• 제목/요약/키워드: MEMS Fabrication Process

검색결과 189건 처리시간 0.027초

경사 전극 배열을 이용한 고밀도 하드 디스크의 마이크로 구동부 제작 (A Microcatuator for High-Density Hard Disk Drive Using Skewed Electrode Arrays)

  • 최석문;박성준
    • 융복합기술연구소 논문집
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    • 제1권2호
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    • pp.6-15
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    • 2011
  • This paper reports the design and fabrication of a micro-electro-mechanical-system(MEMS)-based electrostatic angular microactuator for a dual-stage servo. The proposed actuator employs a novel electrode pattern named "skewed electrode array(SEA)" scheme. It is shown that SEA has better linearity than a parallel plate type actuator and stronger force than a comb-drive based actuator. The moving and the fixed electrodes are arranged to make the driving force perpendicular to the rotating moment of arm. By changing the electrode overlap length, the magnitude of electrostatic force and stable displacement will be changed. In order to optimize the design, an electrostatic FE analysis was carried out and an empirical force model was established for SEA. A new assembly method which will allow the active electrodes to be located beneath the slider was developed. The active electrodes are connected by inner and outer rings lifted on the base substrate, and the inner and outer rings are connected to platform on which the slider locates. Electrostatic force between active electrodes and platform can be used for exiting out of plane modes, so this provides the possibility of the flying height control. A microactuator that can position the pico-slider over ${\pm}0.5{\mu}m$ using under 20 volts for a 2 kHz fine-tracking servo was designed and fabricated using SoG process.

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전사방법을 이용한 폴리머 필름에 내재된 실리콘 나노구조물 어레이 제작 (Fabrication of a Silicon Nanostructure Array Embedded in a Polymer Film by using a Transfer Method)

  • 신호철;이동기;조영학
    • 한국생산제조학회지
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    • 제25권1호
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    • pp.62-67
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    • 2016
  • This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).

구배 지수에 근거한 강건 최적 설계 기법을 이용한 공진형 미소탐침의 강건 최적화 (Robust Optimization of a Resonant-type Micro-probe Using Gradient Index Based Robust Optimal Design Method)

  • 한정삼;곽병만
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1254-1261
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    • 2003
  • In this paper we present a simple and efficient robust optimal design formulation and its application to a resonant-type micro probe. The basic idea is to use the Gradient Index (GI) to improve robustness of the objective and constraint functions. In the robust optimal design procedure, a deterministic optimization for performance of MEMS structures is followed by design sensitivity analysis with respect to uncertainties such as fabrication errors and change of operating conditions. During the process of deterministic optimization and sensitivity analysis, dominant performance and uncertain variables are identified to define GI. The GI is incorporated as a term of objective and constraint functions in the robust optimal design formulation to make both performance and robustness improved. While most previous approaches for robust optimal design require statistical information on design variations, the proposed GI based method needs no such information and therefore is cost-efficient and easily applicable to early design stages. For the micro probe example, robust optimums are obtained to satisfy the targets for the measurement sensitivity and they are compared in terms of robustness and production yield with the deterministic optimums through the Monte Carlo simulation.

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마이크로 리블렛이 부착된 NACA0012 익형의 항력 감소 연구 (Drag Reduction of NACA0012 Airfoil with a Flexible Micro-riblet)

  • 장영길;이상준
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2002년도 학술대회지
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    • pp.479-482
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    • 2002
  • Riblets with longitudinal grooves along the streamwise direction have been used as an effective flow control technique for drag reduction. A flexible micro-riblet with v-grooves of peak-to-peak spacing of $300{\mu}m$ was made using a MEMS fabrication process of PDMS replica. The flexible micro-riblet was attached on the whole surface of a NACA0012 airfoil with which grooves are aligned with the streamwise direction. The riblet surface reduces drag coefficient about $7.9{\%}\;at\;U_o=3.3m/s$, however, it increases drag about $8{\%}\;at\;U_o=7.0m/s$, compared with the smooth airfoil without riblets. The near wake has been investigated experimentally far the cases of drag reduction ($U_o\;=\;3.3 m/s$) and drag increase ($U_o\;=\;7 m/s$). Five hundred instantaneous velocity fields were measured for each experimental condition using the cross-correlation PIV velocity field measurement technique. The instantaneous velocity fields were ensemble averaged to get spatial distribution of turbulent statistics such as turbulent kinetic energy. The experimental results were compared with those of a smooth airfoil under the same flow condition. The micro-riblet surface influences the near wake flow structure largely, especially in the region near the body surface

