• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.608-613
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• 2007

Fine pitch microprobe arrays are microneedle-like probes for inspecting the pixel of LCD panel. They are usually made of multilayers of metallic, nonmetallic, or combination of the two. In this study, the microprobe arrays were fabricated using the process applied for MEMS fabrication technology and they consist of BeCu, BeNi, or Si. Their contacting probing force and deflection were measured using the laser equipment. The design requirement are 5gf of a minimum contact force and $150{\mu}m$ of a maximum deflection. A lot of microprobe shape are possible satisfying the requirement. A double cantilever-type microprobe having needles on both ends were applied for this study. Several candidate were chosen using the topology and shape optimization technique subjected to the design requirements. Finite element results and experimental results were compared and both gave good correlation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.148-148
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• 2004

전 세계적으로 컴퓨터 및 이동통신의 급속한 발전과 함께 전자, 통신부품을 비롯한 각종 부품들의 초소형화, 고기능화가 요구되고 있다. 이러한 추세에 따라 수 $\mu\textrm{m}$ 의 크기와 수 nm의 정밀도를 갖는 MEMS기술과 NANO 기술에 대한 연구가 활발히 전개되고 있다 MEMS 기술의 경우기존의 생산, 가공 공정과는 완전히 다른 반도체공정을 기반으로 한 리소그래피(lithography) 기술이나 전기도금(electroplating) 등의 기존 기계공학적 생산, 가공 방법을 넘어선 기술을 사용하게 되며 NANO 기술 역시 분자, 원자 단위를 기초로 한 AFM(atomic force microscope) 기술과 임프린팅(nanoimprinting) 기술 등의 새로운 기술을 접목시키는 생산 방법을 사용한다.(중략)

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 추계학술대회논문집
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• pp.88-91
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• 2005

Although the MEMS element is made through a very precise manufacturing process, usually there is the difference between the modeling design and the actual product. So tuning is required. Through the frequency tuning(changing the characteristics of device), we can calibrate the fabrication error and uncertainty. I'll propose the method of changing the natural frequency through the imposing the axial force on the anchor part to separate the sensing part and the tuning part. When the shape of section is the form of rectangular, the degree of the natural frequencies' change under axial force appears D be different. Applying a tuning force of 30 $\mu$N, the natural frequencies' difference can be reduced by 5 percent.

• 한국광학회지
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• 제16권5호
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• pp.428-432
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• 2005

마이크로칼럼에 사용되는 전자렌즈는 MEMS 공정으로 정밀하게 가공되어 기존의 전자칼럼에 비하여 광학수차를 최소화 할 수 있으며, 이는 전자칼럼의 성능 향상에 주요한 요소로 작용한다. 따라서 반도체 공정 방식(습식식각과 건식식각)에 의해 형성되는 렌즈구조에 따른 전자 광학계 연구는 중요한 의미가 있다. 마이크로칼럼을 구성하고 있는 전자방출원, 소스렌즈, 디플렉터, 포커스렌즈(Einzel lens) 중에서 전자빔의 특성에 가장 큰 영향을 주는 것은 소스렌즈이다. 본 연구에서는 소스렌즈의 extractor와 limiting aperture의 구조에 따른 전자빔 특성을 조사하였다.

• 대한금속재료학회지
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• 제49권4호
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• pp.304-312
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• 2011

In this study, MOSFET type micro hydrogen gas sensors with platinum catalytic metal gates were designed, fabricated, and their electrical characteristics were analyzed. The devised MOSFET Hydrogen Sensors, called MHS-1 and -2, were designed with a platinum gate for hydrogen gas adsorption, and an additional sensing part for higher gas sensitivity and with a micro heater for operation temperature control. In the electrical characterization of the fabricated Pt-gate MOSFET (MHS-1), the saturated drain current was 3.07 mA at 3.0 V of gate voltage, which value in calculation was most similar to measurement data. The amount of threshold voltage shift and saturated drain current increase to variation of hydrogen gas concentration were calculated and the hydrogen gas sensing properties were anticipated and analyzed.

