• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.13-18
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• 2000

Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.

• Journal of the Korean Society of Safety
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• v.33 no.1
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• pp.28-34
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• 2018

The purpose of this study is to fabricate a sensor module to detect the resistive leakage current (Igr) in real time that occurs to low voltage electric lines and to verify its reliability. In the case of the developed sensor module, wires are inserted into the zero current transformer (ZCT) and current transformer (CT) in advance and then the branch line is connected to the circuit breaker. The measurement result of the resistance of the distribution panel equipped with the developed sensor module shows that the resistance is $0.151m{\Omega}$ between the R and R phases, $0.169m{\Omega}$ between the S and S phases, and $0.178m{\Omega}$ between the T and T phases, respectively. The insulation resistance measured at AC 500 V and 1,000 V is $0.08m{\Omega}$ between the R, S, T and N phases, respectively. Then, the insulation resistance measured at DC 500 V is $83.3G{\Omega}$ between the R, S, T and G terminal, respectively. In addition, the applied withstanding voltage is AC 220 V/380 V/440 V and it was found that characteristics between all phases are good. This study measured the standby power by installing the developed sensor module at the rear of the MCCB and switching the circuit breaker on sequentially. The standby power is 1.350 W when one circuit breaker is turned on, 1.690 W when 2 circuit breakers are turned on, and 4.371 W when 10 circuit breakers are turned on. This study also verified the reliability of the standby power of the distribution panel equipped with the developed sensor module using the Minitab Program (Minitab PGM). Since the analysis shows the statistical average of 1.34627 in the reliable range of normal distribution, standard deviation of 0.001874, AD of 0.554, and P value of 0.140, it is found that the distribution panel equipped with the developed sensor module has high reliability.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.295-301
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• 2011

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.471-476
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• 2001

The characteristics of conjugated heat transfer in the inclined channel was experimentally investigated. The simulated module is attached to the bottom of the inclined channel and is heated with constant heat flux. The experimental parameters of this study are input power (Q = 3, 7W), inlet air velocity ($V_{i}=0.1{\sim}0.9m/s$) and inclined channel angle (${\varphi}=0{\sim}90^{\circ}$). The results show that input power was most effective parameter on the temperature differences between module and air. As the inclined channel angle increases, the temperatures of the module are increased. And we obtained the best condition on the conductive board when ${\varphi}=0^{\circ}$.

• Bulletin of the Korean Mathematical Society
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• v.20 no.1
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• pp.45-49
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• 1983

If R is ring and M is a right (or left) R-module, then M is called a faithful R-module if, for some a in R, x.a=0 for all x.mem.M then a=0. In [4], R.E. Johnson defines that M is a prime module if every non-zero submodule of M is faithful. Let us define that M is of prime type provided that M is faithful if and only if every non-zero submodule is faithful. We call a right (left) ideal I of R is of prime type if R/I is of prime type as a R-module. This is equivalent to the condition that if xRy.subeq.I then either x.mem.I ro y.mem.I (see [5:3:1]). It is easy to see that in case R is a commutative ring then a right or left ideal of a prime type is just a prime ideal. We have defined in [5], that a chain of right ideals of prime type in a ring R is a finite strictly increasing sequence I$_{0}$.contnd.I$_{1}$.contnd....contnd.I$_{n}$; the length of the chain is n. By the right dimension of a ring R, which is denoted by dim, R, we mean the supremum of the length of all chains of right ideals of prime type in R. It is an integer .geq.0 or .inf.. The left dimension of R, which is denoted by dim$_{l}$ R is similarly defined. It was shown in [5], that dim$_{r}$R=0 if and only if dim$_{l}$ R=0 if and only if R modulo the prime radical is a strongly regular ring. By "a strongly regular ring", we mean that for every a in R there is x in R such that axa=a=a$^{2}$x. It was also shown that R is a simple ring if and only if every right ideal is of prime type if and only if every left ideal is of prime type. In case, R is a (right or left) primitive ring then dim$_{r}$R=n if and only if dim$_{l}$ R=n if and only if R.iden.D$_{n+1}$ , n+1 by n+1 matrix ring on a division ring D. in this paper, we establish the following results: (1) If R is prime ring and dim$_{r}$R=n then either R is a righe Ore domain such that every non-zero right ideal of a prime type contains a non-zero minimal prime ideal or the classical ring of ritght quotients is isomorphic to m*m matrix ring over a division ring where m.leq.n+1. (b) If R is prime ring and dim$_{r}$R=n then dim$_{l}$ R=n if dim$_{l}$ R=n if dim$_{l}$ R<.inf. (c) Let R be a principal right and left ideal domain. If dim$_{r}$R=1 then R is an unique factorization domain.TEX>R=1 then R is an unique factorization domain.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.05b
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• pp.91-100
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• 2000

