gal to 250gal than at lower input amplitudes which range from 10gal to 50gal. This confirms the results obtained in previous sinusoidal tests. It was also seen that natural frequency results have lower error values which range from 0% to 3.92% in comparison to the response spectra results. This also confirms that in-built MEMS sensors in mobile devices are good at estimating natural frequency of structures. In addition, it was also seen that earthquake input amplitudes with more frequency contents (Gyeongju) had considerably higher error values than Pohang excitation tests which has less frequency contents.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2011년도 춘계학술대회 논문집
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• pp.816-820
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• 2011

본 논문은 구형 마이크로폰 어레이의 부엽 레벨의 차를 증가시키기 위한 방법에 대한 연구 내용을 다루었다. 일반적인 어레이 신호처리에서 마이크로폰을 조밀하게 배치함으로써 어레이 응답에서의 주엽과 부엽 간의 차이를 늘릴 수 있고 어레이의 소음원 판별능력을 증가시킨다. 최근 사용되고 있는 상용 에레이들은 제작 단가와 어레이의 크기 때문에 센서의 수를 늘리는데 한계를 보이고 있다. 이런 문제를 극복하기 위해 본 연구에서는 MEMS 센서를 이용하여 구형 어레이에 적용하였다. 구형 마이크로폰 어레이를 이용한 시뮬레이션과 실험을 통해 정현파 소음원을 측정하였다. 실험을 위해 32 개의 일반 측정용 마이크로폰을 이용한 어레이와 85 개의 MEMS 마이크로폰을 이용한 구형 어레이를 제작하였다. 구형 조화 분해기법과 빔형성기법을 이용하여 측정 데이터를 분석하였다. 2 kHz 이상의 소음원에 대하여 MEMS 마이크로폰 어레이가 4 dB 이상의 부엽 저감 능력을 가지는 것을 확인하였다.

• 한국공간구조학회논문집
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• 제17권4호
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• pp.93-102
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• 2017

Wireless MEMS sensors have common features such as wireless communication, data measurement, embedded processing, battery-based self-power, and low cost, and increased measurement effectiveness. Wireless MEMS sensors enable efficient SHM without interfering with location because there is no requirement for triboelectric noise and cumbersome cables. However, there is little research on the communication distance with sensors and data. For instance, existing researches have limited communication distance experiments in civil engineering bridges. It is also necessary to investigate the characteristics of dynamic behavior and the communication distance of architectural structures with different wireless transmission/reception environments. Therefore, in a building structure with walls and slabs instead of open spaces, MEMS sensors and data loggers were used as distance experiments where communication disturbance between the vertical slab and the horizontal wall could actually be communicated.

• 센서학회지
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• 제18권5호
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• pp.359-364
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• 2009

This paper presents flexible electrocardiography(ECG) sensors using micro electro mechanical systems(MEMS) and flexible printed circuit(FPC) technology. By using FPC technology, ECG sensors which consisted of an outer hook-shaped electrode and an inner circular-shaped electrode were fabricated on the polyimide substrate. Thereafter, the bipolar ECG sensor was miniaturized using MEMS technology. The ECG measurement capability was examined by attaching the sensor to the human chest and wrist. Performance of the proposed sensors was then compared with ECG measured by commercial Ag/AgCl electrodes. It was verified that ECG could be measured using proposed sensors at only single body.

• Smart Structures and Systems
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• 제6권3호
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• pp.225-238
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• 2010

We report on the development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process which includes a gap narrowing procedure suitable to fabricate sensors with low motional resistance. In order to employ these sensors for crack monitoring, techniques suited for bonding the MEMS sensors on a steel surface ensuring good strain transfer from steel to silicon and a packaging technique for the bonded sensors are proposed, conceived for realizing a low-power crackmeter for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with a resolution of $10{\mu}m$ and very low power consumption requirements (potentially suitable for wireless operation) is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in underground tunnel test sections.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1761-1766
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• 2004

In this lecture, we reviewed the principle and types of force sensors with strain gages, tactile sensors based on MEMS and force sensor as well as nano force sensors. Also we investigated applications of force sensors for NT, BT and RT.