• 센서학회지
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• 제19권4호
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• pp.259-270
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• 2010

MEMS(micro electro mechanical systems) is a technology for the manufacture hyperfine structure, as a micro-sensor and a driving device, by a variety of materials such as silicon and polymer. Many study for utilizing the MEMS applications have been performed in variety of fields, such as light devices, high frequency equipments, bio-technology, energy applications and other applications. Especially, the field of Bio-MEMS related with bio-technology is very attractive, because it have the potential technology for the miniaturization of the medical diagnosis system. Bio-MEMS, the compound word formed from the words 'Bio-technology' and 'MEMS', is hyperfine devices to analyze biological signals in vitro or in vivo. It is extending the range of its application area, by combination with nano-technology(NT), Information Technology(IT). The LOC(lab-on-a-chip) in Bio-MEMS, the comprehensive measurement system combined with Micro fluidic systems, bio-sensors and bio-materials, is the representative technology for the miniaturization of the medical diagnosis system. Therefore, many researchers around the world are performing research on this area. In this paper, the application, development and market trends of Bio-MEMS are investigated.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1896-1898
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• 2001

An offset problem caused by the static parasitic capacitors is analyzed and then some techniques to reduce their effect on the capacitive position sensor are presented. Also new offset compensation technique is proposed that by adjusting the magnitudes of the modulating signals independently, the charge imbalance between electrodes caused by the parasitic capacitors is eliminated without sensor gain variation. Simulation results are given to validate the proposed compensation technique.

• 대한전자공학회논문지SD
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• 제42권11호
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• pp.1-8
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• 2005

본 논문은 MEMS (Micro-Mechanical-Electronic System) 기술을 이용한 온도, 압력, 습도 복합 센서의 설계와 제작, 그리고 평가에 관한 것이다. 이러한 MEMS 복합 센서는 휴대 전화나 PDA와 같이 가정용 제품에 사용되어 환경을 모니터링하는 건강 측정용 센서로서 사용될 것이다. 이 연구의 범위는 이러한 개별 센서의 연구 및 모든 센서를 하나의 실리콘 웨이퍼 상에서 집적할 수 있는 구조에 관한 연구, 그리고 복합 센서를 MEMS 공정에서 제작할 수 있는 공정 호환성에 대한 연구와 얻어진 센서 prototype의 측정, 평가로 이루어져 있다. 이 연구에서 우리는 온도와 압력 센서의 경우에는 선형성과 이력특성이 $1\%FS$안에 들어오는 특성을 얻었으며 단지 습도 센서의 경우에는 $5\%FS$에 해당하는 선형성과 이력 특성을 얻었다. 다만 원리적으로 습도 센서의 동작 특성은 비선형적이며 우리가 3차로 근사화할 경우에 보다 낳은 결과를 얻을 것을 기대할 수 있다. 이러한 특성을 더욱 개선하기 위한 것은 추후의 연구 영역이 될 것이다.

• Journal of Mechanical Science and Technology
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• 제20권4호
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• pp.505-512
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• 2006

This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

• 한국정보통신학회논문지
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• 제23권11호
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• pp.1364-1370
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• 2019

건축물이나 교량, 터널과 같은 구조물의 붕괴를 측정하기 위하여 기울기 센서를 사용하고 있으며 최근에는 사용성이 편리하고 가격이 저렴하여 MEMS(Micro-Electro-Mechanical System) 센서를 사용한 기울기 센서를 많이 사용하고 있으나 측정 범위가 한정되어 있어 360도 전 방위에 대해 고정밀도를 가지지는 못하고 있다. 이것은 MEMS 센서가 갖는 오프셋과 스케일 오차 때문이다. 본 논문에서는 MEMS 센서가 갖는 기계적 오차를 줄이기 위하여 정밀도가 높은 각도 계산을 위한 알고리즘을 제시하였고 MEMS 센서 모듈과 전송 모듈을 제작하여 교정 전 센서 모듈의 각도 정확도와 교정 후 각도 측정 정확도를 비교하여 교정 알고리즘의 효과를 제시하였으며, 실험 결과 제안 기술을 적용하였을 때 360도 전 방위에 대해 ±0.015도의 정밀도를 가짐을 확인하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.497-502
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• 2002

This paper describes a design methodology of a tri-axial silicon-based farce sensor with square membrane by using micromachining technology (MEMS). The sensor has a maximum farce range of 5 N and a minimum force range of 0.1N in the three-axis directions. A simple beam theory was adopted to design the shape of the micro-force sensor. Also the optimal positions of piezoresistors were determined by the strain distribution obtained from the commercial finite element analysis program, ANSYS. The Wheatstone bridge circuits were designed to consider the sensitivity of the force sensor and its temperature compensation. Finally the process for microfabrication was designed using micromachining technology.

• 한국공간구조학회논문집
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• 제18권4호
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• pp.49-59
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• 2018

Wireless sensors are more favorable in measuring structural response compared to conventional sensors. This is because they are easier to use with no issues with cables and are considerably cheaper. There are several applications that can be used in recording and analyzing data from MEMS sensor installed on an iPhone. The Vibration App is one of the applications used and there has not been adequate research conducted in analyzing the performance of this App. This paper analyzed the performance of the Vibration App by comparing it with the performance of an ICP sensor. Results show that natural frequency results are more accurate (error less than 5%) in comparison to the amplitude results. This means that built- in MEMS sensor in smartphones are good at estimating natural frequency of structures. In addition, it was seen that the results became more accurate at higher frequencies (5.0Hz and 10.0Hz).

• 전기학회논문지
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• 제56권8호
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• pp.1461-1465
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• 2007

A micromachined sensor part for an infrared focal plane array has been designed and fabricated. Amorphous silicon was adapted as a sensing material, and silicon nitride was used as a membrane material. To get a good efficiency of infrared absorption, the sensor was made as a ${\lambda}/4$ cavity structure. All the processes were done in $0.5\;{\mu}m$ iMEMS fab. in the Electronics and Telecommunication Research Institute (ETRI). The processed MEMS sensor structure had a small membrane deflection less than $0.3\;{\mu}m$. This excellent deflection property can be attributed to the rigorous balancing of the stresses of individual layers. The efficiency of infrared absorption was more than 75% in the wavelength range $8\;-\;14\;{\mu}m$.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2007년도 춘계학술대회논문집
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• pp.448-452
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• 2007

Many industrial operations require continuous or nearly-continuous operation of machines, which if interrupted can result in significant financial loss. The condition monitoring of these machines has received considerable attention recent years. Rapid developments in semiconductor, computing, and communication with a remote site have led to a new generation of sensor called "smart" sensors which are capable of wireless communication with a remote site. The purpose of this research is the development of smart sensor using which can on-line perform condition monitoring. This system is addressed to detect conditions that may lead to equipment failure when it is running. Moreover it will reduce condition monitoring expense using low cost MEMS accelerometer. This sensor can receive data in real-time or periodic time from MEMS accelerometer. Furthermore, this system is capable for signal preprocessing task (High Pass Filter, Low Pass Filter and Gain Amplifier) and analog to digital converter (A/D) which is controlled by CPU. A/D converter that converts 10bit digital data is used. This sensor communicates with a remote site PC using TCP/IP protocols. Wireless LAN contain IEEE 802.11i-PSK or WPA (PSK, TKIP) encryption. Developed sensor executes performance tests for data acquisition accuracy estimations.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.