• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.8 s.101
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• pp.931-938
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• 2005

This paper presents a robust optimal design method for a periodic structure type of MEMS resonator that is vulnerable to mode localization. The robust configuration of such a MEMS resonator to fabrication error is implemented by changing the regularity of periodic structure For the mathematical convenience, the MEMS resonator is first modeled as a multi-pendulum system. The index representing the measure of mode variation is then introduced using the perturbation method and the concept of modal assurance criterion. Finally, the optimal intentional mistuning, minimizing the expectation of the irregularity measure for each substructure, is determined for the normal distributed fabrication error and its robustness in the design of MEMS resonator to the fabrication error is demonstrated with numerical examples.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.43 no.5
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• pp.432-439
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• 2015

MEMS solid thruster module is composed of solid thruster and its control board. It was developed for the purpose of an academic research. Therefore, thermo-mechanical design and verification for space usage were not considered in the design phase. To mount it on a cube satellite without any design modification, technical efforts at the system level structure design is required. In this study, we proposed a structural design concept to mount the MEMS thruster module by using brackets for guaranteeing structure safety under launch loads and easier mating and de-mating of MEMS thruster module during test phase. The effectiveness of the design has been verified through structural analysis and vibration test. In addition, electrical connection method using spring pins between MEMS thruster and control board is effective for guaranteeing the structural safety under launch vibration loads.

• Structural Engineering and Mechanics
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• v.30 no.2
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• pp.191-209
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• 2008

A structural monitoring system based on cheap and wireless monitoring system is investigated in this paper. Due to low-cost and low power consumption, micro-electro-mechanical system (MEMS) is suitable for wireless monitoring and the use of MEMS and wireless communication can reduce system cost and simplify the installation for structural health monitoring. For system identification using wireless MEMS, a finite element (FE) model updating method through correlation with the initial analytical model of the structure to the measured one is used. The system identification using wireless MEMS is evaluated experimentally using a three storey frame model. Identification results are compared to ones using data measured from traditional accelerometers and results indicate that the system identification using wireless MEMS estimates system parameters with reasonable accuracy. Another smart sensor considered in this paper for structural health monitoring is Lead Zirconate Titanate (PZT) which is a type of piezoelectric material. PZT patches have been applied for the health monitoring of structures owing to their simultaneous sensing/actuating capability. In this paper, the system identification for building structures by using PZT patches functioning as sensor only is presented. The FE model updating method is applied with the experimental data obtained using PZT patches, and the results are compared to ones obtained using wireless MEMS system. Results indicate that sensing by PZT patches yields reliable system identification results even though limited information is available.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.2 s.173
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• pp.421-430
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• 2000

We apply the Rayleigh Ritz method to analyze multi-layered plates with residual stresses. The method is very simple, straight forward, and easily programmable, but it should be applied to structure s only in simple shapes. We derive coupled variational equations based on the principle of virtual displacement, and investigate what kind of basis functions is desirable for the analysis of rectangular plates with various boundary conditions. We demonstrate the effectiveness and usefulness of the method through several examples. The analysis results obtained with the method are in good agreement with those available in literature. A multi-layered MEMS plate example shows that the coupling effect should not be ignored and that residual stresses do influence the stiffness of the structure very much.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.12 s.255
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• pp.1196-1202
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• 2006

A MEMS methanol reformer was fabricated and its performance was evaluated in the present study. Catalytic steam reforming of methanol was selected because the process had been widely applied in macro scale reformers. Conventional Cu/ZnO catalyst that was prepared by co-precipitation method to give the highest coating quality was used. The reactor structure was made by bonding three layers of glass wafers. The internal structure of the wafer was fabricated by the wet-etching process that resulted in a high aspect ratio. The internal surface of the reactor was coated by catalyst and individual wafers were fusion-bonded to form the reactor structure. The internal volume of the microfabricated reactor was $0.3cm^3$ and the reactor produced exhaust gas with hydrogen concentration at 73%. The production rate of hydrogen was 4.16 ml/hr that could generate power of 350 mW in a typical PEM fuel cell.

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.274-279
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• 2015

This paper describes optimizing fabrication methods for 2-axis electrically levitated MEMS gyroscope. Electrostatically levitated gyroscope has very high potential of performance due to the fact that its proof mass is not mechanically bound to any other structures, but its complex structure and difficulty of fabrication holds back the research that only a few researches have been reported. In this work, fabrication method for glass-silicon-glass 3-floor structure for 2-axis electrically levitated MEMS gyroscope is presented, including simplified multi-level glass etch method utilizing photoresist attack, preventing metal diffusion by adding middle layer of metal electrode, overcoming Deep RIE limitation by separate fabrication of silicon structures and keeping the electrode safe from dicing debris.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.163-167
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• 2003

In this paper, an air-suspension type RF MEMS inductor is fabricated, and an appropriate de-embedding scheme for 3-dimenstional MEMS structure is applied and verified with inductance calculation algorithm. With the presented de-embedding method, parasitics from contanct pads and feeding lines are effectively and accurately de-embedded using open and short calibration procedure, and only spiral and posts can be characterized as a high-Q inductor structure. The validity of the de-embedding method is verified by the comparison of the measured and calculated inductances of two 1.5 and 2.5 turn square spiral inductors. The open-short de-embedded inductance error is below 5% each case in comparison with the calculated value based on H.M. Greenhouse's algorithm.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1972-1975
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• 2002

In this paper, we have proposed low temperature co-fired ceramic (LTCC) based packaging for RF MEMS devices. The packaging structure is designed and evaluated with 3D full field simulation. 50 ${\Omega}$ matched coplanar waveguide(CPW) transmission line is employed as the test vehicle to evaluate the performances of the proposed package structure. The line is encapsulated with the LTCC packaging lid and connected to the via feed line. To reduce the insertion loss due to the packaging lid, the cavity with via post is formed in the packaging lid. The performances of the package structure is simulated with the different cavity depth and via-to-via length. Simulation results show that the proposed package structure has reflection loss better than 20 dB and insertion loss lower than 0.1 dB from DC to 30 GHz with the cavity depth and via-to-via length of 300 ${\mu}m$ and 350 ${\mu}m$, respectively. To realize the designed package structure, the cavity patterning is tested using the sandblast of LTCC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.373-378
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• 2004

Recently the electrostatic 2-axis MEMS stages have been fabricated for the purpose of an application to PSD (Probebased Storage Device). However, most of them have low area efficiency, which is undesirable as data storage devices, since all of the components (springs, comb electrodes, anchors, platform, etc.) are placed in-plane. In this paper, we present a novel structure of electrostatic 2-axis MEMS stage that is characterized by having large area platform. For large area efficiency, the actuator part consisting of mainly comb electrodes and springs is placed right below the platform. In this article, the structures and operational principle of the MEMS stages are described, followed by design procedure, structural and modal analysis using FEM(Finite Element Method). The area efficiency of the MEMS stage was designed to be about 55％, that is very large compared with conventional ones having a few percentage.