• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.4
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• pp.733-737
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• 2007

The object of this paper is to propose a method to solve resulting heat in using numerous modulized watt-class LEDs in MCPCB as lighting device. To use LED for lighting, the chip needs to have a large capacity, resulting in extra heat in P-N connection area. To solve this problem, a Pottier Module, heat-sink panel and a fan was installed to measure variations in the temperature. Additionally, temperature variation characteristics were observed according to the heat conductor panel connecting cooling module and heat-sink panel, insulator and thermal grease. As a result, the type and amount of heat-sink panel was the most important facto. The fan would effect the temperature by max. $18[^{\circ}C]$ while other materials affected the temperature by $2{\sim}3[^{\circ}C]$, showing significant difference.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1722-1723
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• 2011

LED는 광학적 특성을 유지하기 위해서는 방열설계가 매우 중요한 문제로 요구된다. 대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며 고출력 LED의 인가된 에너지는 20%정도가 광으로 출력되며 나머지 80%정도가 열로 전환된다. 이러한 이유 때문에 LED소자의 신뢰성과 효율 향상을 위한 방열성능의 극대화가 필요하다. 본 연구에서는 AI MCPCB 기판에 기반을 둔 COB Type의 고출력 LED모듈의 구조를 제안 하였으며, LED Chip과 금속base 사이의 절연층 유무의 관점에서의 비교 열 시뮬레이션을 통해 결과를 분석하여 고출력 COB LED모듈의 방열 특성을 최적화 하였다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.6
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• pp.1178-1182
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• 2011

The best methods for distribution controled of LED lighting fixtures is control to designed LED chip array, lens and reflector. However, lens design need distribution design to reflector for low-wattage LED lighting because of difficulty of production and reduction of light efficiency. In addition, it needs maximize of thermal performance to improve the efficiency and reliability of device. As a result, for the height of reflector 40[mm] and Inclination 25[$^{\circ}$], we can see the best distribution properties, and, in the thermal properties, junction temperature MCPCB 62.9 [$^{\circ}C$], FR4 PCB 89.6 [$^{\circ}C$], FR4 PCB from Via-hole is 63.1 [$^{\circ}C$]. it may improve for thermal properties for makes the Via-hole.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1609_1610
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• 2009

LED는 광학특성을 유지하기 위해서 최적의 방열설계가 요구된다. 이 논문에서는 입력FR-4의 Top Layer의 면적을 506.25[$mm^2$]이상으로 확대함으로써, 인가 전력 0.5W 조건하에서 FR-4 PCB로 MCPCB와 유사한 방열 특성을 발휘할 수 있음을 열화상카메라를 통한 측정 및 전산모사를 이용하여 확인하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.6
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• pp.1565-1568
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• 2008

This thesis is about the design of heat sink which is the obstacle in commercializing LED light fixture. It suggests a way of solving the problem by the analysis on heat radiation of LED light fixture using CF-design. As a result of the analysis, the difference of simulation value and the measured temperature of proto-type was derived as less than 6[$^{\circ}C$]. Even the results approaching the target value of actual product could be obtained with the given factors well applied.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1661-1662
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• 2006

고출력 LED의 전기적 광학적 열적인 특성을 분석한 결과를 토대로 MCPCB를 사용하지 않고 전구 형태의 좁은 면적에 고출력 1W LED를 배열하고, 적외선 카메라와 ICEPAK(열유동해석 프로그램)을 이용하여 14개의 LED 배열에 대한 LED 전구의 최적방열 및 기구 설계를 실시하였다. LED 전구에 대한 정전압과 정전류 제어방식의 고효율 구동회로를 제작하여, 약 70% 이상의 회로 효율과 약 95% 이상의 고역률, 약 20lm/W 이상의 고효율 LED 전구를 실현하였다. 정전압 구동회로는 동작시간에 무관하게 일정한 광출력을 나타내며, 정전류 구동회로는 초기 시동시 높은 광출력을 나타내고 동작시간의 경과에 따라 광출력 감소율이 높게 나타냄을 알 수 있다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1484-1488
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• 2009

This thesis is about Heat-sink design which is considered as the biggest problems for commercialization of LED lighting and suggests how to solve the problems though analysis on heat-sink using COMSOL. The temperature difference after simulation value and modelling was $10^{\circ}C$by Transient analysis of Heat Transfer Module which is in the COMSOL Multiphysics. The result approximated the object which is close to actual lighting, when various elements are used according to temperature change of interior and exterior surroundings LED lighting is set up.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.2
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.7
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• pp.2317-2322
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• 2010

Market for LED lights as a newly-growing industry has been growing, and secureness of high efficiency and long life through optimal thermal design are crucial for further popularization. In this study, considerable improvement in thermal performance for a 10W LED light has been done compared to a previous model. For this, numerical model has been established through experiments and used to optimize design factors in heat release such as fin shape, PCB kind or LED number etc. Furthermore, prototype of a LED light has been made and the improved thermal performance was verified with heat release experiments.