• Journal of Sensor Science and Technology
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• v.7 no.3
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• pp.211-217
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• 1998

Si and ITO-coated #7059 glass wafers were electrostatically bonded by employing #7740 interlayer. It was inferred that the thermionic- electrostatic migration of $Na^{+}$ ions in the #7740 interlayer played an important role in the bonding process through SIMS analysis. The temperature and voltage required for reliable electrostatic bonding were in the range of $180{\sim}200^{\circ}C$ and $50{\sim}70V_{dc}$(10min), respectively. The low temperature Si-ITO coated glass bonding can be effectively applied to the packaging of field emission devices.

• Journal of Welding and Joining
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• v.12 no.2
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• pp.39-48
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• 1994

In comparison to the conventional brazing, laser welding of ceramics has advantages of direct bonding without filler material, which causes the thermal stress due to the differences of thermal expansion coefficients. In pulse-mode, laser welding of dispersion ceramic having high thermal resistance is possible at relatively low preheating temperature of $1300^{\circ}C$ In CW-mode, alumina can be welded at high preheating temperature $1500^{\circ}C$ under the condition of low feed rate of 500 mm/min, respectively. Further studies on developing mechanism of pores in the bead during laser welding of ceramics is required.

• Journal of the Korean institute of surface engineering
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• v.31 no.1
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• pp.12-23
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• 1998

The Thermal Barrier Coating(TBC) has been used to improve the heat barrier and tribological properties of the aircraft engine and the automobile engine in high temperature. Especially, the high temperature tribological propertied of the cylinder haed and the piston crown of diesel engine was emphasized. Therefore, the purpose of this work was to evaluate the microstructure, tribological propeer in high tempearmal shock resistance and bonding strength of five layer functionally gradient TBC for the applications. The five layerwere composed with 100% ceramic insulating later, 75(ceramic):25 (metal) layer, 50:50 layer, 25:75 layer and 100% metal bonding layer to redude the thermal stress. the YSL and MSL poweders were the insulation ceramics powers. The NiCrAly, Inconel625 and SUS powders were the bonding and mixingg powders for plasma spray process. According to the result of high temperature wear test, the wera resistance of YSZ/NiCrAlY siytem was most out standing at 600 and $800^{\circ}C$. At $400^{\circ}C$, the wear resistance of YSZ/Inconel system was better than others. Wear volume at other temperature because of the low temperature degration of zirconia. The thermal shock mechanism of 5 later is the vertical crack gegration in insulating layer. this means that the initial cracks were generated in the top layer, and then developed into the composite layers during thermal shock test. Finally, these cracks werereached to the interface of coating and substrate and also, these vertioal cracks join with the horizontal cracks of the each layers. The bonding strength of YSZ/NiCrAlY and YSZ/Inconel 5 layer system is better than other 5layer systems. The theramal shock resistance of thermal barrier coating s with 5 layer system is better than that of 3 layers and 2 layers.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1594-1597
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• 2008

Carbon nanotube (CNT) cathodes were fabricated using nano-sized silver powders as a bonding material. The effects of powder size on the field emission properties for the CNT cathode were investigated The better emission properties of CNT cathodes using smaller particles are due to a low sintering temperature of the bonding materials.

• Journal of the Korean Ceramic Society
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• v.18 no.3
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• pp.192-200
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• 1981

