• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.781-784
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• 2005

Twenty four types of thermopile for micro spectrometer infrared sensors were fabricated on low-stress $Si_3N_4$ membranes with $1.2{\mu}m-thickness$ using MEMS technology. Poly-Si thin film with thickness of 3500 ${\AA}$ as the first thermocouple material, was deposited by LPCVD method. And aluminum thin film with thickness of 6000 ${\AA}$ as the second thermocouple material, was deposited by sputtering method. Thermopile were designed and fabricated for optimum conditions by five parameters of thermocouple numbers (16 ${\sim}$ 48), thermocouple line widths (10 ${\mu}m$ ${\sim}$ 25 ${\mu}m$), thermocouple lengths (100 ${\mu}m$ ${\sim}$ 500 ${\mu}m$), membrane areas ($1^2\;mm^2$ ${\sim}$ $2.5^2\;mm^2$) and junction areas (150 ${\mu}m^2$ ${\sim}$ 750 ${\mu}m^2$), respectively. Electromotive forces of fabricated thermopile were measured 1.1 mV ${\sim}$ 7.4 mV at $400^{\circ}C$. It was thought that measurement results could be used for thermopile infrared sensors optimum structure for micro spectrometers.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1196-1200
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• 2004

Micropump is very useful component in micro/nano fluidics and bioMEMS applications. In this study, a bubble-powered micropump was fabricated and tested. The micropump consists of two-parallel micro line heaters, a pair of nozzle-diffuser flow controller and a 1 mm in diameter, 400 ${\mu}m$ in depth pumping chamber. The two-parallel micro line heaters with 20 ${\mu}m-width$ and 200 ${\mu}m-length$ were fabricated to be embedded in the silicon dioxide layer of a wafer which serves as a base plate for the micropump. The pumping chamber, the pair of nozzle-diffuser unit and microchannels including the liquid inlet and outlet port were fabricated by etching through another silicon wafer. A glass wafer (thickness of $525{\pm}15$ ${\mu}m$) having two holes of inlet and outlet ports of liquid serve as upper plate of the pump. Finally the silicon wafer of the base plate, the silicon wafer of pumping chamber and the glass wafer were aligned and bonded (Si-Si bonding and anodic bonding). A sequential photograph of bubble nucleation, growth and collapse was visualized by CCD camera. Clearly liquid flow through the nozzle during the period of bubble growth and slight back flow of liquid at the end of collapsing period can be seen. The mass flow rate was found to be dependent on the duty ratio and the operation frequency. As duty ratio increases, flow rate decreases gradually when the duty ratio exceeds 60%. Also as the operation frequency increases, the flow rate of the micropump decreases slightly.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.171-176
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• 2000

The physical and electrical characteristics of MgO and Pt thin-films on it, deposited by reactive sputtering and rf magnetron sputtering, respectively, were analyzed with annealing temperature and time by four-point probe, SEM and XRD. Under annealing conditions of $1000^{\circ}C$ and 2 hr, MgO thin-film had the properties of improving Pt adhesion to $SiO_2$ and insulation without chemical reaction to Pt thin-film, and the sheet resistivity and the resistivity of Pt thin-film deposited on it were $0.1288\;{\Omega}/{\square}$ and $12.88\;{\mu}{\Omega}{\cdot}cm$, respectively. We made Pt resistance pattern on $SiO_2$/Si substrate by lift-off method and fabricated thin-film type Pt-RTD(resistance thermometer device) for micro thermal sensors by Pt-wire, Pt-paste and SOG(spin-on-glass). In the temperature range of $25{\sim}400^{\circ}C$, the TCR value of fabricated Pt-RTD with thickness of $1.0{\mu}m$ was $3927\;ppm/^{\circ}C$ close to the Pt bulk value. Resistance values were varied linearly within the range of measurement temperature.

• Journal of Sensor Science and Technology
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• v.20 no.5
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• pp.317-321
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• 2011

A Micro platform for micro gas sensor consisted of micro heater, insulator, and sensing electrode on 2 ${\mu}m$ thick $SiN_x$ membrane. Three types of micro platforms were designed and fabricated with membrane sizes. Total size of micro platform was 2.6 mm by 2.6 mm. Measured power consumptions were 28 mW, 28 mW, and 32.5 mW for Type 1, Type 2, and Type 3. At this moment, temperatures of membranes on the platforms were $295^{\circ}C$, $297^{\circ}C$, and $296^{\circ}C$, respectively. Fabricated micro platform considered appropriate to apply for low power consumption micro gas sensor. Micro gas sensors were prepared by the sequence that $SnO_2$ nanopowder pastes were dropped on membrane of Type 1 platforms, dried in oven, heat-treated with micro heaters in platforms. One of the micro gas sensors was tested for gas response to 1157 ppm, 578 ppm, and 231 ppm of methane and 1.68 ppm, 0.84 ppm, and 0.42 ppm of $NO_2$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.918-924
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• 2009

