• Steel and Composite Structures
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• v.38 no.3
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• pp.337-353
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• 2021

Micro-electro-mechanical systems (MEMS) are widely employed in sensors, biomedical devices, optic sectors, and micro-accelerometers. New reinforcement materials such as carbon nanotubes as well as graphene platelets provide stiffer structures with controllable mechanical specifications by changing the graphene platelet features. This paper deals with buckling analyses of functionally graded graphene platelets micro plates with two piezoelectric layers subjected to external applied voltage. Governing equations are based on Kirchhoff plate theory assumptions beside the modified couple stress theory to incorporate the micro scale influences. A uniform temperature change and external electric field are regarded along the micro plate thickness. Moreover, an external in-plane mechanical load is uniformly distributed along the micro plate edges. The Hamilton's principle is employed to extract the governing equations. The material properties of each composite layer reinforced with graphene platelets of the considered micro plate are evaluated by the Halpin-Tsai micromechanical model. The governing equations are solved by the Navier's approach for the case of simply-supported boundary condition. The effects of the external applied voltage, the material length scale parameter, the thickness of the piezoelectric layers, the side, the length and the weight fraction of the graphene platelets as well as the graphene platelets distribution pattern on the critical buckling temperature change and on the critical buckling in-plane load are investigated. The outcomes illustrate the reduction of the thermal buckling strength independent of the graphene platelets distribution pattern while meanwhile the mechanical buckling strength is promoted. Furthermore, a negative voltage, -50 Volt, strengthens the micro plate stability against the thermal buckling occurrence about 9% while a positive voltage, 50 Volt, decreases the critical buckling load about 9% independent of the graphene platelet distribution pattern.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1522-1523
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• 2007

MEMS(Micro Electro Mechanical Systems)기술과 니켈 전기도금 공정을 이용하여 수십 내지 수백개의 탐침소자를 갖는 프르브디바이스(probe device)를 제작하였다. 사용된 기판은 $4000{\AA}$의 oxide가 있는 p-type 실리콘 웨이퍼로서, 기판위에 NiCr과 Au를 증착한 후 PR 패터닝을 통하여 니켈을 전기도금법으로 도금하고 니켈 도금층을 제외한 부분의 NiCr과 Au를 식각함으로서 전류가 흐르는 라인(line)배선과 탐침소자가 세워질 라인을 형성하였다. 그 후 후막의 PR을 코팅하고 탐침소자가 세워질 부분을 패터닝 한 후 전기도금법을 이용하여 니켈 탐침소자를 제작하였다. 제작된 탐침소자 하나의 크기는 $60{\mu}m$의 폭과 $70{\mu}m$의 높이를 보이며, 탐침소자 전체의 크기는 $250{\mu}m$이고 탐침소자와 탐침소자 사이의 간격은 $50{\mu}m$로 제작되었다. 본 연구에서 제작된 탐침소자의 수는 25*2line으로서 총 50개 이지만 이러한 공정방식을 이용하고 탐침소자의 크기를 작게 제작한다면 하나의 프르브 디바이스에 수백 내지수천 개의 탐침소자를 제작할 수 있을 것이다.

• Journal of Korean Society for Geospatial Information Science
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• v.20 no.1
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• pp.65-72
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• 2012

With the development of MEMS, small and low-priced sensors integrating IMU and GPS have produced and exploited for diverse field. In this research, we have judged that MEMS-based IMU/GPS sensor is suitable for light-weighted mobile mapping system and carried out experiments to analyze the characteristics of MTi-G, which was developed from XSens company. From a sensor which fixed to dashboard, coordinates results with no post-processing were achieved for test area. On the whole, the results show satisfactory performances but some errors also were discovered from parts of the road due to sensor properties, XKF characteristics and GPS reception environment. We could confirm the potential of light-weighted mobile mapping system. Experiments considering various GPS reception environments and road condition and more detailed level of accuracy analysis will be performed for further research.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.2
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• pp.153-158
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• 2016

The elastic material constants, stiffness constants ($c_{11}$, $c_{12}$, and $c_{44}$), are three unique coefficients that establish the relation between stress and strain. Accurate knowledge of mechanical properties and the stiffness coefficients for silicon is required for design of Micro-Electro-Mechanical Systems (MEMS) devices for proper modeling of stress and strain in electronic packaging. In this work, the stiffness coefficients for silicon as a function of temperature from $-150^{\circ}C$ to $+25^{\circ}C$ have been extracted by using the experimental measurements of Poisson's ratio (${\nu}$) of silicon in several directions.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.248-252
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• 2004

The mechanical properties of polycrystalline thin-films, critical for Micro-Electro-Mechanical Systems (MEMS) components, are known to have the size effect and the scatter in the length scale of microns by the numbers of intensive investigation by experiments and simulations. So, the consideration of the microstructure is essential to cover these length scale effects. The lattice based stochastic model for the microstructure evolution is used to simulate the actual microstructure, and the fast and reliable algorithm is described in this paper. The kinetics parameters, which are the key parameters for the microstructure evolution based on the nucleation and growth mechanism, are extracted from the given micrograph of a polycrystalline material by an inverse method. And the method is verified by the comparison of the quantitative measures, the number of grains and the grain size distribution, for the actual and simulated microstructures. Finite element mesh is then generated on this lattice based microstructure by the developed code. And the statistical finite element analysis is accomplished for selected microstructure.