An operating principle of PID module was implemented using the load, where the integer in a PID measuring derivate equation were valid in the ranges of 500-9000, 60-1000, and 000-9000, for P, I and D, respectively. A load operation program was designed to investigate the PID theory and its realization process. With it, it was examined the process that the current PV tracts the target SV, By investigating the time when the PV approaches the SV and the rate at which the EV is varied, it is revealed that 1) larger (or Smaller) Kp leads to faster (or slower) approaching of PV to SV, 2) smaller (or larger) Ti results in faster (or slower) approaching of PV to SV, 3) larger (or smaller)$T_d$ causes smaller (or Larger) rate variation in the EV. These observation were found to coincide with those of PID operating characteristics. Though this implementation, it is known for the widespread use of PID module that an improvement should be made in the error of temperature. This, meanwhile, implies that the computational time of conventional manipulation valve must be faster than 0.1 second. It is demanded that an improved PID module including the A/D and D/A module, in itself must be used in conjunction with PLC.

• Proceedings of the KSR Conference
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• 2009.05a
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• pp.2050-2055
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• 2009

This paper describes the proceeding experimental results to replace the 32 [W] fluorescent lamp installed in subway train to a LED module. We fabricated 25 [W] LED modules to meet the illuminance 300 [lx] specified in the standard for subway train. After the installation of LED modules, comparative analysis with conventional fluorescent lamps was carried out. From the experimental results, illuminances on the height of 0.85 [m] and 1 [m] above floor were 323 [lx] and 360 [lx], respectively. These illuminances satisfied the requirement 300 [lx]. By the application of 25 [W] LED module as a light source in subway train, energy saving about 22 [%] compared with 32 [W] fluorescent is acquired. Also, low cost of maintenance is expected due to 8 times longer lifetime 50,000 hours of LED than that 6,000 hours of fluorescent lamp.

• Journal of Sensor Science and Technology
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• v.27 no.2
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• pp.112-117
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• 2018

In this study, a bender-type piezoelectric energy harvester was fabricated and evaluated to compensate for the disadvantages of high-power generation only in the resonance frequency range of a piezoelectric harvester using a piezoelectric cantilever. The generated power was investigated according to various changes in the vibration environment. Compared with the piezoelectric cantilever module, the bender-type piezoelectric module showed a larger number of peak voltages. The primary peak voltage shifted toward the low frequency when the spring was coupled to the bender-type piezoelectric module. The harvester of the three bender-type modules had a vibration frequency exceeding 1 mW in the 34-45 Hz range and generated 3.112 mW of power at the vibration frequency of 38 Hz. The harvester of the six bender-type modules had a vibration frequency exceeding 1 mW in the 31-45 Hz range and generated 3.081 mW of power at the vibration frequency of 35 Hz.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.318-318
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• 2009

The door stiffness is one of the important factors side impact. Generally, the researches have been conducted on the assembled door module. This study is to analysis the side impact characteristics for automotives door module. The impact characteristics have been determined by door module side impact test machine. To determine the initial, intermediate and peak crush resistances use the plot of load versus displacement and obtain the integral of the applied load with respect to the crush distances specified below for each door tested. The initial crush resistance is the average force required to deform the door through the initial 6 inches of crush. The intermediate crush resistance is the average force required to deform the door through the initial 12 inches of crush. The peak crush resistance will be directly obtained from the plot of load versus displacement since it is the largest force required to deform the door through the entire 18 inches crush distance. The data are used to determine if a specific vehicle or item of automotives equipment meets the minimum performance requirements of the subject Federal Motor Vehicle Safety Standard(FMVSS). FMVSS Static 214, Side impact protection, specifies performance requirements for protection of occupants in side impact crashes.

• ETRI Journal
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• v.28 no.1
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• pp.9-16
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• 2006

In this paper, we analyzed and measured the electrical crosstalk characteristics of a 1.25 Gbps triplexer module for Ethernet passive optical networks to realize fiber-tothe-home services. Electrical crosstalk characteristic of the 1.25 Gbps optical triplexer module on a resistive silicon substrate should be more serious than on a dielectric substrate. Consequently, using the finite element method, we analyze the electrical crosstalk phenomena and propose a silicon substrate structure with a dummy ground line that is the simplest low-crosstalk layout configuration in the 1.25 Gbps optical triplexer module. The triplexer module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and an analog photodetector as a cable television signal receiver. According to IEEE 802.3ah and ITU-T G.983.3, the digital receiver and analog receiver sensitivities have to meet -24 dBm at $BER=10^{-12}$ and -7.7 dBm at 44 dB SNR. The electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the dummy line with $100\;{\mu}m$ space from the signal lines and 4 mm separations among the devices satisfies the electrical crosstalk level compared to a simple structure. This proposed structure can be easily implemented with design convenience and greatly reduce the silicon substrate size by about 50 %.