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집적형 광 픽업용 대면적 실리콘 미러 제작 (Fabrication of Large Area Silicon Mirror for Integrated Optical Pickup)

  • 김해성;이명복;손진승;서성동;조은형
    • 정보저장시스템학회논문집
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    • 제1권2호
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    • pp.182-187
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    • 2005
  • A large area micro mirror is an optical element that functions as changing an optical path by reflection in integrated optical system. We fabricated the large area silicon mirror by anisotropic etching using MEMS for implementation of integrated optical pickup. In this work, we report the optimum conditions to better fabricate and design, greatly improve mirror surface quality. To obtain mirror surface of $45^{\circ},\;9.74^{\circ}$ off-axis silicon wafer from (100) plane was used in etching condition of $80^{\circ}C$ with 40wt.% KOH solution. After wet etching, polishing process by MR fluid was applied to mirror surface for reduction of roughness. In the next step, after polymer coating on the polished Si wafer, the Si mirror was fabricated by UV curing using a trapezoid bar-type way structure. Finally, we obtained peak to valley roughness about 50 nm in large area of $mm^2$ and it is applicable to optical pickup using blu-ray wavelength as well as infrared wavelength.

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PZT 박막의 압전특성에 미치는 공정변수의 효과 (Effect of Process Parameter on Piezoelectric Properties of PZT Thin films)

  • 김동국;지정범
    • 한국전기전자재료학회논문지
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    • 제15권12호
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    • pp.1060-1064
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    • 2002
  • We have studied the effect of crystallization temperature, composition and film thickness, which are the fundamental processing parameters of lead zirconate titanate(PZT) thin film fabrication, in the respect of the piezoelectric properties by our pneumatic loading method(PLM). A great deal of research has been done in the field of characterization for piezoelectric thin films after the first report on the measurement for the piezoelectric coefficient of thin films in 1990. Even though the piezoelectric properties of thin films are very critical factors in the micro-electro mechanical system(MEMS) and thin film sensor devices, a few reports for the piezoelectric characterization are provided for the last decade unlikely the bulk piezoelectric devices. We have found that the piezoelectric properties of thin films are improved as the increase of crystallization temperature up to 750$\^{C}$ and this behavior can be also explained by the analysis of dielectric polarization hysteresis loop, X-ray diffraction and scanning electron microscopy. The effect of Zr/Ti composition has been also studied. This gives us the fact that the maximum piezoelectricity is found near Morphotropic Phase Boundary(MPB) as bulk PZT system does.

저온 공정을 통해 제작이 가능한 Sn/SWNT 혼합 파우더 기반의 TSV구조 개발 (Manufacture of TSVs (Through-Silicon Vias) based on Single-Walled Nanotubes (SWNTs)/Sn Composite at Low Temperature)

  • 정동건;정대웅;공성호
    • 센서학회지
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    • 제28권2호
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    • pp.127-132
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    • 2019
  • In this study, the fabrication of through-silicon vias (TSVs) filled with SWNTs/Sn by utilizing surface/bulk micromachining and MEMS technologies is proposed. Tin (Sn) and single-walled nanotube (SWNT) powders are used as TSV interconnector materials in the development of a novel TSV at low temperature. The measured resistance of a TSV filled with SWNT/Sn powder is considerably reduced by increasing the fraction of Sn and is lower than that of a TSV filled with only Sn. This is because of a decrease in the surface scattering of electrons along with an increase in the grain size of sintered SWNTs/Sn. The proposed method is conducted at low temperatures (< $400^{\circ}C$) due to the low melting temperature of Sn; hence, the proposed TSVs filled with SWNTs/Sn can be utilized in CMOS based applications.

