• Journal of the Korean Ceramic Society
• /
• v.31 no.4
• /
• pp.381-388
• /
• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1999.05a
• /
• pp.673-676
• /
• 1999

We fabricated green sheet by tape casting method with fluormica glass-ceramic powders for fabrication of low temperature co-firing substrate. After ball milling with organic additives, we investigated green strength and density of green sheets which were casted by doctor blade machine. Green sheets were sintered at 700 ~ 1,00$0^{\circ}C$ for 1 ~3hrs. Microstructure, linear shrinkage and dielectric constant of substrates were surveyed.

• Korean Journal of Materials Research
• /
• v.14 no.10
• /
• pp.731-736
• /
• 2004

Herein, we report on the co-firing of a low-K wiring substrate and a middle-K functional substrate in LTCC. Firstly, we researched the sintering behavior and dielectric properties of the low-k wiring substrate comprised by alumina and glass frit with ${\varepsilon}_r$, of $\sim7$ and the middle-k functional substrate comprised by $Ba_{5}Nb_{4}O_{15}$ and glass frit with ${\varepsilon}_r$, of $20\sim30$. The warpage and delamination between the hetero layers of the low-K and the middle-K composition were also studied. In particular, physical matching of the hetero layers could be possible by adjusting of the sintering properties of the composition. We observed that an introduction of the glass frit to the low- and middle-K substrate gives rise to a minimization of an effect given by separation of the hetero layers, and modification of the fraction of the glass frit accompanied by a variation of the composition could control the sintering behavior and its beginning temperature. In the case of co-firing of the L03 as the low-K wiring substrate composition and the M03 as the middle-K functional substrate composition at $875^{\circ}C$, we could fabricate a desirable structure of hetero layers without any kinds of structural defects such as separation, warpage, delamination, pore trap, etc. We suppose that the co-firing techniques described in this study would provide a helpful method to fabricate a LTCC multi-functional for the next generation.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.31 no.5
• /
• pp.218-227
• /
• 2021

A thick film NTC thermistor for low temperature co-firing was manufactured by printing and sintering a paste prepared using NTC powder of Mn_1.5Ni_0.4Co_0.9Cu_0.4O₄ composition, lead free frit, and RuO₂ on a 96 % alumina substrate. The effect of frit and RuO₂ on the electrical properties of thick film NTC thermistor was studied. The resistance of the thick film NTC thermistor was higher than that of the bulk phase sintered at the same temperature, but it was found that the negative resistance temperature characteristic appeared more clearly and linearly in the resistance - temperature characteristic. On the other hand, the area resistance decreased as the sintering temperature increased, and the area resistance increased as the amount of frit added increased. The B constant of the thick film NTC thermistor was 3000 K or higher. Among them, it was found that the B constant of the thick film NTC thermistor made of paste with 5 wt% of frit added and sintered at 900℃ showed the highest B constant. Also, it can be seen that the area resistance decreased with the addition of RuO₂, and the change in the area resistance decrease of the thick film NTC thermistor obtained by sintering the paste containing 5 wt% of RuO₂ at 900℃ is the most obvious.

• Journal of the Korean Ceramic Society
• /
• v.43 no.12 s.295
• /
• pp.788-797
• /
• 2006

An anode-supported SOFC single cell having $5{\mu}m$ thin electrolyte was fabricated cost-effectively by tape casting, laminating, and co-filing of anode (NiO-YSZ), cathode (LSM-YSZ), and electrolyte (YSZ) components. The optimal slurry compositions of the green tapes for SOFC components were determined by an analysis of the mean diameter, the slurry viscosity, the tensile strength/strain of the green tapes, and their green microstructures. The single cells with a dense electrolyte and porous electrodes could be co-fired successfully at $1325\sim1350^{\circ}C$ by controlling the contents of pore former and the ratio of coarse YSZ and fine YSZ in the anode and the cathode. The single cell co-fired at $1350^{\circ}C$ showed $100.2mWcm^{-2}$ of maximum power density at $800^{\circ}C$ but it was impossible to apply it to operate at low temperature because of low performance and high ASR, which were attributed to formation of the secondary phases in the cathode and the interface between the electrolyte and the cathode.

• Proceedings of the Korean Ceranic Society Conference
• /
• 2003.04a
• /
• pp.193.2-193
• /
• 2003

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.11a
• /
• pp.53-53
• /
• 1998

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.10
• /
• pp.869-872
• /
• 2007

In this study, in order to develop low temperature sintering ultrasonic nozzle, single-layer and multilayer ring-type piezoelectric actuators were manufactured using PMN-PNN-PZT ceramics, And then the electrical properties were investigated. A ring-type piezoelectric actuator was modeled by ATILA program using finite element method(FEM). The piezoelectric actuator dimension was $\Phi26.5$ (outer diameter), $\Phi12$ (inner diameter), 3.5 mm (thickness). By FEM analysis, resonant and anti-resonant frequencies were appeared as 56.7 kHz and 61.5 kHz. The displacement increased with the increases of the number of layer. Based on the result, ring-type multilayer piezoelectric actuators were manufactured at low co-firing temperature of $940^{\circ}C$. The resonant resistance decreased with the increases of the number of layer. And also, the capacitance increased with the increases of the number of layer. The mechanical quality factor (Qm) decreased with the increases of the number of layer.

• Transactions on Electrical and Electronic Materials
• /
• v.12 no.6
• /
• pp.249-252
• /
• 2011

We investigated the low firing of $Li_2CO_3$ added $0.2Pb(Mg_{1/3}Nb_{2/3})O_3$ - 0.3Pb($Fe_{1/2}Nb_{1/2}$) - $0.5Pb(Zr_{0.475}Ti_{0.525})O_3$ (PMN-PFN-PZT) ceramics and multilayer actuators (MLAs) using Ag inner electrodes. It was found that 0.1 wt% $Li_2CO_3$ was quite effective in lowering the sintering temperature of PMN-PFN-PZT ceramics from $1,100^{\circ}C$ down to $900^{\circ}C$ without deteriorating their piezoelectric ceramics ($d_{33}$ = 425 pC/N and $k_p$ = 61.9%). However, excess $Li_2CO_3$ up to 0.3 wt% brings about unwanted problems such as the formation of a $LiPbO_2$ secondary phase and subsequent degradation in the piezoelectric properties. Using 0.1 wt% $Li_2CO_3$ added PMN-PFN-PZT ceramics, MLAs with Ag inner electrodes were successfully fabricated, resulting in a normalized strain of 580 pm/V at an electric field of 1.5 kV/mm.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.3 s.32
• /
• pp.77-82
• /
• 2004

In this paper, warpages of heterogeneous LTCC substrates comprised of high K/low K hi-layered structure were investigated. The effect of glass content in high K LTCC layer on the warpage of substrate during co-firing process was examined. Shrinkage and dielectric properties of high K and low K green sheets were measured. In-situ camber observation by hot stage microscopy showed different camber development of heterogeneous LTCC substrates according to glass content in high K green sheet. High K green sheet containing $50\%$ glass was matched to low K green sheet in the shrinkage. Therefore, LTCC substrate of Low K/High K+$50\%$ glass structure showed flat surface after sintering.