• Applied Microscopy
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• v.49
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• pp.3.1-3.7
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• 2019

Graphene, which is one of the most promising materials for its state-of-the-art applications, has received extensive attention because of its superior mechanical properties. However, there is little experimental evidence related to the mechanical properties of graphene at the atomic level because of the challenges associated with transferring atomically-thin two-dimensional (2D) materials onto microelectromechanical systems (MEMS) devices. In this study, we show successful dry transfer with a gel material of a stable, clean, and free-standing exfoliated graphene film onto a push-to-pull (PTP) device, which is a MEMS device used for uniaxial tensile testing in in situ transmission electron microscopy (TEM). Through the results of optical microscopy, Raman spectroscopy, and TEM, we demonstrate high quality exfoliated graphene on the PTP device. Finally, the stress-strain results corresponding to propagating cracks in folded graphene were simultaneously obtained during the tensile tests in TEM. The zigzag and armchair edges of graphene confirmed that the fracture occurred in association with the hexagonal lattice structure of graphene while the tensile testing. In the wake of the results, we envision the dedicated preparation and in situ TEM tensile experiments advance the understanding of the relationship between the mechanical properties and structural characteristics of 2D materials.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.1
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• pp.62-67
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• 2016

This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).

• Journal of Ocean Engineering and Technology
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• v.31 no.2
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• pp.177-182
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• 2017

This paper describes an unscented Kalman filter approach to estimate the bias in magnetic field measurements. A microelectromechanical systems attitude heading reference system (MEMS AHRS) was used to measure the magnetic field, together with the acceleration and angular rate. A magnetic field is usually used for yaw detection, while the acceleration serves to detect the roll and pitch. Magnetic field measurements are vulnerable to distortion due to hard-iron effect and soft-iron effect. The bias in the measurement accounts for the hard-iron effect, and this paper focuses on an approach to estimate this bias. The proposed method is compared with other methods through experiments that implement the navigation of an underwater robot using an AHRS and Doppler velocity log. The results verify that the compensation of the bias by the proposed method improves the navigation performance more than or comparable to the compensation by other methods.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.477-482
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• 2006

In this study, a micro vapor compressor has been designed, fabricated and tested. The micro vapor compressor was made of silicon substrates and fabricated by micromachining process. The compressor is driven by a piezoelectric actuator which is widely used in microfluidic systems because of its strong force and rapid response. The actuator is a bimorph structure which consists of a silicon membrane and a piezoelectric ceramic film. A simulation work was conducted on the performance characteristics of the compressor. The simulation investigated the flow rate variation under various back pressure conditions. Experimental works were carried out on the operation of a compressor and the test results were compared with the simulation results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.418-418
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• 2008

The electrochemical etching of silicon in HF-based solutions is known to form various types of porous structures. Porous structures are generally classified into three categories according to pore sizes: micropore (below 2 nm in size), mesopore (2 ~ 50 nm), and macropore (above 50 nm). Recently, the formation of macropores has attracted increasing interest because of their promising characteristics for an wide scope of applications such as microelectromechanical systems (MEMS), chemical sensors, biotechnology, photonic crystals, and photovoltaic application. One of the promising applications of macropores is in the field of MEMS. Anisotropic etching is essential step for fabrication of MEMS. Conventional wet etching has advantages such as low processing cost and high throughput, but it is unsuitable to fabricate high-aspect-ratio structures with vertical sidewalls due to its inherent etching characteristics along certain crystal orientations. Reactive ion dry etching is another technique of anisotropic etching. This has excellent ability to fabricate high-aspect-ratio structures with vertical sidewalls and high accuracy. However, its high processing cost is one of the bottlenecks for widely successful commercialization of MEMS. In contrast, by using electrochemical etching method together with pre-patterning by lithographic step, regular macropore arrays with very high-aspect-ratio up to 250 can be obtained. The formed macropores have very smooth surface and side, unlike deep reactive ion etching where surfaces are damaged and wavy. Especially, to make vertical microwire or nanowire arrays (aspect ratio = over 1:100) on silicon wafer with top-down photolithography, it is very difficult to fabricate them with conventional dry etching. The electrochemical etching is the most proper candidate to do it. The pillar structures are demonstrated for n-type silicon and the formation mechanism is well explained, while such a experimental results are few for p-type silicon. In this report, In order to understand the roles played by the kinds of etching solution and mask patterns in the formation of microwire arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, dimethyl sulfoxide (DMSO), iso-propanol, and mixtures of HF with water on the structure formation on monocrystalline p-type silicon with a resistivity with 10 ~ 20 $\Omega{\cdot}cm$. The different morphological results are presented according to mask patterns and etching solutions.

• Journal of Sensor Science and Technology
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• v.8 no.3
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• pp.265-273
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• 1999

Various oxide films are commonly used as a sacrificial layer or etch mask in the fabrication of microelectromechanical systems (MEMS). Large residual strain of these oxide films causes the wafer to bow, which can have detrimental effects on photolithography and other ensuing processes. This paper investigates the residual strain of tetraethoxysilane (TEOS), low temperature oxide (LTO), 7 wt% and 10 wt% phosphosilicate glass (PSG). Euler beams and a bent-beam strain sensor are used to measure the residual strain. A poly silicon layer is used as the sacrificial layer, which is selectively etched away by $XeF_2$. First, the residual strain of as-deposited films is measured, which is quite large. The residual strain of the films is also measured after annealing them not only at $500^{\circ}C$, $600^{\circ}C$, $700^{\circ}$ and $800^{\circ}C$ in $N_2$ environment for 1 hour but also at the conditions for depositing a $2\;{\mu}m$ thick polysilicon at $585^{\circ}C$ and $625^{\circ}C$. Our results show that the 7 wt% PSG is best suited as the sacrificial layer for $2\;{\mu}$ thick polysilicon processes.

