• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2004년도 춘계학술대회
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• pp.267-269
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• 2004

본 연구에서는 일반적인 미세구조물 제작공정인 lithography 공정을 이용하지 않고 SLS(Selective Laser sintering)형 RP(Rapid Prototyping system)을 이용하여 패턴의 깊이가 400$\mu$m인 미세구조물을 제작하였다. 제작 공정변수 중 재료의 상태가 new powder 이고 배치각이 $0^{\circ}$ 일 때 패턴의 깊이, 선폭과 표면조도가 가장 잘 구현되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.373-374
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• 2007

The amorphous silicon microbolometer array has been developed by the MEMS design and fabrication technology. Before the bolometer array for the image sensor being designed, the structure of unit cel I and 16x16 array of it was simulated, designed and fabricated. The properties of bolometer have been measured as such that the TCR and thermal time constant can be achieved -2 %/K and 1.4 msec respectively.

• 한국정밀공학회지
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• 제21권5호
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• pp.19-23
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• 2004

최근 산업의 고도화와 함께 초고온, 방사선노출 등과 같은 극한환경에서 사용되는 구조물과 MEMS 와 같은 미소 구조물(Hicrostructure)이 많아지고 있으며, 이들의 변형해석을 위한 기존의 접촉식 기법들은 그 한계를 극복해야 할 필요가 있다 해결방안으로 레이저를 이용한 비접촉 측정방식이 많은 발전을 해오고 있으며, 특히, 스페클간섭법(Speckle inteferometry)기반의 변형해석 기술이 가장 뛰어난 기술로 인정받고 있다. 스페클간섭법은 컴퓨터 화상처리기술에 힘입어 전자처리 스페클간섭법(Electronic Speckle Pattern Interferometry : ESPI)으로 발전을 하고 있으며, 자동차와 같은 대형구조물의 변형해석에서 MEMS 구조물과 같은 미소구조물 변형해석까지 그 적용범위가 매우 넓다. 본 논문에서는 ESPI 를 이용한 변형해석분야의 국내외 기술현황 및 적응사례, 발전방향를 소개하였다.(중략)

• 한국광학회지
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• 제16권5호
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• pp.428-432
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• 2005

마이크로칼럼에 사용되는 전자렌즈는 MEMS 공정으로 정밀하게 가공되어 기존의 전자칼럼에 비하여 광학수차를 최소화 할 수 있으며, 이는 전자칼럼의 성능 향상에 주요한 요소로 작용한다. 따라서 반도체 공정 방식(습식식각과 건식식각)에 의해 형성되는 렌즈구조에 따른 전자 광학계 연구는 중요한 의미가 있다. 마이크로칼럼을 구성하고 있는 전자방출원, 소스렌즈, 디플렉터, 포커스렌즈(Einzel lens) 중에서 전자빔의 특성에 가장 큰 영향을 주는 것은 소스렌즈이다. 본 연구에서는 소스렌즈의 extractor와 limiting aperture의 구조에 따른 전자빔 특성을 조사하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.1039-1042
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• 2000

This research will deal with Innovative manufacturing technology for milli-structure manufacturing technology which is located betweon the traditional manufacturing technology for macro-sized structure and the recently emerging manufacturing technology for micro-scaled structure such as MEMS. There are four fields in this research, which are micro-sheet metal forming technology, micro-bulk forming technology micro-molding technology and micro die making technology. As a project for new-technology in next generation, this research will be carried out through three terms and each term and be composed of three years.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.756-759
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• 2004