This study deals with the low temperature ($25^{\circ}C$-$600^{\circ}C$) properties of Kaolin-Phosphate-water systems. Phosphoric acid, mono aluminum phosphate, mono ammonium phosphate, the mixture of phosphoric acid and mono aluminum phosphate, and the mixture of phosphoric acid and mono ammonium phosphate were used to characterize the M.O.R. of the systems with to quantity of phosphates, curing time, and firing temperature. Firing shrinkage, viscosity, surface tension, DTA, TGA, and X-ray diffraction patterns were also measured in order to investigated the factors of strengthening. The results of this study were summarized as follows: 1. The M.O.R. of kaolin-phosphate systems were stronger than that of Kaolin-water system at room temperature or low temperature($25^{\circ}C$-$600^{\circ}C$). Though it was increased according to the longer curing time, the higher temperature, and the more addition of phosphate, the M.O.R. were decreased in the case of 10 wt% phosphate addition in the system of phosphoric acid, mono aluminum phosphate and phosphoric acid-mono aluminum phosphate. 2. When the concentration of Phosphate was at 4 wt%, the M.O.R. of specimen cured at $25^{\circ}C$ and added to the phosphoric acid was strongest among the specimens in added to the others phosphates. Whereas, when the concentration of phosphate was above 6wt%, the M.O.R. of specimen cured at $25^{\circ}C$ and added to the phosphoric acid mono ammonium phosphate system cured at $25^{\circ}C$ was the strongest. 3. The M.O.R. of the specimen heated, in the temperature range of 15$0^{\circ}C$-1$600^{\circ}C$, and added to the mixture of phosphoric acid-mono aluminum phosphate system or phosphoric acid-mono ammonium phosphate system was stronger than that of specimen added to Phosphoric acid, mono-aluminum Phosphate or mono-ammonium phosphate alone. 4. The bonding force of phosphate binders was more closely related to surface tension than viscosity and it tended to be inversely proportional to surface tension. The bonding force after heating treatment seemed to be caused by the change of structure of phosphate according to heating.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.76-83
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• 2013

This study investigated the effect of bonding temperature and holding time on microstructures and mechanical properties of diffusion bonded joint of Haynes230. The diffusion bonds were performed at the temperature of 950, 1050, and $1150^{\circ}C$ for holding times of 30, 60, 120 and 240 minutes at a pressure of 4MPa under high vacuum condition. The amount of non-bonded area and void observed in the bonded interface decreased with increasing bonding temperature and holding time. Cr-rich precipitates at the linear interface region restrained grain migration at $950^{\circ}C$ and $1050^{\circ}C$. However, the grain migration was observed in spite of short holding time due to the dissolution of precipitates to base metal in the interface region at $1150^{\circ}C$. Three types of the fracture surface were observed after tensile test. The region where the coalesce and migration of grain occurred much showed high fracture load because of base metal fracture whereas the region where those did less due to the precipitates demonstrated low fracture load because of interface fracture. The expected fracture load could be derived with the value of fracture area of base metal ($A_{BF}$) and interface ($A_{IF}$), $Load=201A_{BF}+153A_{IF}$. Based on this equation, strength of base metal and interface fracture were calculated as 201MPa and 153MPa, respectively.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.45 no.3
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• pp.188-193
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• 2009

The present study was undertaken to evaluate the effect of temperature on the results of Charpy impact test for glass fiber reinforced polyurethane(GF/PUR) composites. The Charpy impact test were conducted in the temperature range from -50$^{\circ}$ to 50$^{\circ}$. The impact fracture toughness of GF/PUR composites was considerably affected by temperature and it was shown that the maximum value was appeared at room temperature. It is believed that sensitivity of notch on impact fracture energy were increased with decrease in temperature of specimen. As the GF/PUR composites exposed in low temperature, impact fracture toughness of composites decreased gradually owing to the decrease of interface bonding strength caused by difference of thermal expansion coefficient between the glass fiber/polyurethane resin. And decrease of interface bonding strength of composites with decrease in specimen temperature was ascertained by SEM photographs of Charpy impact fracture surface.

• Journal of Power System Engineering
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• v.9 no.4
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• pp.137-142
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• 2005

The effects of temperature and initial crack length on impact fracture behavior of side plate material of 35 ton class FRP ship, which are composed by glass fiber and unsaturated polyester resin, were investigated. Impact fracture toughness of GF/PE composites displayed maximum value when the temperature of specimen is room temperature and $50^{\circ}C$, and with decrease in temperature of specimen, impact fracture toughness decreased. Impact fracture energy of GF/EP composites decreased with increase in initial crack length of specimen, and this value decreased rapidly when the temperature of specimen is lowest, $-25^{\circ}C$,. It is believed that sensitivity of notch on impact fracture energy were increased with decrease in temperature of specimen. As the GF/EP composites exposed in low temperature, impact fracture toughness of composites decreased gradually owing to the decrease of interface bonding strength caused by difference of thermal expansion coefficient between the glass fiber/polyester resin. Further, decrease of interface bonding strength of composites with decrease in specimen temperature was ascertained by SEM photograph of impact fracture surface.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.