• Proceedings of the KSME Conference
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• 2007.05a
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• pp.608-613
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• 2007

Fine pitch microprobe arrays are microneedle-like probes for inspecting the pixel of LCD panel. They are usually made of multilayers of metallic, nonmetallic, or combination of the two. In this study, the microprobe arrays were fabricated using the process applied for MEMS fabrication technology and they consist of BeCu, BeNi, or Si. Their contacting probing force and deflection were measured using the laser equipment. The design requirement are 5gf of a minimum contact force and $150{\mu}m$ of a maximum deflection. A lot of microprobe shape are possible satisfying the requirement. A double cantilever-type microprobe having needles on both ends were applied for this study. Several candidate were chosen using the topology and shape optimization technique subjected to the design requirements. Finite element results and experimental results were compared and both gave good correlation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.148-148
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• 2004

전 세계적으로 컴퓨터 및 이동통신의 급속한 발전과 함께 전자, 통신부품을 비롯한 각종 부품들의 초소형화, 고기능화가 요구되고 있다. 이러한 추세에 따라 수 $\mu\textrm{m}$ 의 크기와 수 nm의 정밀도를 갖는 MEMS기술과 NANO 기술에 대한 연구가 활발히 전개되고 있다 MEMS 기술의 경우기존의 생산, 가공 공정과는 완전히 다른 반도체공정을 기반으로 한 리소그래피(lithography) 기술이나 전기도금(electroplating) 등의 기존 기계공학적 생산, 가공 방법을 넘어선 기술을 사용하게 되며 NANO 기술 역시 분자, 원자 단위를 기초로 한 AFM(atomic force microscope) 기술과 임프린팅(nanoimprinting) 기술 등의 새로운 기술을 접목시키는 생산 방법을 사용한다.(중략)

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.11a
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• pp.88-91
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• 2005

Although the MEMS element is made through a very precise manufacturing process, usually there is the difference between the modeling design and the actual product. So tuning is required. Through the frequency tuning(changing the characteristics of device), we can calibrate the fabrication error and uncertainty. I'll propose the method of changing the natural frequency through the imposing the axial force on the anchor part to separate the sensing part and the tuning part. When the shape of section is the form of rectangular, the degree of the natural frequencies' change under axial force appears D be different. Applying a tuning force of 30 $\mu$N, the natural frequencies' difference can be reduced by 5 percent.

• Korean Journal of Optics and Photonics
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• v.16 no.5
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• pp.428-432
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• 2005

Microlens precisely fabricated by MEMS process, is a key component of the Microcolumn, Since, miniaturization can reduces aberrations, microcolumn is expected to have better performance than conventional columns. Depending on the fabrication techniques, the sectional view of micro lens has different shape. In the paper, the effect of the sectional shape of extractor lens and limiting aperture on the focusing property of microcolumns have been studied.

• Korean Journal of Metals and Materials
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• v.49 no.4
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• pp.304-312
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• 2011

In this study, MOSFET type micro hydrogen gas sensors with platinum catalytic metal gates were designed, fabricated, and their electrical characteristics were analyzed. The devised MOSFET Hydrogen Sensors, called MHS-1 and -2, were designed with a platinum gate for hydrogen gas adsorption, and an additional sensing part for higher gas sensitivity and with a micro heater for operation temperature control. In the electrical characterization of the fabricated Pt-gate MOSFET (MHS-1), the saturated drain current was 3.07 mA at 3.0 V of gate voltage, which value in calculation was most similar to measurement data. The amount of threshold voltage shift and saturated drain current increase to variation of hydrogen gas concentration were calculated and the hydrogen gas sensing properties were anticipated and analyzed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.831-835
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• 2013

In this study, we fabricated a micro $Pb(Zr,Ti)O_3$ (PZT) film piezoelectric cantilever with a Si proof mass and dual beams through MEMS process. The size of the beam and the integrated Si proof mass were about $4,320{\mu}m{\times}290{\mu}m{\times}12{\mu}m$ and $1,380{\mu}m{\times}880{\mu}m{\times}450{\mu}m$ each. To reduce the air damping and have the larger displacement of dual beams was used for design. After mounting micro PZT film piezoelectric cantilever on shaker, we measured the resonance frequency and a output voltage while making resonant frequency changed. The resonant frequency and the highest average power of the cantilever device were 110.2 Hz and 0.36 ${\mu}W$ each, at 0.8 g acceleration and 23.7 $k{\Omega}$ load resistance, respectively.

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.430-435
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• 2004

The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.4
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• pp.391-398
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• 2010

In this paper, we propose a sensor design by using a polysilicon strain gauge bonded to a metal diaphragm. The fabrication process of the thin polysilicon strain gauges having thicknesses of $50\;{\mu}m$ was established using conventional MEMS technologies; further, the technique of glass frit bonding of the polysilicon strain gauge to the stainless steel diaphragm was established. Performance of the polysilicon strain gauge bonded to the metal cantilever beam was evaluated. The gauge factor, temperature coefficient of resistance (TCR), nonlinearity, and hysteresis of the polysilicon strain gauge were measured. The results demonstrate that the resistance increases linearly with tensile stress, while it decreases with compressive stress. The value of the gauge factor, which represents the sensitivity of strain gauges, is 34.0; this value is about 7.15 times higher than the gauge factor of a metal-foil strain gauge. The resistance of the polysilicon strain gauge decreases linearly with an increase in the temperature, and TCR is $-328\;ppm/^{\circ}C$. Further, nonlinearity and hysteresis are 0.21 % FS and 0.17 % FS, respectively.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.3
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• pp.182-188
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• 2001

A solenoid-type MEMS inductor with a quality factor over 10 at 2 GHz has been developed using an electroplating technique. The integrated spiral inductor has a low Q factor due to substrate loss and skin effects. It also occupies a large area compared to the solenoid-type inductor. The direction of flux of the solenoid-type inductor is parallel to the substrate, which can lower the substrate loss and other interference with integrated passive components. To estimate the characteristics of the proposed inductor over a high frequency range, the 3D FEM (Finite Element Method) simulation is used by using the HFSS at the Ansoft corporation. The electroplated solenoid-type inductor is fabricated on a glass substrate step by step by using photolithography and copper electroplating. The fabrication process to improve the quality factor of the inductor is also developed. The achieved inductance varies within a range from 0.5 nH to 2.8 nH, and the maximum Q factor is over 10.

• 한국정보통신설비학회:학술대회논문집
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• 2006.08a
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• pp.67-70
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• 2006

This paper deals with a single crystalline silicon (SCS) RF MEMS switch for telecommunication system applications. The proposed SCS switch was fabricated using a silicon-on-glass (SiOG) process and its performances in terms of RF responses, switching time, lifetime were characterized. The proposed SCS switch consists of movable plates, mechanical spring structures, which are composed of robust SCS, resulting in mechanically good stability, The measured actuation voltage was 30 V, and with this applied voltage, the insertion loss and isolation characteristics were measured to be 0.05 and 44.6 dB at 2 GHz respectively. The measured switch ON and OFF time were 13 and $9{\mu}s$, respectively. The lifetime of the fabricated switch was tested. Even after over 1 billion cycles repeated ON/OFF actuations, the switch maintained its own characteristics.