We present a piezoelectric actuator using stiffness control and stroke amplification mechanism in order to make large lateral displacement. In this work, we suggest stiffness control approach that generates lateral displacement by increasing the vertical stiffness and reducing the lateral stiffness using additional structure. In addition, an additional structure of a serpentine spring amplifies the lateral displacement like leverage structure. The suggested lateral PZT actuator (bellows actuator) consists of serpentine spring and PZT/electrode layer which is located at the edge of the serpentine spring. The edge of the serpentine spring prevents the vertical motion of PZT layer, while the other edge of the serpentine spring makes stroke amplification like leverage structure. We have determined dimensions of the bellows actuator using ANSYS simulation. Length, width and thickness of PZT layer are 135$\mu$m, 20$\mu$m and 0.4$\mu$m, respectively. Dimensions of the silicon serpentine spring are thickness of 25$\mu$m, length of 300$\mu$m, and width of 5$\mu$m. The bellows actuator has been fabricated by SOI wafer with 25$\mu$m-top silicon and 1$\mu$m-buried oxide layer. The bellows actuator shows the maximum 3.93$\pm$0.2$\mu$m lateral displacement at 16V with 1Hz sinusoidal voltage input. In the frequency response test, the fabricated bellows actuator showed consistent displacement from 1Hz to 1kHz at 10V. From experimental study, we found the bellows actuator using thin film PZT and silicon serpentine spring generated mainly laterally displacement not vertical displacement at 16V, and serpentine spring played role of stroke amplification.

• 센서학회지
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• 제20권6호
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• pp.393-399
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• 2011

In this paper, we designed and fabricated the novel air flow sensor using air drag force, which can be applied to the low air flow detection. To measure the low air flow, we should enlarge the air drag force and the output signal at the given air flow. The paddle structure is applied to the device, and the device is vertically located against the air flow to magnify the air drag force. We also adapt the corrugation structure to improve the output signals on the given air velocity. The device structure is made up of the silicon nitride layer and the output signal is measured with the piezoresistive layer. The output signals from the corrugated device show the better measurement sensitivity and the response time than that of flat one. The repeated measurement also shows the stabilized signals.

• 한국정밀공학회지
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• 제27권9호
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• pp.20-25
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• 2010

The effect of micro surface structure on printing for printed electronics has been studied experimentally. The photolithography MEMS fabricationwass used to make a SU-8 molder which has micro structures on the surface, and the PDMS micro structure was fabricated by the PDMS molding method. In the aspect of printed electronics, we used silver paste conductive ink. We measured the surface energy variation on pillar microstructure. The microstructure was used to real printing experiment by a screen printing. We printed 1cm micro lines which have $30{\sim}250{\mu}m$ width, and checked the conductivity to sort out opened line pattern. Printability was defined by success probability of printed patterns and we found that the present microstructures improve the printability significantly.

• 한국전기전자재료학회논문지
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• 제24권2호
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• pp.112-115
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• 2011

To stabilize the electric characteristic of Silicon Thin Film Transistor, reducing the current leakage is most important issue. To reduce the current leakage, many ideas were suggested. But the increase of mask layer also increased the cost. On this research Bird's Beak process was use to present element. Using Silvaco simulator, it was proven that it was able to reduce current leakage without mask layer. As a result, it was possible to suggest the structure that can reduce the current leakage to 1.39nA without having mask layer increase. Also, I was able to lead the result that electric characteristic (on/off current ratio) was improved compare from conventional structure.

• 대한전자공학회논문지TC
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• 제42권3호
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• pp.33-38
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• 2005

본 논문에서는 표면 마이크로 머시닝 기법으로 구현된 DAML (Dielectric-supported Airbridge Microstrip Line) 형태의 새로운 구조를 이용하여 $180^{\circ}$ 링 하이브리드 결합기를 설계 및 제작 하였다. DAML 구조로 이용하여 제작된 결합기는 60 GHz 중심 주파수에서 3.58 dB의 S31과 3.31 dB의 S21과 61 GHz에서 16.17 dB 이상의 S11과 55 dB 이상의 S41를 얻을 수 있다. 결합기의 크기를 줄이기 위하여 slow wave 구조가 삽입된 결합기를 설계 제작하였으며 크기를 $33\%$ 정도 줄일 수 있는 효과를 얻을 수 있었다.