In this paper, we designed micro-structured electromagnetic transducers for energy harvesting and verified the performance of proposed transducers using finite element analysis software, COMSOL Multiphysics. To achieve higher energy transduce efficiency, around the magnetic core material, three-dimensional micro-coil structures with high number of turns are fabricated using semiconductor fabrication process technologies. To find relations between device size and energy transduce efficiency, generated electrical power values of seven different sizes of transducers ($3{\times}3\;mm^2$, $6{\times}6\;mm^2$, $9{\times}9\;mm^2$, $12{\times}12\;mm^2$, $15{\times}15\;mm^2$, $18{\times}18\;mm^2$, and $21{\times}21\;mm^2$) are analyzed on various magnetic flux density environment ranging from 0.84 T to 1.54 T and it showed that size of $15{\times}15\;mm^2$ device can generate $991.5\;{\mu}W$ at the 8 Hz of environmental kinetic energy. Compare to other electromagnetic energy harvesters, proposed system showed competitive performance in terms of power generation, operation bandwidth and size. Since proposed system can generate electric power at very low frequency of kinetic energy from typical life environment including walking and body movement, it is expected that proposed system can be effectively applied to various pervasive computing applications including power source of embodied medical equipment, power source of RFID sensors and etc. as an secondary power sources.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.5
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• pp.515-523
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• 2015

In this paper, we fabricated and evaluated the gas sensor for the detection of CO gas and $NO_X$ gas among the vehicle exhaust emission gasses. The $SnO_2$ (tin dioxide) layer is used as the detection material, and the thin-film type and the nano-fiber type layers are deposited with various thicknesses using sputtering method and electro spinning method, respectively. The experiments are performed in the chamber where the gas concentration is controlled with mass flow controller. The fabricated devices are applied to the CO and $NO_X$ gas, where the device with the thinner $SnO_2$ layer shows better sensitivity. The nano-fiber has the larger surface area, and the shorter response time and recovery time are obtained. From the experimental results, both types of gas sensors successfully detect CO and $NO_X$ gases, which can be applied to measure those gases from the vehicle emissions.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.3
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• pp.194-198
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• 2010

Recently as the electronic devices are getting to be more and more smaller, transformers are needed to be micro fabricated using MEMS technology. In this paper transformers have been fabricated and measured by depositing insulation layer to reduce the loss of eddy current and in the middle core a high permeability permalloy was designed based on the turns ratio between primary coil and secondary coil which are 1:1 transformers. (the number of turns of primary coil and secondary coil: 3/3, 5/5, 7/7). The size of the transformers including ground shield are $1mm{\times}1.5mm$, $1mm{\times}1.95mm$, $1mm{\times}2.35mm$ respectively. The line width, pitch and the height of post are 50um. Based on the measured data from the micro fabricated transformers, the 3/3 turns in the primary coil and secondary coil showed the lowest insertion loss with 1.5 dB at 480 MHz and the 7/7 turns in the primary coil and secondary coil showed the highest insertion loss with 2.5 dB at 280 MHz. Also confirmed that the bandwidth goes up as the number of turns goes down. There was some difference between the actual measured data and the HFSS simulation result. It looks as if it is an error of the difference between oxidation of copper or the permeability of SU-8.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1968-1970
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• 1996

We investigate a surface-micromachined polysilicon microgyroscope, whose resonant frequencies are electrostatically-tunable after fabrication. The microgyroscope with two oscillation nudes has been designed so that the resonant frequency in the sensing mode is higher than that in the actuating mode. The microgyroscope has been fabricated by a 4-mask surface-micrormachining process, including the deep RIE of a $6{\mu}m$-thick LPCVD polycrystalline silicon layer. The resonant frequency in the sensing mode has been lowered to that in actuating mode through the adjustment of an inter-plate bias voltage; thereby achieving a frequency matching at 5.8kHz under the bias voltage of 2V in a reduced pressure of 0.1torr. For an input angular rate of $50^{\circ}/sec$, an output signal of 20mV has been measured from the tuned microgyroscope under an AC drive voltage of 2V with a DC bias voltage of 3V.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.2004-2006
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• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.