• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.10a
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• pp.394-399
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• 2012

In recent years, MEMS sensors show huge attraction in machine condition monitoring, which have advantages in power, size, cost, mobility and flexibility. They can integrate with smart sensors and MEMS sensors are batch product. So the prices are cheap. And the suitability of it for condition monitoring is researched by experimental study. This paper presents a comparative study and performance test of classification of MEMS sensors in target machine fault classification by 3 intelligent classifiers. We attempt to signal validation of MEMS sensor accuracy and reliability and performance comparisons of classifiers are conducted. MEMS accelerometer and MEMS current sensors are employed for experiment test. In addition, a simple feature extraction and cross validation methods were applied to make sure MEMS sensors availabilities. The result of application is good for using fault classification.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.09a
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• pp.55-85
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• 2000

MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.11
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• pp.1364-1370
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• 2019

Tilt sensors are mainly used to measure the collapse of structures such as buildings, bridges and tunnels. Recently, due to the ease of use and low price, many tilt sensors using MEMS sensors have been used, but the measurement angle range is limited, and thus, they do not have high precision for 360 degree. This is due to the inherent offset and scale errors of MEMS sensors. In this paper, we proposed an algorithm for the calculation of precision angles to reduce the mechanical error of MEMS sensors, and produced a MEMS sensor module and a transmission module to compare the angle accuracy of sensor modules before calibration and the angle measurement accuracy after calibration. Experimental results show that the proposed technique has a precision of ± 0.015 degrees for all 360-degree.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.280-287
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• 2002

We present technical issues involved in the development of actuators and sensors for applications to high-precision Micro Electro Mechanical System (MEMS). The technical issues include fabrication uncertainty and noise disturbance, causing major difficulties for MEMS to achieve high-precision actuation and detection functions. For nano-precision actuators, we solve the fabrication instability and electrical noise problems using digital actuators coupled with nonlinear mechanical modulators. For the high-precision capacitive sensors, we present a branched finger electrodes using high-amplitude anti-phase sensing signals. We also demonstrate the potential applications of the nanoactuators and nanodetectors to high-precision positioning MEMS.

• Journal of Korean Association for Spatial Structures
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• v.19 no.2
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• pp.63-72
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• 2019

Wireless sensors are more favorable in measuring structural response compared to conventional sensors in terms of them being easier to use with no issues with cables and them being considerably cheaper. Previous tests have been conducted to analyze the performance of MEMS (Micro Electro Mechanical Systems) sensor in sinusoidal excitation tests. This paper analyzes the performance of in-built MEMS sensors in devices by comparing with an ICP sensor as the reference. Earthquake input amplitude excitation in shaking table tests was done. Results show that MEMS sensors are more accurate in measuring higher input amplitude measurements which range from 100gal to 250gal than at lower input amplitudes which range from 10gal to 50gal. This confirms the results obtained in previous sinusoidal tests. It was also seen that natural frequency results have lower error values which range from 0% to 3.92% in comparison to the response spectra results. This also confirms that in-built MEMS sensors in mobile devices are good at estimating natural frequency of structures. In addition, it was also seen that earthquake input amplitudes with more frequency contents (Gyeongju) had considerably higher error values than Pohang excitation tests which has less frequency contents.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2011.04a
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• pp.816-820
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• 2011

A method for increasing the difference of side-lobe level in spherical microphone array is presented. In array signal processing, it is known that narrow interval between sensors can increase the difference between main lobe and side-lobe of array response which eventually increase the source recognition capability. Recent commercial array being used, however, have shown certain limitation in using the number of sensors due to its costs and geometrical size of array. To overcome this problem, we have adapted MEMS sensors into spherical microphone array. To check out the improvement, two different types of spherical microphone array were designed. One array is composed with 32 regular instrument microphones and the other one is 85 MEMS sensors. Simulation and experiments were conducted on a sinusoidal noise source with two arrays. The time history data were analyzed with spherical harmonic decomposition and beamforming technique. 85 MEMS sensors array showed the improved side-lobe level suppression by more than 4 dB above the frequency content of 2 kHz compared to 32-sensor array.

• Journal of Korean Association for Spatial Structures
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• v.17 no.4
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• pp.93-102
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• 2017

Wireless MEMS sensors have common features such as wireless communication, data measurement, embedded processing, battery-based self-power, and low cost, and increased measurement effectiveness. Wireless MEMS sensors enable efficient SHM without interfering with location because there is no requirement for triboelectric noise and cumbersome cables. However, there is little research on the communication distance with sensors and data. For instance, existing researches have limited communication distance experiments in civil engineering bridges. It is also necessary to investigate the characteristics of dynamic behavior and the communication distance of architectural structures with different wireless transmission/reception environments. Therefore, in a building structure with walls and slabs instead of open spaces, MEMS sensors and data loggers were used as distance experiments where communication disturbance between the vertical slab and the horizontal wall could actually be communicated.

• Journal of Sensor Science and Technology
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• v.18 no.5
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• pp.359-364
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• 2009

This paper presents flexible electrocardiography(ECG) sensors using micro electro mechanical systems(MEMS) and flexible printed circuit(FPC) technology. By using FPC technology, ECG sensors which consisted of an outer hook-shaped electrode and an inner circular-shaped electrode were fabricated on the polyimide substrate. Thereafter, the bipolar ECG sensor was miniaturized using MEMS technology. The ECG measurement capability was examined by attaching the sensor to the human chest and wrist. Performance of the proposed sensors was then compared with ECG measured by commercial Ag/AgCl electrodes. It was verified that ECG could be measured using proposed sensors at only single body.

• Smart Structures and Systems
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• v.6 no.3
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• pp.225-238
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• 2010

We report on the development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process which includes a gap narrowing procedure suitable to fabricate sensors with low motional resistance. In order to employ these sensors for crack monitoring, techniques suited for bonding the MEMS sensors on a steel surface ensuring good strain transfer from steel to silicon and a packaging technique for the bonded sensors are proposed, conceived for realizing a low-power crackmeter for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with a resolution of $10{\mu}m$ and very low power consumption requirements (potentially suitable for wireless operation) is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in underground tunnel test sections.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1761-1766
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• 2004

In this lecture, we reviewed the principle and types of force sensors with strain gages, tactile sensors based on MEMS and force sensor as well as nano force sensors. Also we investigated applications of force sensors for NT, BT and RT.