• Korean Journal of Food Science and Technology
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• v.45 no.2
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• pp.191-198
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• 2013

The storage quality of fresh Sulhyang strawberries packaged under modified atmospheres was investigated to examine the effect of high $O_2$ on the fruit. Fresh strawberries were packed into PP trays and top-sealed with PET/PP film. Initial gas compositions inside the packages were varied with air, 40% $O_2$/60% $N_2$, 60% $O_2$/40% $N_2$, and 80% $O_2$/20% $N_2$. Sealed packages in PE film bags with air and perforated PP trays were also used as another treatment and control, respectively. Quality attributes and viable cell counts of pathogenic bacteria were assessed during storage at $5^{\circ}C$ for 12 days. High $O_2$ concentration showed no significant effects on the physicochemical and microbial qualities of strawberries. Fruit packaged in PE film bags with 6-15% $O_2$ and 7-9% $CO_2$ during storage had the lowest viable cell counts of inherent microorganisms among the treatment samples. Growth of pathogenic bacteria was suppressed in perforated packages where molds occurred frequently. In an overall sensory aspect, the PE film packages exhibited higher scores than the others at the end of storage period. The experimental results suggested that gas-permeable film packaging with an appropriate combination of $O_2$ and $CO_2$ rather than gas-barrier tray packaging with an initially high $O_2$ concentration would be suitable for improving the storability of strawberries.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.89-98
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• 2003

The electrical and mechanical properties of sputtered Cu(Mg) films are investigated for highly reliable interconnects. The roughness, adhesion, hardness and resistance to thermal stress of Cu(Mg) film annealed in vacuum at $400^{\circ}C$ for 30min were improved than those of pure Cu film. Moreover, the flat band voltage(V$_{F}$ ) shift in the Capacitance-Voltage(C-V) curve upon bias temperature stressing(BTS) was not observed and leakage currents of Cu(Mg) into $SiO_2$ were three times less than those of pure Cu. Because Mg was easy to react with oxide than Cu and Si after annealing, the Mg Oxide which formed at surface and interface served as a passivation layer as well.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.37-41
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• 2014

One of the important developments in next generation electronic devices is the technology for power delivery and heat dissipation. In this study, the Cu-to-Cu flip chip bonding process was evaluated using the square ABL power bumps and circular I/O bumps. The difference in bump height after Cu electroplating followed by CMP process was about $0.3{\sim}0.5{\mu}m$ and the bump height after Cu electroplating only was about $1.1{\sim}1.4{\mu}m$. Also, the height of ABL bumps was higher than I/O bumps. The degree of Cu bump planarization and Cu bump height uniformity within a die affected significantly on the misalignment and bonding quality of Cu-to-Cu flip chip bonding process. To utilize Cu-to-Cu flip chip bonding with ABL bumps, both bump planarization and within-die bump height control are required.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.37-43
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• 2006

Surface roughness and hardness of the electroplated Sn were characterized with variations of electroplating current density and current mode. The Sn electroplated at $5{\sim}50mA/cm^{2}$ exhibited the surface roughness of $2.0{\sim}2.4{\mu}m$. The Sn electroplated with pulse current mode exhibited low surface roughness compared one processed with direct current mode. With surface annealing at $300^{\circ}C$ for 3 sec using halogen lamp, surface roughness of the Sn bump was substantially reduced to $1{\mu}m$. The Sn electroplated at $5{\sim}50mA/cm^{2}$ exhibited the hardness of 10 Hv. Low contact resistances of $33{\sim}17m{\Omega}$ were obtained for specimens flip-chip bonded with Sn bumps.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.19-26
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• 2020

Flexible displays have been evolved into curved, foldable, and rollable as the degree of bending increases. Due to the presence of brittle electrodes (e.g. indium-tin oxide (ITO)) that easily cracked and delaminated under severe bending deformation, lowering mechanical stress of the electrodes has been critical issue. Because of this, mechanical stress of brittle electrode in flexible displays has been analyzed mostly in terms of bending radius. On the other hand, in order to make rollable display, various mechanical components such as roller and spring are needed to roll-up or extend the screen for the rollable display apparatus. By these mechanical components, brittle electrode in the rollable display is subjected to the excessive tensile stress due to the retracting force as well as the bending stress by the roller. In this study, mechanical deformation of rollable OLED display was modeled considering boundary conditions of the apparatus. An analytical modeling based on the classical beam theory was introduced in order to investigate the mechanical behavior of the rollable display. In addition, finite element analysis (FEA) was used to analyze the effect of mechanical components in the apparatus on the brittle electrode. Furthermore, a strategy for improving the mechanical reliability of the rollable display was suggested through controlling the stiffness of adhesives in the display panel.

