• Journal of Sensor Science and Technology
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• v.25 no.2
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• pp.116-123
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• 2016

This paper presents the fabrication and evaluation of the novel drag force type air flowmeter using MEMS technologies for the vehicle applications. To obtain the air drag force, the flowmeter utilized the curved beam structure, which was realized by the difference of residual stress between the silicon oxide layer and the silicon nitride layer. The paddle structure was applied for the maximum air drag force, and the dual-beam was adapted to prevent distortion. The basic experiments were performed in the wind tunnel, and the stable outputs were obtained. The device was applied to the internal combustion engine, and the results were compared with the HI-DS output where the convection thermal flowmeter was used as the reference sensor. The results indicated that the comparable resolutions and response times were obtained under the various engine speeds.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.187-188
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• 2005

In this paper, big free standing metal structures for electrostatic MEMS switches are easily fabricated using photoresist sacrificial layer. The entire process sequence, through the removal of the sacrificial layer, is kept below 150 $^{\circ}C$ to avoid curing problem of photoresist sacrificial layer. Metal structure is fabricated by thermal evaporator and a self test electrode is fabricated underlying metal suspended structure for testing by electrostatic force. The new wet release process is considered using methanol rinse, general wet release process cause stiction problem by capillary force during drying, and the yield is dramatically improved than previous wet release process using DI water rinse. The fabrication becomes much simpler and cheaper with use of a photoresist sacrificial layer.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.132-137
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• 2022

In this paper, we have studied the quadrature error reduction for the single drive 3-axis MEMS Gyroscope. There was a limitation of the previous study which is the z-axis quadrature error was large. To reduce this value, design methodologies were presented. And the methodologies included a different mesh application, z-rate spring structure change, and mass compensation for balancing of the structure. We conducted the modal analysis, drive mode analysis and sense mode analysis using COMSOL Multiphysics. As a result, a drive resonant frequency was 26003 Hz, with the x-sense, y-sense, z-sense being 26749 Hz, 26858 Hz, 26920 Hz, respectively. And the Mechanical sensitivity was computed at 2000 degrees per second(dps) input angular rate while the sensitivity for roll, pitch, and yaw was computed 0.011, 0.012, and 0.011 nm/dps respectively. And z-axis quadrature error was successfully improved, 2.78 nm to 0.95 nm, which the improvement rate was about 66 %.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.362-363
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• 2005

The objectives of this paper are to achieve good planarization of the deposited film and to improve deposition efficiency of multi-layer structures by using surface-micromaching process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages and disadvantages of CMP for MEMS structures are observed respectively by using the test patterns with structures larger than 1 um line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of slurries: ILD1300 and Nalco2371. And then, the experiments were conducted based on the pretest.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.573-574
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• 2006

The planarization technology of Chemical-mechanical polishing(CMP), used for the manufacturing of multi-layer various material interconnects for Large-scale Integrated Circuits (LSI), is also readily adaptable as an enabling technology in MicroElectroMechanical System (MEMS) fabrication, particularly polysilicon surface micromachining. However, general LSI device CMP has partly distinction aspects, the pattern scale and material sorts in comparison with MEMS CMP. This study performed preliminary CMP tests to identify slurry characteristic used in general IC device. The experiment result is possible to verify slurry characteristic in MEMS structure material.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.1050-1053
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• 2002

This paper presents metal structure that is fabricated using UV-LIGA process with PMER N-CA3000. In order to fabricate metal structure with high aspect ratio, the systematic optimization method was adopted and then the structure of $36{\mu}m$ thick mold with aspect ratio 7:1 (trench) and $32{\mu}m$ thick nickel structure was obtained. This structure is applied to the fabrication of optical switch.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.609-611
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• 1995

In this study, we experimented the properties of SOG film as sacrificials layers in surface micromachining and made $SiO_2$ films through spin, bake, cure process. When we culled SOG films once, SOG film thickness is 1000 $\sim$ 3000 ${\AA}$. Then we coaled 200-${\AA}$ SOG film on 9000 ${\AA}$-CVD oxide and then we fabricated test structure, cantilever and ring/beam structure. We estimated deformed structure by SEM. As the results, The deformation of the structure layer in the SOG-coated sacrificial layers is small compared with that or the structure layer on CVD oxide or PSG. In the future, we use multi coated SOG films, SOG film become adequate material as sacrificial layer.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.953-956
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• 2005

Low voltage actuation and high isolation characteristics are key features to be solved in electrostatic RF switch design. Since these parameters in the conventional parallel plate MEMS switch design are in trade-off relation, both requirements cannot be met simultaneously. In vertical comb design, however, the actuation voltage is independent to the vertical separation distance between the contact electrodes. Then, we can design the large separation distance between contact electrodes to get high isolation. We have designed an RF MEMS switch which has -40dB isolation at 5 GHz and 6 V operation voltages. The characteristics of the fabricated switch are being evaluate.

• Journal of Aerospace System Engineering
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• v.9 no.2
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• pp.13-18
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• 2015

Micro planar type liquid propellant thruster was fabricated by MEMS manufacturing process for micro/nano satellites applications. 90 wt.% hydrogen peroxide was used as propellant and for propellant decomposition, Pt/Al2O3 was used as catalyst. Micro thruster structure was made by 5 photosensitive glasses patterned with thruster component profiles. Objective thrust was 50 mN and required hydrogen peroxide mass flow was 2.1 ml/min, which was supplied by syringe pump and teflon tube in experimental test. Performance test said that average steady thrust was approximately 30 mN, around 60% of objective thrust, and transient time was about 5 sec. It is estimated that extended response time was due to high thermal energy loss of micro scale thruster and low enthalpy input by propellant mass flow.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.4 s.235
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• pp.526-533
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• 2005

Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.