• Honam Mathematical Journal
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• v.34 no.2
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• pp.161-169
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• 2012

Let R be a commutative Noetherian ring and I, J be ideals of R. We introduced the notion of (I; J)-cominimax R-modules. For an integer $n$ and an R-module M, let $H^i_{I,J}(M)$ be an (I; J)-cominimax R-module for all $i<n$. The J-minimaxness of some Ext modules of $H^n_{I,J}(M)$ is investigated. Among of the obtaining results, there is a generalization of the main result of [1].

• Honam Mathematical Journal
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• v.20 no.1
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• pp.1-14
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• 1998

In this short note we study the torsion theories over a commutative ring R and discuss a relative dimension related to such theories for R-modules. Let ${\sigma}$ be a torsion functor and (T, F) be its corresponding partition of Spec(R). The concept of ${\sigma}$-Cohen Macaulay (abbr. ${\sigma}$-CM) module is defined and some of the main points concerning the usual Cohen-Macaulay modules are extended. In particular it is shown that if M is a non-zero ${\sigma}$-CM module over R and S is a multiplicatively closed subset of R such that, for all minimal element of T, $S{\cap}p={\emptyset}$, then $S^{-1}M$ is a $S^{-1}{\sigma}$-CM module over $S^{-1}$R, where $S^{-1}{\sigma}$ is the direct image of ${\sigma}$ under the natural ring homomorphism $R{\longrightarrow}S^{-1}R$.

• Bulletin of the Korean Mathematical Society
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• v.41 no.3
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• pp.419-426
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• 2004

Let R be a commutative Noetherian ring and let M be an Artinian R-module. Let M${\subseteq}$M′ be submodules of M. Suppose F is an R-module which is projective relative to M. Then it is shown that $Att_{R}$($Hom_{A}$ (F,M′) :$Hom_{A}$(F,M) $In^n$), n ${\in}$N and $Att_{R}$($Hom_{A}$(F,M′) :$Hom_{A}$(F,M) In$^n$ $Hom_{A}$(F,M") :$Hom_{A}$(F,M) $In^n$),n ${\in}$ N are ultimately constant.

• Proceedings of the IEEK Conference
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• 2002.07b
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• pp.1304-1307
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• 2002

In this paper, we describe the structure and the test results of a Bluetooth baseband module we have developed. The module has a distributed buffer, i.e. FIFO, for data stream. Bus interface of the module is designed on the basis of interface of microprocessor widely used and the external interface is designed to consider chips connected directly. Since the module performs as many hardware efficient tasks as possible, processing load of microprocessor is very small. It can also be controlled either by software or by hardware for flexibility. The fully synthesizable baseband module was fabricated in a $0.25\mu\textrm{m}$ CMOS technology occupying $2.79\times2.8{\textrm{mm}^2}$ area. And an FPGA implementation of this module is tested for file and bit-stream transfers between PCs.

• Membrane Journal
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• v.25 no.2
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• pp.180-190
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• 2015

PVDF (polyvinylidene fluoride) nanofiber has the advantages such as excellent strength, chemical resistance, nontoxic, non-combustibility. Flat membranes with 0.3 and $0.4{\mu}m$ pore size respectively, were manufactured by PVDF nanofiber, and then each spiral wound module was prepared with them. A woven paper was not included in preparing the module with $0.3{\mu}m$ pore size; however, it was included the module with $0.4{\mu}m$ pore size. The permeate fluxes and rejection rates of the two modules were compared using pure water and simulation solution including kaolin and humic acid. The recovery rate and filtration resistance were calculated after water back-washing. In addition, the effect of flow rate and trans-membrane pressure on treatment efficiency and filtration resistance were investigated for the spiral wound module with $0.4{\mu}m$ pore size.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• Structural Engineering and Mechanics
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• v.69 no.4
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• pp.407-416
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• 2019

This paper develops a wireless sensor for online fatigue crack detection and failure warning based on crack-induced nonlinear ultrasonic modulation. The wireless sensor consists of packaged piezoelectric (PZT) module, an excitation/sensing module, a data acquisition/processing module, a wireless communication module, and a power supply module. The packaged PZT and the excitation/sensing module generate ultrasonic waves on a structure and capture the response. Based on nonlinear ultrasonic modulation created by a crack, the data acquisition/processing module periodically performs fatigue crack diagnosis and provides failure warning if a component failure is imminent. The outcomes are transmitted to a base through the wireless communication module where two-levels duty cycling media access control (MAC) is implemented. The uniqueness of the paper lies in that 1) the proposed wireless sensor is developed specifically for online fatigue crack detection and failure warning, 2) failure warning as well as crack diagnosis are provided based on crack-induced nonlinear ultrasonic modulation, 3) event-driven operation of the sensor, considering rare extreme events such as earthquakes, is made possible with a power minimization strategy, and 4) the applicability of the wireless sensor to steel welded members is examined through field and laboratory tests. A fatigue crack on a steel welded specimen was successfully detected when the overall width of the crack was around $30{\mu}m$, and a failure warnings were provided when about 97.6% of the remaining useful fatigue lives were reached. Four wireless sensors were deployed on Yeongjong Grand Bridge in Souht Korea. The wireless sensor consumed 282.95 J for 3 weeks, and the processed results on the sensor were transmitted up to 20 m with over 90% success rate.

• Resources Recycling
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• v.13 no.1
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• pp.59-67
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• 2004

A universal plasma-chemical module (PChM) for the industrial processing of different hydrocarbon raw material pyrolysis was designed and tested. Laboratory investigations for the plasma-chemical method of acetylene production from natural gas and different coals were made. Similar laboratory tests on the industrial production of acetylene as a raw material for organic syn-thesis were developed using the PChM. A comparison of the suggested plasma-chemical method with the traditional process of acetylene production were carried out. The outlook of the plasma-chemical method was shown.

• Kyungpook Mathematical Journal
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• v.56 no.3
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• pp.737-743
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• 2016

Let a and b be two ideals of a commutative Noetherian ring R, M a finitely generated R-module and i an integer. In this paper we study formal local cohomology modules with respect to a pair of ideals. We denote the i-th a-formal local cohomology module M with respect to b by ${\mathfrak{F}}^i_{a,b}(M)$. We show that if ${\mathfrak{F}}^i_{a,b}(M)$ is artinian, then $a{\subseteq}{\sqrt{(0:{\mathfrak{F}}^i_{a,b}(M))$. Also, we show that ${\mathfrak{F}}^{\text{dim }M}_{a,b}(M)$ is artinian and we determine the set $Att_R\;{\mathfrak{F}}^{\text{dim }M}_{a,b}(M)$.

• Honam Mathematical Journal
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• v.38 no.2
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• pp.259-267
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• 2016

A module M over an associative ring R with unity is a QTAG-module if every finitely generated submodule of any homomorphic image of M is a direct sum of uniserial modules. Recently, the authors introduced the classes of QTAG-modules namely as socle-regular and strongly socle-regular QTAG-modules which properly contain the classes of transitive and fully transitive QTAG-modules respectively. Here we define strongly and quasi transitivities and study the inter relations between various type of transitivities.