Quatrz 웨이퍼의 직접접합과 극초단 레이저 가공을 이용한 체내 이식형 혈압센서 개발 (Development of Implantable Blood Pressure Sensor Using Quartz Wafer Direct Bonding and Ultrafast Laser Cutting)

  • 김성일;김응보;소상균;최지연;정연호
    • 대한의용생체공학회:의공학회지
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    • 제37권5호
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    • pp.168-177
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    • 2016
  • In this paper we present an implantable pressure sensor to measure real-time blood pressure by monitoring mechanical movement of artery. Sensor is composed of inductors (L) and capacitors (C) which are formed by microfabrication and direct bonding on two biocompatible substrates (quartz). When electrical potential is applied to the sensor, the inductors and capacitors generates a LC resonance circuit and produce characteristic resonant frequencies. Real-time variation of the resonant frequency is monitored by an external measurement system using inductive coupling. Structural and electrical simulation was performed by Computer Aided Engineering (CAE) programs, ANSYS and HFSS, to optimize geometry of sensor. Ultrafast laser (femto-second) cutting and MEMS process were executed as sensor fabrication methods with consideration of brittleness of the substrate and small radial artery size. After whole fabrication processes, we got sensors of $3mm{\times}15mm{\times}0.5mm$. Resonant frequency of the sensor was around 90 MHz at atmosphere (760 mmHg), and the sensor has good linearity without any hysteresis. Longterm (5 years) stability of the sensor was verified by thermal acceleration testing with Arrhenius model. Moreover, in-vitro cytotoxicity test was done to show biocompatiblity of the sensor and validation of real-time blood pressure measurement was verified with animal test by implant of the sensor. By integration with development of external interrogation system, the proposed sensor system will be a promising method to measure real-time blood pressure.

가변 속도 이동식 마스크를 이용한 렌즈 곡면 형성 (Generation of Lens surface by moving mask lithography)

  • 이준섭;박우제;송석호;오차환;김필수
    • 한국광학회지
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    • 제16권6호
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    • pp.508-515
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    • 2005
  • MEMS 공정을 이용한 굴절렌즈 제작을 위하여, 슬릿 패턴을 갖는 마스크를 이동시키며 노광을 하는 가변 속도 이동식 마스크에 의한 노광 방법을 제안하였다. 감광제 면이 굴절렌즈의 곡면을 이루려면 감광제의 위치에 따른 노광 에너지의 분포를 조절해야 한다. 마스크의 패턴 형태와 이동 속돈 방향에 따라 감광제의 위치에 따른 노광 에너지의 분포를 이론적으로 분석하였으며, 감광제 박막에 임의의 곡면을 갖는 굴절렌즈 형상을 형성할 수 있음을 실험적으로 확인하였다. $100 {\mu}m$ 이상의 후막 감광제를 이용하거나, 혹은 곡면 형상을 갖는 얇은 감광제 형상을 마스크로 하여 이온식각을 수행하여 수백 ${\mu}m$ 정도의 최대높이를 갖는 렌즈 곡면형상을 제작 할 수 있었다.

복합 산화법과 MEMS 기술을 이용한 RF용 두꺼운 산화막 에어 브리지 및 공면 전송선의 제조 (Fabrication of Thick Silicon Dioxide Air-Bridge and Coplanar Waveguide for RF Application Using Complex Oxidation Process and MEMS Technology)

  • 김국진;박정용;이동인;이봉희;배영호;이종현;박세일
    • 센서학회지
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    • 제11권3호
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    • pp.163-170
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    • 2002
  • 본 논문에서는 양극반응과 복합 산화법($H_2O/O_2$ 분위기에서 $500^{\circ}C$, 1시간 열산화와 $1050^{\circ}C$, 2분간 RTO(Rapid Thermal Oxidation) 공정)을 이용한 두꺼운 OPSL(Oxidized Porous Silicon Layer)을 형성하여 이를 마이크로머시닝 기술을 이용함으로써 $10\;{\mu}m$ 두께의 OPS(Oxidized Porous Silicon) 에어 브리지를 제조하고, 그 위에 전송선로를 형성하여 그 RF 특성을 조사하였다. OPS 에어 브리지 위에 형성된 CPW(Coplanar Waveguide)의 손실이 OPSL 위에 형성된 전송선의 삽입손실보다 약 2dB 정도 적은 것을 보여주었으며, 반사손실은 OPSL 위에 형성된 전송선의 반사손실보다 적으며 약 -20 dB를 넘지 않고 있다. 본 연구에서 개발한 산화된 다공질 실리콘 멤브레인 및 에어 브리지 구조는 CMOS 공정 후에 사용 가능하며, 초고주파 회로 설계시 편리성과 유용성을 제시하고 있다.