• Journal of the Korean Society of Food Science and Nutrition
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• v.43 no.1
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• pp.135-140
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• 2014

Pre-storage ultra-violet (UV) light treatment on fresh produce is known to inactivate the contaminated microorganisms, activate the defense system, and delay ripening extending the shelf life. As UV light emitting diode (LED) becomes available at a relatively low price, continuous or intermittent UV treatment during chilled storage is possible in a container or package. This study attempted an in situ UV LED treatment on fresh produce stored under a refrigerated container in order to see its potential in the fresh produce storage and further optimize its application conditions. The effect of in-container UV LED irradiation on the quality preservation of shredded carrots was investigated in the air and modified atmosphere (MA) conditions. Two sets of experiment with Escherichia coli inoculation and with natural microbial flora in the air (two 30 minute on-off cycles of 1 $diode/dm^2$ per day at a location above 2 cm) showed a clear and significant effect of the UV LED irradiation on the suppression of microbial growth: 280 nm was the most effective by maintaining a lower microbial count by at least 0.5 log (CFU/g) throughout the 6 day storage period. The carotenoids content of shredded carrots subjected to UV LED treatment at 365 and 405 nm in the air was higher than that of the control shredded carrots. In MA condition of $O_2$ of 1.2~4.3% and $CO_2$ of 8.4~10.6% being indifferent with LED wavelengths, 280 nm UV LED irradiation was also effective in inhibiting the microbial growth. While there was no observed difference in the carotenoids content between untreated and UV LED-treated shredded carrots in MA, UV LED irradiation at 365 and 405 nm was slightly better in DPPH radical scavenging activity. The use of UV LED in storage container or package seems to give the benefits of preserving the microbial and nutritional qualities of minimally processed fruits and vegetables.

• Preventive Nutrition and Food Science
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• v.10 no.1
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• pp.88-91
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• 2005

To improve the physical properties of protein films, various plasticizers and cross-linking agents were used in the preparation of the films. For zein film, 3% polypropylene glycol with 3% glycerol was the best plasticizer, while 2.5% glycerol was the most suitable for soy protein isolate (SPI) film in terms of tensile strength (TS), % elongation, and water vapor permeability (WVP). Formaldehyde, glutaraldehyde, glyoxal, and cinnamaldehyde as cross-linking agents of protein films were used to further improve the physical properties of the films. All aldehydes used as cross-linking agent in this study improved TS of zein and SPI films. In particular, cinnamaldehyde was the best cross-linking agent due to its safety in foods. These results suggest that appropriate use of plasticizer and cross-linking agent like cinnamaldehyde should improve the physical properties of protein films for use in food packaging.

• Korean Journal of Food Science and Technology
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• v.26 no.6
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• pp.713-717
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• 1994

Effects of packing materials on the gas compositions in package of fresh peeled garlic (Allium sativum L.) were investigated. The fresh peeled garlics packed in $20,\;40,\;60\;{\mu}m$ LDPE and $30\;{\mu}m$ HDPE pouches were stored at $20^{\circ}C$, 76% RH. The variables including respiration characteristics, gas compositions, general appearance, and film permeabilities to $O_2$, $CO_2$ and $H_2O$ vapor were measured. A model was evaluated for the prediction of $O_2$ and $CO_2$ equilibrium concentrations inside packages and for the optimization of packaging parameters. Experimental and simulated gas composition results were found to be in good agreement. The $30\;{\mu}m$ HDPE pouch with 4% $O_2$ and 7.5%$CO_2$ equilibrium concentrations conferred the best appearance of peeled garlic, giving 6 days of storage life. As a result, MA seemed to have a beneficial effect on appearance of fresh peeled garlic, possibly due to reduced microbial activity.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.2
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• pp.105-113
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• 2022

Mulching film was produced by LDPE and LLDPE adding biomass byproducts and MA(maleic anhydride), talc/clay/CaO/CaCO₃. And also surveyed to tensile strength, elongation, TGA and DSC according to the UV irradiation time. The tensile strength and elongation showed 20 N/cm² and 5% after UV irradiation 100 hours, and those was nearly 0 N/cm² and 0% after 200 hours, respectively. TGA of film was showed to peak of polymer itself, and DSC was slightly higher than that of initial value. At the pilot scale test, we were able to see the differentiate of degradation between control and developed film after 12 weeks, and also torn off at several part of mulching film. The degradation of mulching film after growing corn showed similar to a pilot scale test. Above the results, the developed mulching film adding biomass will be to used for agricultural farming.

• Korean Journal of Food Science and Technology
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• v.31 no.5
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• pp.1308-1314
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• 1999

The effects of modified atmosphere(MA) packaging and coating on the quality of mushroom (Agaricus bisporus) were investigated. Whole mushrooms(100 g) were packed with polyvinyl chloride(PVC) film wrap, PD941 and PD961 film bags and were stored in a chamber at $12^{\circ}C$ and 80% RH for 6 days. Gas composition of packages, respiration rate, weight loss, color and maturity index of MA packaged mushrooms were examined. The wrap packaged mushrooms showed different level of internal $CO_2$ concentrations among water washed, chitosan coated and $CaCl_2$ coated subgroups significantly at 5% level. The maximum $CO_2$ concentration of PD941 and PD961 packages for all coated showed $4.1{\sim}4.7%$ and $10.4{\sim}11.7%$, respectively, for the first day. PD961 package showed the lowest $O_2$ concentration compared to other groups. There were no significant respiration rate differences between wrap packed and PD941 packaged. Respiration rate of water washed. chitosan coated and $CaCl_2$ coated in PD961 packaged was 192 mg, 226 mg and 245 mg, respectively. Maturity index of PD961 packaged were not significantly different among the water washed, chitosan and $CaCl_2$ coated packages. Chitosan coating showed a negative effect on color change of mushrooms. The weight loss of 961 packaged was lower $(7.0{\sim}8.0%)$ that those of wrap packaged and PD941 packaged.