• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.153-154
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• 2013

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.47 no.6
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• pp.438-445
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• 2019

In this paper, we present a new approach to extract the g-sensitivity scale-factor error for a MEMS gyroscope. MEMS gyroscopes, based on the use of both angular momentum and the Coriolis effect, have a g-sensitivity error due to mass unbalance. Generally, the g-sensitivity error is not considered in general use of gyroscopes, but it deserves our attention if we are to develop for tactical class performance and reliability. The g-sensitivity error during vehicle flight increases navigation error; so it must be analyzed and compensated for the use of MEMS IMU for high dynamics vehicle systems. Therefore, we analyzed how to extract the g-sensitivity scale-factor error from the inertial sensor error model. Furthermore we propose a new method to extract the g-sensitivity error using flight motion simulator. We verified our proposed method with experimental results.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.36 no.10
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• pp.1017-1025
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• 2008

The air data system(ADS) was developed for unmanned aerial vehicle(UAV) in this paper. Generally, the ADS helps flight control computer(FCC) to control the UAV above the stall speed and to hold the given altitude. The accurate measurement of airspeed and altitude of UAV is important because it indicates a flight performance and assures a safe flight. The ADS consists of MEMS pressure sensors, a lowpass filter, a micro controller unit and a pitot-tube. The ADS errors were reduced by pressure and temperature compensation of MEMS sensors. Finally, the altitude and airspeed data of the ADS was compared with GPS data in the flight test.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.11
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• pp.40-46
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• 2002

A MEMS(Micro Electro Mechanical System) package using a doped-silicon(Si) carrier for coplanar microwave and millimeter-wave integrated circuits is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed carrier scheme is verified by fabrication and measuring a GaAs CPW(Coplanar Waveguide) on the three types of Si-carriers(gold-plated high resistivity, lightly doped, high resistivity). The proposed MEMS package using the lightly doped(15 ${\Omega}{\cdot}$) Si-carrier shows parasitic-free performance since the lossy Si-carrier effectively absorbs and suppresses the resonant leakage.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.195-198
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• 2002

현재의 광통신, 이동통신 및 디지털 시대에서는 보다 소형화되고, 대용량의 데이터 저장 및 다기능 소자에 대한 요구가 많아지고 있다. 이러한 전자 산업 환경에서 MEMS 소자는 여러 요구조건을 만족시킬 수 있는 특징을 갖추고 있으며 실제 소자의 제작에 있어서 MEMS 소자를 이용하여 여러 물리 및 화학 센서 및 Actuator 제작에 응용이 되어지고 있고 Optical switch, Gyroscope, 적외선 어레이 센서, 가속도 센서, 위치 센서 등 여러 분야에서 실용화가 진행되어지고 있다. MEMS 구조물의 packaging 방법에 있어서는 내부 MEMS 소자의 동작을 위한 외부 환경으로부터의 보호를 위하여 Hermetic sealing에 대한 요구를 만족시켜야 한다. 본 발표에서는 이와 같은 MEMS device의 진공 패키지를 구현함에 있어서 기판 내부에 수동소자를 실장할 수 있는 LTCC 기술을 이용하여 진공 패키징하는 방법에 대하여 소개한다. 본 기술을 이용하는 경우 기존의 Hermetic sealing 이외에 향후 적층 기판 내부에 수동소자를 내장시켜 배선 길이 및 노이즈 성분을 감소시켜 더욱 전기적 성능을 향상시킬 수 있는 장점이 있게된다. 본 논문에서는 LTCC 기판을 이용하여 패키징 시킨 후, 내부 진공도에 영향을 줄 수 있는 계면들에서의 시간에 따른 진공도 변화의 특성치를 측정하여 LTCC 기판의 Hermetic sealing 특성에 관하여 조사하였다.

• Smart Structures and Systems
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• v.5 no.6
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• pp.663-679
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• 2009

The use of Micro-Electro-Mechanical Systems (MEMS) accelerometers in geotechnical instrumentation is relatively new but on the rise. This paper describes a new MEMS-based system for in situ deformation and vibration monitoring. The system has been developed in an effort to combine recent advances in the miniaturization of sensors and electronics with an established wireless infrastructure for on-line geotechnical monitoring. The concept is based on triaxial MEMS accelerometer measurements of static acceleration (angles relative to gravity) and dynamic accelerations. The dynamic acceleration sensitivity range provides signals proportional to vibration during earthquakes or construction activities. This MEMS-based in-place inclinometer system utilizes the measurements to obtain three-dimensional (3D) ground acceleration and permanent deformation profiles up to a depth of one hundred meters. Each sensor array or group of arrays can be connected to a wireless earth station to enable real-time monitoring as well as remote sensor configuration. This paper provides a technical assessment of MEMS-based in-place inclinometer systems for geotechnical instrumentation applications by reviewing the sensor characteristics and providing small- and full-scale laboratory calibration tests. A description and validation of recorded field data from an instrumented unstable slope in California is also presented.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.62-66
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• 2023

With the advancement in technology and rapid increase in the demand for microelectromechanical systems (MEMS) based inertial measurement units (IMUs), high-volume production and test system remain a major challenge for the MEMS industry. To compete with the challenging market of Industry 4.0, here we developed an automatic test system to evaluate the performance of the ovenized IMU sensors as well as analyze the data. The automatic test system was developed by interfacing a commercial MEMS IMU (BMI 088) using LabVIEW. The BMI 088 was tested experimentally for long-term bias stability, ON/OFF bias repeatability, and root mean square (rms) noise. Furthermore, the data was analyzed through the developed test system. The results show that the automatic test system has improved the test time and reduced human effort. The developed automatic test system is a significant approach to MEMS research and development (R&D) to increase and improve the mass production of IMUs.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.31-38
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• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.