• Journal of Korean Association for Spatial Structures
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• v.19 no.2
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• pp.63-72
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• 2019

Wireless sensors are more favorable in measuring structural response compared to conventional sensors in terms of them being easier to use with no issues with cables and them being considerably cheaper. Previous tests have been conducted to analyze the performance of MEMS (Micro Electro Mechanical Systems) sensor in sinusoidal excitation tests. This paper analyzes the performance of in-built MEMS sensors in devices by comparing with an ICP sensor as the reference. Earthquake input amplitude excitation in shaking table tests was done. Results show that MEMS sensors are more accurate in measuring higher input amplitude measurements which range from 100gal to 250gal than at lower input amplitudes which range from 10gal to 50gal. This confirms the results obtained in previous sinusoidal tests. It was also seen that natural frequency results have lower error values which range from 0% to 3.92% in comparison to the response spectra results. This also confirms that in-built MEMS sensors in mobile devices are good at estimating natural frequency of structures. In addition, it was also seen that earthquake input amplitudes with more frequency contents (Gyeongju) had considerably higher error values than Pohang excitation tests which has less frequency contents.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.20 no.2
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• pp.166-171
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• 2010

Wired monitoring systems have been used for damage detection and dynamic analysis of large structures(bridges, dams, plants, etc.). However, the real-world applications still remain limited, mainly due to time and cost issues inherent to wired systems. In recent years, an increasing number of researchers have adopted WSN(wireless sensor network) technologies to the field of SHM(structural health monitoring). Accurate time synchronization is most critical for the wireless approach to be feasible for SHM purpose, along with sufficient wireless bandwidth and highly precise measuring resolution. To satisfy technical criteria stated above, a wireless vibration monitoring system that uses high-precision MEMS(micro-electro-mechanical system) sensors and A/D convertor is discussed in detail. It was found experimentally that the level of time synchronization fell within $200\;{\mu}sec$.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.177-181
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• 2000

The tunneling current is exponentially dependent on the separation gap between a pair of conductors. The detection of displacement can be, therefore, carried out by measurment of a variation in the tunneling current. In this experiment, we fabricated pyramid-type silicon tunneling devices in which a tunneling current flow between a micro-tip and $Si_3N_4$ thin film membrane. A MEMS process was used for the fabrication of the tunneling devices. The micro-tips were formed on Si wafers by undercutting a differently oriented square of $SiO_2$ with KOH. The stiffness of the $Si_3N_4$ films were observed and the model for the stiffness calculation, which is useful in predicting the stiffness even when the stiffness ranges beyond the scope of the normal experimental condition, was suggested.

• Journal of the Korea institute for structural maintenance and inspection
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• v.18 no.1
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• pp.160-165
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• 2014

In this study, an efficiency test was performed by fabricating MEMS (Micro Electro Mechanical Systems) based 3-axis acceleration sensor modules and an earthquake monitoring system was composed. Data acquisition device (NI-9239) with a 24bit ADC (Analog to Digital Converter) was used for improving the performance of 3-axis acceleration sensor modules and filtered data (100Hz Low Pass Filter) was used for reducing noises. Also this paper focused on detecting meaningful vibration in the building by developing the earthquake monitoring software. If vector sum of 3-axis acceleration is greater than the preset value, the value will be recorded and saved to the file.

• The Journal of the Korea institute of electronic communication sciences
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• v.12 no.2
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• pp.315-324
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• 2017

The smart grid with distributed power supply introduces a number of problems including not only the problems of the existing power grid but also the problem of protection co-operation due to new electric phenomenon because it has a mixed operation structure combining the existing radial operation structure and the new loop operation structure. The EMTP based power system analysis method has flexibility and convenience from the view of system configuration but it requires another experimental verification because of uncertainty of design and analysis results. On the other hand, the real demonstration system has difficulties in observing accurate fault on large scale system due to considerable economical and spatial construction cost, system configuration constraint, and it is difficult to demonstrate the distributed, autonomous and adaptive control strategy of smart grid. In this paper, a basic theory for a micro smart grid simulator design using MEMS(Micro Electro-Mechanical Systems) miniaturization technology is studied which can safely and freely experiment and observe electrical phenomena, and distribution, autonomous adaptive control strategy for disturbances on 22.9kV smart grid under minimum economic and spatial cost.