• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.129-129
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• 2009

In this paper, a tunable microstrip patch antenna designed using RF MEMS switches is reported. The design and simulation antenna were performed using high frequency structure simulator (HFSS). The antenna was designed in ISM Band and operates simultaneously at 2.4 GHz and 5.7 GHz with a -10 dB return-loss bandwidth of 20 MHz and 180 MHz, respect-tively. To obtain high efficiency and improve integrated ability, the High Resistivity Silicon (HRS) wafer was used for the antenna. The antenna achieved high gain with 8 dB at 5.7 GHzand 1.5 dB at 2.4 GHz. The RF MEMS DC contact switches was simulated and analysis by ANSYS software.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1701-1705
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• 2004

This paper presents a design and analysis of electromechanical sigma-delta modulator for MEMS gyroscope, which enables us to control the proof mass and to obtain an exact digital output without additional A/D conversion. The system structure and the circuit realization of the sigma-delta modulation are simpler than those of the analog sensing and feedback circuit. Based on the electrical sigma-delta modulator theory, a compensator is designed to improve the closed loop resolution of the sensor. With the designed compensator, we could obtain enhanced closed-loop performances of the gyroscope such as larger bandwidth, lower noise, and digital output comparing with the results of analog open-loop system.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.592-595
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• 2004

This paper presents a study on the development of a multi-sensing inertial sensor with a single mechanical structure, which can be used both as a gyroscope and an accelerometer. The proposed MEMS gyro-accelerometer is designed to detect the angular rate and the acceleration at the same time using two separate detection circuits for one proof mass. In this study, the detection and signal processing circuit for an effective signal processing of different inertial measurements is designed, fabricated, and tested. The experimental results show that the performances of the gyro-accelerometer have resolutions of 1mg and 0.025deg/sec and nonlinearities of less than 0.5% for the accelerometer and the gyroscope, respectively, which are similar results with those of sensors with different structures and different detection circuits. The size of the sensor is reduced almost by 50% comparing with the sensors of separated proof mass.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.371-371
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• 2010

In this paper, the stress induced leakage currents of thin silicon oxides is investigated in the MEMS implementation with nano structure. The stress and transient currents associated with the on and off time of applied voltage were used to measure the distribution of high voltage stress induced traps in thin silicon oxide films. The oxide current for the thickness dependence of stress current, transient current, and stress induced leakage currents has been measured in oxides with thicknesses between $41{\AA}$, which have the gate area $10^{-3}cm^2$. The stress current, transient current is used to estimate to fundamental limitations on oxide thicknesses.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1211-1214
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• 2003

The film is prepared by electron cyclotron resonance chemical vapor deposition (ECRCVD) employing CH$_4$ and H$_2$ gases. It is deposited by the control of microwave plasma power, gas flow ratio, deposition pressure, and In-situ thermal treatment temperature. The structure of a-C:H (hydrogenated amorphous carbon) thin film is analysed by FT-IR spectroscopy. The fraction sp$^3$ versus sp$^2$ bonding is very important to clear up the surface and interrace of a-C:H film properties such as nano-scale friction behavior. The sp$^3$ versus sp$^2$ bonding of a-C:H thin film is dependent on the deposition conditions, therefore. nano-scale friction behavior is dependent on the deposition conditions.

• Journal of Sensor Science and Technology
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• v.20 no.3
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• pp.145-150
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• 2011

In this paper, we designed a tunable microstrip patch antenna using RF MEMS switches. The design and simulation of the antenna were performed using a high frequency structure simulator(HFSS). The antenna was designed for use in the ISM band and either operates at 2.4 GHz or 5.7 GHz achieving -10 dB return-loss bandwidths of 20 MHz and 180 MHz, respectively. In order to obtain high efficiency and improve the ease of integration, a high resistivity silicon(HRS) wafer on a glass substrate was used for the antenna. The antenna achieved high gains: 8 dB at 5.7 GHz and 1 dB at 2.4 GHz. The RF MEMS DC contact switches were simulated and analyzed using ANSYS software.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1994-1996
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• 2002

This paper reports a novel high-speed fluid injection system employing a simple magnetic micoractuator. This magnetic microacutator consists of current carrying copper beams and permanent magnet under the beams. There were many efforts to magnetic microactuator realization using conducting coils [1-2]. Even though many of magnetic microactuators were successfully fabricated and tested, it is true that most them suffer complex fabrication processes and thus higher production costs than electrostatic counterparts. In this research, efforts were concentrated on the microactuator realization that has simple structure, low production cost, and mass production possibility.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.673-675
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• 2005

Ink jet printheads are now widely used in manufacturing processes that require precise dispensing of materials. Today, Dimatix manufactures a variety of drop-on-demand ink jet printheads for the industrial printing market, but emerging opportunities present fresh challenges to our technology. In response to requirements for digitally printing on flexible substrates and dispensing novel electronic fluids, we are developing next generation jetting technology based on our three-dimensional silicon MEMS technology with a piezo-driven pumping chamber integrated into the chip structure. This presentation will address the functional and physical design features and properties of Dimatix's MEMS process, its characteristics, reliability and usability. Examples of opportunities and applications for digitally printing electronic fluids on flexible substrates with MEMS-based ink jet technology will be presented.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.6 s.261
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• pp.644-650
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• 2007

Mechanical property evaluation of micrometer-sized structures is necessary to help design reliable microelectromechanical systems(MEMS) devices. Most material properties are known to exhibit dependence on specimen size and such properties of microscale structures are not well characterized. This paper describes techniques developed for tensile testing of thin film used in MEMS. Epi-polycrystalline silicon is currently the most widely used material, and its tensile strength has been measured as 1.52GPa. We have developed a tensile testing machine for testing microscale specimen using electro-magnetic actuator. The field magnet and the moving coil taken from an audio-speaker were utilized as the components of the actuator. Structure of specimen was designed and manufactured for easy handling and alignment. In addition to the static tensile tests, it is described that new techniques and procedures can be adopted for high cycle fatigue test of a thin film.

• Journal of Sensor Science and Technology
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• v.29 no.5
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• pp.354-359
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• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.