• Advances in nano research
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• v.16 no.3
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• pp.289-301
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• 2024

In this work, an analytical model employing a new higher-order shear deformation beam theory is utilized to investigate the bending behavior of axially randomly oriented functionally graded carbon nanotubes reinforced composite nanobeams. A modified continuum nonlocal strain gradient theory is employed to incorporate both microstructural effects and geometric nano-scale length scales. The extended rule of mixture, along with molecular dynamics simulations, is used to assess the equivalent mechanical properties of functionally graded carbon nanotubes reinforced composite (FG-CNTRC) beams. Carbon nanotube reinforcements are randomly distributed axially along the length of the beam. The equilibrium equations, accompanied by nonclassical boundary conditions, are formulated, and Navier's procedure is used to solve the resulting differential equation, yielding the response of the nanobeam under various mechanical loadings, including uniform, linear, and sinusoidal loads. Numerical analysis is conducted to examine the influence of inhomogeneity parameters, geometric parameters, types of loading, as well as nonlocal and length scale parameters on the deflections and stresses of axially functionally graded carbon nanotubes reinforced composite (AFG CNTRC) nanobeams. The results indicate that, in contrast to the nonlocal parameter, the beam stiffness is increased by both the CNTs volume fraction and the length-scale parameter. The presented model is applicable for designing and analyzing microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) constructed from carbon nanotubes reinforced composite nanobeams.

• Journal of Biomedical Engineering Research
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• v.28 no.3
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• pp.348-354
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• 2007

Polymer actuators, which are also called as smart materials, change their shapes when electrical, chemical, thermal, or magnetic energy is applied to them and are useful in wide variety of applications such as microelectromechanical systems (MEMS), machine components, and artificial muscles. For this study, Polyaniline/carbon-nanotube polymer actuator that is one of electroactive polymer actuators was prepared. Since the nonlinear phenomena of hysteresis and a step response are essential considerations for practical use of polymer actuators, we have investigated the movement of the Polyaniline/carbon-nanotube polymer actuator and have developed an integrated model that can be used for simulating and predicting the hysteresis and a step response during actuation. The Preisach hysteresis model, one of the most popular phenomenological models of hysteresis, were used for describing the hysteretic behavior of Polyaniline/carbon-nanotube polymer actuator while the ARX method, one of system identification techniques, were used for modeling a step response. In this paper, we first expain details in preparation of the Polyaniline/carbon-nanotube polymer then present the mathematical description of our model, the extraction of the parameters, simulation results from the model, and finally a comparison with measured data.

• Journal of the Korean Vacuum Society
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• v.18 no.2
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• pp.85-91
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• 2009

There has been a rapid progress for flexible polymer-based MEMS(Microelectromechanical Systems) technology. Polycarbonate (PC) and Poly Methyl Methacrylate (PMMA), so-called acrylic, have many advantages for optical, non-toxic and micro-device application. We studied dry etching of PC and PMMA as a function of % gas ratio in the $O_2/SF_6/CH_4$ temary plasma. A photoresist pattern was defined on the polymer samples with a mask using a conventional lithography. Plasma etching was done at 100 W RIE chuck power and 10 sccm total gas flow rate. The etch rates of PMMA were typically 2 times higher than those of PC in the whole experimental range. The result would be related to higher melting point of PC compared to that of PMMA. The highest etch rates of PMMA and PC were found in the $O_2/SF_6$ discharges among $O_2/SF_6$, $O_2/CH_4$ and $SF_6/CH_4$ and $O_2/SF_6/CH_4$ plasma composition (PC: ${\sim}350\;nm/min$ at 5 sccm $O_2/5$ sccm $SF_6$, PMMA: ${\sim}570\;nm/min$ at 2.5 sccm $O_2/7.5$ sccm $SF_6$). PC has smoother surface morphology than PMMA after etching in the $O_2/SF_6/CH_4$ discharges. The surface roughness of PC was in the range of 1.9$\sim$3.88 nm. However, that of PMMA was 17.3$\sim$26.1 nm.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.6 s.324
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• pp.59-68
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• 2004

Thanks to the development of microelectromechanical systems(MEMS), wireless communication technology and microsensor technology, it was Possible to manufacture a very small and low costdata acquisition node with sensing function, processing function, wireless communication function and battery. Thus sensor networks begin to be prevailed. The sensor network is a spontaneous system which sets up automatically routing paths and transmits asignificant data to the destination. Sensor nodes requires low-power operation because most of them use a battery as operating power. Sensor nodes transmit a sensing data to the destination. Moreover, they play a router. In fact, because the later consumes more energy than the former, the low-power routing is very important. Sensor networks don't have a routing standard unlike general wireless Ad-hoc networks. So This paper proposes a low-power routing method for anting to sensor networks. It is based on AODV and adapts a method to drop probably RREQ depending on remaining power. We examined it through simulations. From simulation results, we could confirm to reduce power consumption about $10-20\%$ and distribute equally power consumption among nodes.