• 한국전기전자재료학회논문지
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• 제26권11호
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• pp.831-835
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• 2013

In this study, we fabricated a micro $Pb(Zr,Ti)O_3$ (PZT) film piezoelectric cantilever with a Si proof mass and dual beams through MEMS process. The size of the beam and the integrated Si proof mass were about $4,320{\mu}m{\times}290{\mu}m{\times}12{\mu}m$ and $1,380{\mu}m{\times}880{\mu}m{\times}450{\mu}m$ each. To reduce the air damping and have the larger displacement of dual beams was used for design. After mounting micro PZT film piezoelectric cantilever on shaker, we measured the resonance frequency and a output voltage while making resonant frequency changed. The resonant frequency and the highest average power of the cantilever device were 110.2 Hz and 0.36 ${\mu}W$ each, at 0.8 g acceleration and 23.7 $k{\Omega}$ load resistance, respectively.

• 센서학회지
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• 제13권6호
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• pp.430-435
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• 2004

The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

• 대한기계학회논문집A
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• 제34권4호
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• pp.391-398
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• 2010

금속은 가공성이 우수하기 때문에 다양한 형태의 구조물이나 격막을 제작할 수 있다. 이런 금속 구조물이나 격막에 민감도가 월등히 우수한 실리콘 스트레인 게이지를 적용할 경우 그 응용 범위가 다양해질 수 있다. 이에 금속구조물에 다결정 실리콘 스트레인 게이지를 접착한 형태의 센서를 제안하였다. 실리콘 기판을 이용해 박막형 다결정 실리콘 스트레인 게이지를 제작하기 위한 제작공정을 확립하였으며, 제작된 실리콘 스트레인 게이지를 금속 변형부 위에 접착하기 위한 접착공정을 확립하였다. 이후 금속 외팔보에 실리콘 스트레인 게이지를 글래스 프릿 접착하여 성능평가를 실시하였다. 성능평가 결과 게이지팩터는 34.0 의 값을 가졌으며, TCR(Temperature Coefficient of Resistance)은 $-328\;ppm/^{\circ}C$의 값을 가졌다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권3호
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• pp.182-188
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• 2001

A solenoid-type MEMS inductor with a quality factor over 10 at 2 GHz has been developed using an electroplating technique. The integrated spiral inductor has a low Q factor due to substrate loss and skin effects. It also occupies a large area compared to the solenoid-type inductor. The direction of flux of the solenoid-type inductor is parallel to the substrate, which can lower the substrate loss and other interference with integrated passive components. To estimate the characteristics of the proposed inductor over a high frequency range, the 3D FEM (Finite Element Method) simulation is used by using the HFSS at the Ansoft corporation. The electroplated solenoid-type inductor is fabricated on a glass substrate step by step by using photolithography and copper electroplating. The fabrication process to improve the quality factor of the inductor is also developed. The achieved inductance varies within a range from 0.5 nH to 2.8 nH, and the maximum Q factor is over 10.

• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2006년도 하계학술대회
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• pp.67-70
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• 2006

This paper deals with a single crystalline silicon (SCS) RF MEMS switch for telecommunication system applications. The proposed SCS switch was fabricated using a silicon-on-glass (SiOG) process and its performances in terms of RF responses, switching time, lifetime were characterized. The proposed SCS switch consists of movable plates, mechanical spring structures, which are composed of robust SCS, resulting in mechanically good stability, The measured actuation voltage was 30 V, and with this applied voltage, the insertion loss and isolation characteristics were measured to be 0.05 and 44.6 dB at 2 GHz respectively. The measured switch ON and OFF time were 13 and $9{\mu}s$, respectively. The lifetime of the fabricated switch was tested. Even after over 1 billion cycles repeated ON/OFF actuations, the switch maintained its own characteristics.